Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/17/2013US20130270558 Semiconductor test and monitoring structure to detect boundaries of safe effective modulus
10/17/2013US20130270557 Test structure for semiconductor process and method for monitoring semiconductor process
10/17/2013US20130270546 Active device and fabricating method thereof
10/17/2013US20130270513 Electropositive metal containing layers for semiconductor applications
10/17/2013US20130270512 Cmos implementation of germanium and iii-v nanowires and nanoribbons in gate-all-around architecture
10/17/2013US20130270511 Graphene pressure sensors
10/17/2013US20130270501 Rram device with an embedded selector structure and methods of making same
10/17/2013US20130270328 Process for direct bonding two elements comprising copper portions and portions of dielectric materials
10/17/2013US20130270252 Methods and apparatus for controlling temperature of a multi-zone heater in a process chamber
10/17/2013US20130270237 Method for manufacturing and scribing a thin-film solar cell
10/17/2013US20130270227 Layer-layer etch of non volatile materials
10/17/2013US20130270152 Front opening wafer container with robotic flange
10/17/2013US20130269877 Semiconductor processing apparatus
10/17/2013US20130269876 Apparatus for fabricating semiconductor device
10/17/2013US20130269737 Liquid processing apparatus
10/17/2013US20130269614 Vapour chamber and substrate processing equipment using same
10/17/2013US20130269613 Methods and apparatus for generating and delivering a process gas for processing a substrate
10/17/2013US20130269609 Carousel reactor for multi-station, sequential processing systems
10/17/2013US20130269465 Robot and robot installation method
10/17/2013US20130269368 Thermal plate with planar thermal zones for semiconductor processing
10/17/2013DE112010000869B4 Plasmaverarbeitungsvorrichtung und Verfahren zum Bilden monokristallinen Siliziums The plasma processing apparatus and method for forming monocrystalline silicon
10/17/2013DE112007001725B4 SOI-Bauelement und Verfahren zu dessen Herstellung SOI device and process for its preparation
10/17/2013DE112004000219B4 Fluidausstoßvorrichtung The fluid ejection device
10/17/2013DE10230252B4 Verfahren zur Herstellung integrierter Mikrosysteme A method for manufacturing integrated microsystems
10/17/2013DE102013103301A1 Electronic package-on-package device for manufacturing semiconductor assembly utilized for manufacturing electronic components, has seal layers arranged between substrates, and solder connection for providing coupling between substrates
10/17/2013DE102013103207A1 Halbleiterbauelement-Kanalsystem und Verfahren Semiconductor component-channel system and method
10/17/2013DE102013103057A1 Einrichtung für FinFETs Means for FinFETs
10/17/2013DE102013102289A1 Ladungskompensations-Halbleitervorrichtung Charge compensation semiconductor device
10/17/2013DE102012224355A1 Leistungsmodul Power module
10/17/2013DE102012206531A1 Verfahren zur Erzeugung einer Kavität innerhalb eines Halbleitersubstrats A method for generating a cavity within a semiconductor substrate
10/17/2013DE102012206289A1 Halbleiterbauelement-Verbundstruktur mit Wärmeableitstruktur und dazugehöriges Herstellungsverfahren Semiconductor component composite structure with heat dissipating structure and associated manufacturing processes
10/17/2013DE102012205943A1 Calibration arrangement for calibrating network analog for calibrated measurement of e.g. microwave circuit, has shield portion for shielding linking dot on opposite side of calibration standard and in extended plane of standard
10/17/2013DE102012110982A1 Integrierte thermische Lösungen zur Verpackung integrierter Schaltkreise Integrated thermal solutions for packaging integrated circuits
10/17/2013DE102012109922A1 Method for formation of semiconductor package of semiconductor device, involves bonding metal ball to contact pad to form first bonding structure, and bonding die package to surface of substrate through connectors
10/17/2013DE102012109339A1 CIGS Solarzellenstruktur und Verfahren zu deren Herstellung CIGS solar cell structure and methods for their preparation
10/17/2013DE102012103254A1 Method for transferring substrate e.g. glass pane into vacuum treatment plant, involves transporting substrate composite into transfer chamber and reducing spacing within substrate composite in transport direction of substrates
10/17/2013DE102012103204A1 Coating a substrate, comprises arranging substrate parallel with respect to first main surface, traversing substrate by film-forming raw material, forming sequence of layers, guiding raw material flowing via inlet opening and dissipating
10/17/2013DE102012013136A1 Method for improving reproducibility of high levels of current gain of e.g. NPN transistor, in semiconductor switching circuit, involves producing exposing and corroding during polysilicon separating and photolithographic processes of gate
10/17/2013DE102010040839B4 Verfahren zum Herstellen eines elektronsichen Bauelements und elektronisches Bauelement A process for producing an electrophotographic Sichen component and electronic component
10/17/2013DE102010026987B4 Herstellvorrichtung und -verfahren für Halbleiterbauelement Fabrication and method for semiconductor device
10/17/2013DE102009028485B4 Verfahren zur Herstellung einer Halbleiterstruktur mit vertikalen Dielektrikumsschichten und Halbleiterbauelement A process for producing a semiconductor structure with vertical dielectric layers and semiconductor component
