Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/24/2013WO2013072760A3 Semiconductor wafer handling and transport
10/24/2013WO2013057949A3 Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
10/24/2013WO2013057456A3 Method for producing an organised network of semiconductor nanowires made from zno
10/24/2013WO2013033340A8 Thermal array system
10/24/2013WO2013033332A9 System and method for controlling a thermal array
10/24/2013WO2010071609A3 System and processing of a substrate
10/24/2013US20130281583 Method for Improving Polyimide Non-Adherence to Substrate and Polyimide Solution
10/24/2013US20130281571 Epoxy-based composition, ashesive film, dicing die-bonding film and semiconductor device
10/24/2013US20130280925 Oxidation annealing device and method for fabricating thin film transistor using oxidation annealing
10/24/2013US20130280924 Systems and methods for non-periodic pulse sequential lateral solidification
10/24/2013US20130280923 Apparatus and method to reduce particles in advance anneal process
10/24/2013US20130280922 Methods for fabricating and orienting semiconductor wafers
10/24/2013US20130280921 Method of manufacturing a semiconductor device, method of processing a substrate, substrate processing apparatus, and recording medium
10/24/2013US20130280920 Templated Monolayer Polymerization and Replication
10/24/2013US20130280919 Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatus
10/24/2013US20130280918 Methods and apparatus for forming silicon passivation layers on germanium or iii-v semiconductor devices
10/24/2013US20130280917 Method and Apparatus for Wafer Electroless Plating
10/24/2013US20130280916 Etching agent, etching method and liquid for preparing etching agent
10/24/2013US20130280915 Plasma processing method
10/24/2013US20130280914 Composite showerhead electrode assembly for a plasma processing apparatus
10/24/2013US20130280913 Composition for forming a resist underlayer film including hydroxyl group-containing carbazole novolac resin
10/24/2013US20130280912 Silicon compound, silicon-containing compound, composition for forming resist underlayer film containing the same and patterning process
10/24/2013US20130280911 Method of manufacturing semiconductor device and semiconductor manufacturing apparatus
10/24/2013US20130280910 Contact release capsule useful for chemical mechanical planarization slurry
10/24/2013US20130280909 Metal cut process flow
10/24/2013US20130280908 Metal assisted chemical etching to produce iii-v semiconductor nanostructures
10/24/2013US20130280907 Silicidation and/or germanidation on sige or ge by cosputtering ni and ge and using an intralayer for thermal stability
10/24/2013US20130280906 Semiconductor device including a deep contact and a method of manufacturing such a device
10/24/2013US20130280905 Software and method for via spacing in a semiconductor device
10/24/2013US20130280904 Method for chip packaging
10/24/2013US20130280902 Stratified gate dielectric stack for gate dielectric leakage reduction
10/24/2013US20130280901 Interface-free metal gate stack
10/24/2013US20130280900 Manufacturing method for semiconductor device having metal gate
10/24/2013US20130280898 Method for forming a dopant profile
10/24/2013US20130280897 Semiconductor device and method for manufacturing the same
10/24/2013US20130280896 Apparatus for producing polycrystalline silicon and method therefor
10/24/2013US20130280895 Laser crystallization apparatus and method for manufacturing thin film transistor array panel using the same
10/24/2013US20130280894 Method for production of selective growth masks using underfill dispensing and sintering
10/24/2013US20130280893 Method for production of selective growth masks using imprint lithography
10/24/2013US20130280892 Methods of depositing a semiconductor material on a substrate
10/24/2013US20130280891 Method and apparatus for germanium tin alloy formation by thermal cvd
10/24/2013US20130280890 Laser and plasma etch wafer dicing using uv-curable adhesive film
10/24/2013US20130280889 Semiconductor device and method capable of scribing chips with high yield
10/24/2013US20130280888 Methods of Forming Semiconductor Devices
10/24/2013US20130280887 Method For Releasing a Thin-Film Substrate
10/24/2013US20130280886 Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
10/24/2013US20130280885 Laser-initiated exfoliation of group iii-nitride films and applications for layer transfer and patterning
10/24/2013US20130280884 Methods for the Formation of a Trap Rich Layer
10/24/2013US20130280883 Methods of forming bulk finfet devices so as to reduce punch through leakage currents
10/24/2013US20130280879 Method for Producing a Conductor Line
