Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/29/2013US8569086 Semiconductor device and method of dicing semiconductor devices
10/29/2013US8569085 Photoelectrochemical etching for chip shaping of light emitting diodes
10/29/2013US8569084 Method for fabricating light emitting device including photonic crystal structures
10/29/2013US8569083 Light-emitting device with narrow dominant wavelength distribution and method of making the same
10/29/2013US8569082 Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
10/29/2013US8569081 Method of making light emitting diode
10/29/2013US8569080 Method for packaging light emitting diode
10/29/2013US8569079 Method for producing an optoelectronic semiconductor component
10/29/2013US8569042 DNA structures on ferroelectrics and semiconductors
10/29/2013US8568877 Porous and non-porous nanostructures
10/29/2013US8568619 Glass frit for forming electrode, and electrically conductive paste for forming electrode and solar cell, utilizing same
10/29/2013US8568610 Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate
10/29/2013US8568604 CMOS gate structures fabricated by selective oxidation
10/29/2013US8568601 Fenceless main pole definition for advanced perpendicular magnetic write head
10/29/2013US8568598 Tip type probe manufacturing method, tip type probe and tip type probe manufacturing apparatus
10/29/2013US8568556 Plasma processing apparatus and method for using plasma processing apparatus
10/29/2013US8568555 Method and apparatus for reducing substrate temperature variability
10/29/2013US8568554 Movable gas introduction structure and substrate processing apparatus having same
10/29/2013US8568553 Method and apparatus for photomask plasma etching
10/29/2013US8568537 Epitaxial wafer and method of producing the same
10/29/2013US8568534 Method for washing device substrate
10/29/2013US8568199 Polishing endpoint detection apparatus
10/29/2013US8567960 Quantum photonic imagers and methods of fabrication thereof
10/29/2013US8567912 Inkjet printing device with composite substrate
10/29/2013US8567911 Silicon interposer for MEMS scalable printing modules
10/29/2013US8567658 Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
10/29/2013US8567110 Process for glass sealing of dye-sensitized solar cells
10/24/2013WO2013159062A1 Temperature calibration and control for semiconductor reactors
10/24/2013WO2013158796A1 Integrated thin film solar cell interconnection
10/24/2013WO2013158692A1 Semiconductor devices having fin structures, and methods of forming semiconductor devices having fin structures
10/24/2013WO2013158690A1 Free layer with high thermal stability for magnetic device applications by insertion of a boron dusting layer
10/24/2013WO2013158593A1 Critical dimension uniformity monitoring for extreme ultra-violet reticles
10/24/2013WO2013158574A1 Method and system for critical dimension uniformity using charged particle beam lithography
10/24/2013WO2013158573A1 Method and system for forming patterns using charged particle beam lithograph
10/24/2013WO2013158561A1 Apparatus and method for synchronizing sample stage motion with a time delay integration charge-couple device in a semiconductor inspection tool
10/24/2013WO2013158543A1 Methods for making micro- and nano-scale conductive grids for transparent electrodes and polarizers by roll to roll optical lithography
10/24/2013WO2013158527A1 Silicon hardmask layer for directed self-assembly
10/24/2013WO2013158526A1 System for delivery of purified multiple phases of carbon dioxide to a process tool
10/24/2013WO2013158492A1 Susceptor assemblies for supporting wafers in a reactor apparatus
10/24/2013WO2013158480A1 Venturi assisted gripper
10/24/2013WO2013158421A1 Bipolar junction transistors with reduced base-collector junction capacitance
10/24/2013WO2013158385A1 Device with graded barrier layer
10/24/2013WO2013158372A1 Method and apparatus for germanium tin alloy formation by thermal cvd
10/24/2013WO2013158335A1 Apparatus and method to reduce particles in advance anneal process
10/24/2013WO2013158242A2 Permanent solid state memory using carbon-based or metallic fuses
10/24/2013WO2013158210A2 Heterogeneous material integration through guided lateral growth
10/24/2013WO2013158038A1 Hemispherical microstructure arrays for gan-based light emitting diodes and method for forming the arrays
10/24/2013WO2013158021A1 A nanocapillary device for biomolecule detection, a fluidic network structure and a method of manufacturing thereof
10/24/2013WO2013157900A1 Base material for forming conductive pattern and conductive pattern formed using same
10/24/2013WO2013157881A1 Semiconductor device and method for manufacturing same
10/24/2013WO2013157875A1 Method for manufacturing highly efficient light-emitting diode