10/17/2013DE102008063402B4 Verringerung der Schwellwertspannungsfluktuation in Transistoren mit einer Kanalhalbleiterlegierung durch Verringern der Abscheideungleichmäßigkeiten Reducing the Schwellwertspannungsfluktuation in transistors with a channel semiconductor alloy by reducing the Abscheideungleichmäßigkeiten
10/17/2013DE102008030725B4 Verfahren zur Herstellung einer Kontakt-Struktur mittels einer Galvanikmaske A method of manufacturing a contact structure by means of an electroplating mask
10/17/2013DE102007047437B4 Substratbearbeitungsverfahren, Substratbearbeitungseinrichtung und Speichermedium Substrate processing method, substrate processing apparatus and storage medium
10/17/2013DE102006052754B4 Transistor, Inverter und Verfahren zur Herstellung eines Transistors Transistor, and inverter process for the preparation of a transistor
10/17/2013DE102006029235B4 Halbleiterbauelement mit piezoelektrischer Schicht zur Stress-Erzeugung sowie entsprechendes Herstellungsverfahren und Betriebsverfahren Semiconductor device with piezoelectric layer for stress generation and manufacturing method thereof and method of operation
10/17/2013CA2774511A1 Cyclometalated transition metal dyes
10/16/2013EP2650930A1 Solar cell stack
10/16/2013EP2650913A1 Dry cleaning method
10/16/2013EP2650912A1 Auxiliary sheet for laser dicing
10/16/2013EP2650911A1 Contact point on a heterogeneous semiconductor substrate
10/16/2013EP2650910A2 Logic transistor and non-volatile memory cell integration
10/16/2013EP2650909A1 Method for manufacturing semiconductor device
10/16/2013EP2650908A1 Semiconductor laminate, semiconductor device, method for producing semiconductor laminate, and method for manufacturing semiconductor device
10/16/2013EP2650907A2 Methods and devices for fabricating and assembling printable semiconductor elements
10/16/2013EP2650906A2 Methods and devices for fabricating and assembling printable semiconductor elements
10/16/2013EP2650905A2 Methods and devices for fabricating and assembling printable semiconductor elements
10/16/2013EP2650904A2 Method for manufacturing a roll for roll printing/roll imprinting
10/16/2013EP2650903A1 Filament lamp for heating
10/16/2013EP2650407A1 Perovskite manganese oxide thin film
10/16/2013EP2650271A1 Zinc oxide sintered compact, sputtering target, and zinc oxide thin film
10/16/2013EP2650124A1 Fine-structure laminate, method for preparing fine-structure laminate, and production method for fine-structure laminate
10/16/2013EP2650082A1 Ceramic composite for photoconversion, and method for manufacture thereof
10/16/2013EP2650076A1 Method and device for inserting separating cracks into a substrate using a blade with a modifyable opening
10/16/2013EP2650074A1 Bonded body, power semiconductor device and method for manufacturing bonded body and power semiconductor device
10/16/2013EP2649668A1 A voltage-tunable phase shifter and associated methods
10/16/2013EP2649644A1 Interconnect structure
10/16/2013EP2649643A2 Compliant interconnects in wafers
10/16/2013EP2649642A1 Adhesive compound and method for encapsulating an electronic arrangement
10/16/2013EP2649641A1 Process for annealing semiconductor wafers with flat dopant depth profiles
10/16/2013EP2649640A1 High density three-dimensional integrated capacitors
10/16/2013EP2649639A1 High density three-dimensional integrated capacitors
10/16/2013EP2649218A1 Apparatus and method for depositing a layer onto a substrate
10/16/2013EP2649144A1 Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
10/16/2013EP2648906A1 Method and system for template assisted wafer bonding
10/16/2013CN203242631U Full-self-alignment insulated gate bipolar transistor (IGBT) device
10/16/2013CN203242625U Embedded nonvolatile memory body
10/16/2013CN203242609U ESD protection device
10/16/2013CN203242608U Silicon wafer grabbing manipulator
10/16/2013CN203242607U Guide wheel, substrate conveying device and substrate processing equipment
10/16/2013CN203242606U Wafer ring-disengaging auxiliary tool
10/16/2013CN203242605U Bearing vessel assembly for roller-type dry-process photoresist-removing work
10/16/2013CN203242604U Drug solution leak detection and receiving device
10/16/2013CN203242603U Apparatus for drying substrate
10/16/2013CN203242602U Sintering mold for diode with square lead
10/16/2013CN103354953A A schottky barrier diode, a method of forming the diode and a design structure for the diode
10/16/2013CN103354951A Interconnect structure
10/16/2013CN103354949A Pin attachment
10/16/2013CN103354948A Method for producing silicon dioxide film
10/16/2013CN103354947A Dual plasma source, lamp heated plasma chamber
10/16/2013CN103354244A Oxide semiconductor film transistor and manufacturing method thereof
10/16/2013CN103354243A Thin film transistor, manufacturing method thereof and related device
10/16/2013CN103354242A Extremely thick epitaxial wafer for high-voltage power device, and method for manufacturing same
10/16/2013CN103354241A Laminate structure including oxide semiconductor thin film layer, and thin film transistor
10/16/2013CN103354236A Silicon-controlled transient voltage inhibitor with embedded Zener diode structure
10/16/2013CN103354225A Stack packaging device
10/16/2013CN103354224A Semiconductor device fan-out flip-chip packaging structure
10/16/2013CN103354218A Array substrate, manufacturing method thereof, and display device
10/16/2013CN103354217A Optimizing method for electrolytic deposition process of through holes in wafer
10/16/2013CN103354216A Atmosphere manipulator terminal holder transferring solar cell pieces in batch