10/24/2013US20130280878 Semiconductor process
10/24/2013US20130280874 Method of fabricating semiconductor device
10/24/2013US20130280873 Enhanced device reliability of a semiconductor device by providing superior process conditions in high-k film growth
10/24/2013US20130280872 Semiconductor device including work function adjusting element, and method of manufacturing the same
10/24/2013US20130280871 Semiconductor device and method of fabricating the same
10/24/2013US20130280866 Lead frame ball grid array with traces under die
10/24/2013US20130280863 Vertically stackable dies having chip identifier structures
10/24/2013US20130280861 Methods for forming semiconductor device packages
10/24/2013US20130280860 Method for synthesizing a material, in particular diamonds, by chemical vapor deposition, as well as device for applying the method
10/24/2013US20130280842 Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same
10/24/2013US20130280840 Vapor deposition device, vapor deposition method, and method of manufacturing organic electroluminescent display device
10/24/2013US20130280839 Method for forming vapor deposition film, and method for producing display device
10/24/2013US20130280838 Method for fabricating array substrate and fabrication apparatus used therefor
10/24/2013US20130280837 Method for fabricating group-iii nitride semiconductor laser device
10/24/2013US20130280836 Method and system for producing high resolution patterns in registration on the surface of a substrate
10/24/2013US20130280831 Permanently bonded fluid channel nozzle plate fabrication
10/24/2013US20130280830 Carbon nanotube field emission device with overhanging gate
10/24/2013US20130280829 Graphene deposition and graphenated substrates
10/24/2013US20130280828 Minimum-spacing circuit design and layout for pica
10/24/2013US20130280827 Method of controlling polishing using in-situ optical monitoring and fourier transform
10/24/2013US20130280826 Adaptive patterning for panelized packaging
10/24/2013US20130280825 Peeling system, peeling method, and computer storage medium
10/24/2013US20130280824 Apparatus and method for measuring radiation energy during thermal processing
10/24/2013US20130280823 Apparatus for Monitoring Ion Implantation
10/24/2013US20130280425 Liquid treatment apparatus and method and non-transitory storage medium
10/24/2013US20130280017 Substrate processing system, substrate transfer method and storage medium
10/24/2013US20130279261 Nonvolatile semiconductor memory device including plural memory cells and a dummy cell coupled to an end of a memory cell
10/24/2013US20130278326 Pressure Contact Arrangement and Method for Producing a Pressure Contact Arrangement
10/24/2013US20130277859 Fabrication of semiconductor device including chemical mechanical polishing
10/24/2013US20130277857 Stack type semiconductor device and method of fabricating and testing the same
10/24/2013US20130277856 Method for stabilizing embedded silicon
10/24/2013US20130277855 High density 3d package
10/24/2013US20130277854 3d integrated circuit system with connecting via structure and method for forming the same
10/24/2013US20130277853 Semiconductor Devices, Methods of Manufacture Thereof, and Methods of Forming Conductive Features
10/24/2013US20130277852 Method for Creating a 3D Stacked Multichip Module
10/24/2013US20130277851 Semiconductor Method and Device of Forming a Fan-Out Device with PWB Vertical Interconnect Units
10/24/2013US20130277848 Method of forming contact and semiconductor device manufactured by using the method
10/24/2013US20130277847 Chip package and method for assembling chip package
10/24/2013US20130277846 Circuit arrangement for a thermally conductive chip assembly and a manufacturing method
10/24/2013US20130277845 Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
10/24/2013US20130277842 Copper interconnect with cvd liner and metallic cap
10/24/2013US20130277841 Rigid Interconnect Structures in Package-on-Package Assemblies
10/24/2013US20130277840 Thermally Enhanced Structure for Multi-Chip Device
10/24/2013US20130277839 Chip package and method for assembling same
10/24/2013US20130277838 Methods and Apparatus for Solder Connections
10/24/2013US20130277837 Controlled solder-on-die integrations on packages and methods of assembling same
10/24/2013US20130277832 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
10/24/2013US20130277830 Bump-on-Trace Interconnect
10/24/2013US20130277829 Method of Fabricating Three Dimensional Integrated Circuit
10/24/2013US20130277828 Methods and Apparatus for bump-on-trace Chip Packaging
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