10/24/2013WO2013157715A1 Method for producing an oxide film using a low temperature process, an oxide film and an electronic device thereof
10/24/2013WO2013157619A1 Semiconductor device and method for manufacturing the same
10/24/2013WO2013157567A1 Adhesive composition, adhesive sheet and method for manufacturing semiconductor device
10/24/2013WO2013157554A1 Composition for silicon wafer polishing liquid
10/24/2013WO2013157547A1 Semiconductor device
10/24/2013WO2013157465A1 Polishing composition to be used to polish semiconductor substrate having silicon through electrode structure, and polishing method using polishing composition
10/24/2013WO2013157462A1 Accommodating container, shutter opening and closing unit for accommodating container, and wafer stocker using same
10/24/2013WO2013157459A1 Photosensitive resin composition, process for producing cured film, cured film, organic el display device, and liquid-crystal display device
10/24/2013WO2013157442A1 Polishing composition
10/24/2013WO2013157421A1 Organic semiconductor layer, electronic device, and method for producing electronic device
10/24/2013WO2013157378A1 Circuit connection material, and manufacturing method for assembly using same
10/24/2013WO2013157366A1 Liquid treatment device, liquid treatment method, and filter device
10/24/2013WO2013157359A1 Method for etching organic film, and plasma etching device
10/24/2013WO2013157356A1 Mask unit and substrate processing device
10/24/2013WO2013157335A1 Method for manufacturing semiconductor device
10/24/2013WO2013157300A1 Device-mounting structure in semiconductor device
10/24/2013WO2013157259A1 Silicon carbide semiconductor device and method for manufacturing same
10/24/2013WO2013157235A1 Deposit removal method and gas treatment device
10/24/2013WO2013157226A1 Solder supply device
10/24/2013WO2013157225A1 Method for manufacturing silicon carbide semiconductor device
10/24/2013WO2013157206A1 Semiconductor integrated circuit
10/24/2013WO2013157197A1 Electronic component mounting method and electronic component mounting line
10/24/2013WO2013157183A1 Method for production of semiconductor device, and semiconductor device
10/24/2013WO2013157179A1 Semiconductor device manufacturing method, heat resistant sheet, method for protecting substrate front surface when forming substrate rear film, and semiconductor substrate holding method
10/24/2013WO2013157075A1 Solder bump and forming method therefor, and substrate having solder bump and manufacturing method for substrate having solder bump
10/24/2013WO2013157047A1 Transistor using nitride semiconductor and method for manufacturing same
10/24/2013WO2013157014A1 Group iii-nitride semiconducting material and a method of manufacturing the same
10/24/2013WO2013156918A1 Substrate carrier having drip edge configurations
10/24/2013WO2013156891A1 Method and apparatus for creating a w-mesa street
10/24/2013WO2013156568A2 Circuit arrangement for thermally conductive chip assembly and production method
10/24/2013WO2013156274A1 Formulations comprising ammoniacal hydroxo-zinc compounds
10/24/2013WO2013156234A1 Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
10/24/2013WO2013155930A1 Enhanced device and manufacturing method therefor
10/24/2013WO2013155929A1 Enhanced switch device and manufacturing method therefor
10/24/2013WO2013155913A1 Substrate support pin and substrate support device adopting substrate support pin
10/24/2013WO2013155840A1 Array substrate and manufacturing method thereof, and display device
10/24/2013WO2013155835A1 Thin film transistor, array substrate and manufacturing method of array substrate, and display panel
10/24/2013WO2013155818A1 Method for manufacturing semiconductor structure
10/24/2013WO2013155775A1 Method for realizing isolation among active regions of germanium-based mos device
10/24/2013WO2013155760A1 Semiconductor structure and manufacturing method thereof
10/24/2013WO2013155749A1 Method and device for testing a substrate
10/24/2013WO2013155746A1 Liquid crystal panel, liquid crystal display device and manufacturing method for array substrate thereof
10/24/2013WO2013155740A1 Semiconductor structure and manufacturing method therefor
10/24/2013WO2013155724A1 Wiring structure and pixel structure of display panel
10/24/2013WO2013155650A1 Method for improving uniformity of chemical mechanical planarization process
10/24/2013WO2013116323A3 Method of making photovoltaic devices incorporating improved pnictide semiconductor films
10/24/2013WO2013112766A3 Method and device for estimating damage to a magnetic tunnel junction (mtj) element
10/24/2013WO2013095692A3 Electrical fuse and method of making the same
10/24/2013WO2013081694A3 Wafer structure for electronic integrated circuit manufacturing