Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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10/23/2013 | CN103367427A Compound semiconductor device and method for manufacturing compound semiconductor device |
10/23/2013 | CN103367426A Compound semiconductor device and manufacture method thereof |
10/23/2013 | CN103367425A Compound semiconductor device and manufacture method thereof |
10/23/2013 | CN103367424A Compound semiconductor device and manufacture method thereof |
10/23/2013 | CN103367423A Semiconductor device and method for manufacturing semiconductor device |
10/23/2013 | CN103367422A Compound semiconductor device and manufacture method thereof |
10/23/2013 | CN103367421A Semiconductor device, nitride semiconductor crystal, method for manufacturing semiconductor device, and method for manufacturing nitride semiconductor crystal |
10/23/2013 | CN103367420A Compound semiconductor device and manufacture method thereof |
10/23/2013 | CN103367419A Compound semiconductor device and method of manufacturing the same |
10/23/2013 | CN103367418A High electron mobility transistor and method of forming the same |
10/23/2013 | CN103367416A Ion-implanted one-dimensional electron gas GaN-based HEMT (high electron mobility transistor) device and preparation method |
10/23/2013 | CN103367414A Structure of vertically pinched-off junction field-effect transistor and manufacturing method thereof |
10/23/2013 | CN103367413A Insulated gate bipolar transistor and manufacturing method thereof |
10/23/2013 | CN103367409A Preparation method for germanium substrate and La-based high-dielectric constant gate dielectric material |
10/23/2013 | CN103367408A Gate dielectric material based on silicon substrate high dielectric constant and preparation method for gate dielectric material |
10/23/2013 | CN103367407A Electrical-free dummy gate |
10/23/2013 | CN103367406A Integrated circuit (IC) including first memory cell transistor of read only memory (ROM) array and manufacturing method thereof |
10/23/2013 | CN103367405A Semiconductor device and method for manufacturing the same |
10/23/2013 | CN103367403A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
10/23/2013 | CN103367399A Transistor and method for forming same |
10/23/2013 | CN103367398A Terminal guard ring and manufacturing method thereof |
10/23/2013 | CN103367396A Super junction Schottky semiconductor device and preparation method thereof |
10/23/2013 | CN103367395A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
10/23/2013 | CN103367394A Semiconductor device and manufacturing method |
10/23/2013 | CN103367393A Transient voltage suppressing device and manufacturing technology method |
10/23/2013 | CN103367392A Semiconductor on insulator structure and manufacturing method thereof |
10/23/2013 | CN103367391A Pixel defining layer, manufacturing method thereof, display substrate and display device |
10/23/2013 | CN103367389A 显示面板及其制造方法 Display panel and manufacturing method thereof |
10/23/2013 | CN103367385A Semiconductor light emitting device, light emitting module and illumination apparatus |
10/23/2013 | CN103367368A Multiple-time programming memory cells and methods for forming the same |
10/23/2013 | CN103367364A Cmos及其制造方法 Cmos its manufacturing method |
10/23/2013 | CN103367363A Semiconductor device and manufacturing method thereof |
10/23/2013 | CN103367362A One-way conductive pressure device and manufacturing method thereof |
10/23/2013 | CN103367352A Passive device cell and fabrication process thereof |
10/23/2013 | CN103367350A Electronic module |
10/23/2013 | CN103367348A Method and apparatus providing integrated circuit system with interconnected stacked device wafers |
10/23/2013 | CN103367339A Chip-packaging method and chip-packaging structure |
10/23/2013 | CN103367338A Chip arrangement, a method for forming a chip arrangement, a chip package and a method for forming a chip package |
10/23/2013 | CN103367337A Semiconductor device and manufacturing method for same |
10/23/2013 | CN103367334A Semiconductor package with through silicon via interconnect and method for fabricating the same |
10/23/2013 | CN103367330A Testing structure of power semiconductor device and manufacture method of testing structure |
10/23/2013 | CN103367323A Detection layout structure and detection method |
10/23/2013 | CN103367321A Chip arrangement and a method for forming a chip arrangement |
10/23/2013 | CN103367319A Through silicon via structure and method for fabricating the same |
10/23/2013 | CN103367317A Semiconductor device, method for fabricating the same and system comprising the same |
10/23/2013 | CN103367316A Reduction of OCD measurement noise by way of metal via slots |
10/23/2013 | CN103367313A Electronic device and method for manufacturing the same |
10/23/2013 | CN103367311A Interconnect structure and formation method thereof. |
10/23/2013 | CN103367310A Interconnect structure and method for forming the same |
10/23/2013 | CN103367309A Silicon-penetrating through hole with control electrode and manufacturing method thereof |
10/23/2013 | CN103367307A Through-silicon via and forming method thereof |
10/23/2013 | CN103367306A Output/input interface of chip packaging structure and configuration method thereof |
10/23/2013 | CN103367304A Package substrate, flip-chip type package and manufacturing method thereof |
10/23/2013 | CN103367300A Lead frame, semiconductor device, and method for manufacturing lead frame |
10/23/2013 | CN103367299A Device and method for power interconnection of semiconductor module |
10/23/2013 | CN103367298A Semiconductor packaging structure and packaging method thereof |
10/23/2013 | CN103367296A Electronic substrate and method for manufacturing integrated circuit with electronic substrate |
10/23/2013 | CN103367295A Semiconductor device and manufacturing method for same |
10/23/2013 | CN103367294A Rotated semiconductor device fan-out wafer level packages and methods of manufacturing the same |
10/23/2013 | CN103367292A Electrode body, wiring substrate, and semiconductor device |
10/23/2013 | CN103367291A Package on package structures and methods for forming the same |
10/23/2013 | CN103367290A Bonding pad structure with dense via array |
10/23/2013 | CN103367288A An electronic device and a method of manufacturing the same |
10/23/2013 | CN103367287A Packaging substrate, semiconductor package and fabrication method thereof |
10/23/2013 | CN103367286A Semiconductor device and assembly method thereof |
10/23/2013 | CN103367285A Through via structure and manufacturing method thereof |
10/23/2013 | CN103367283A Semiconductor device and method of fabricating the same |
10/23/2013 | CN103367282A Semiconductor chip and packaging structure and formation method of packaging structure |
10/23/2013 | CN103367281A Semiconductor structure with through silicon via and test circuit and method for manufacturing semiconductor structure |
10/23/2013 | CN103367280A Through silicon via structure and manufacture method thereof |
10/23/2013 | CN103367274A Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package |
10/23/2013 | CN103367271A Semiconductor packages and methods of formation thereof |
10/23/2013 | CN103367270A Aluminum silicon carbide composite material with laser welding layer and preparing method of aluminum silicon carbide composite material |
10/23/2013 | CN103367269A Separation mixed substrate for radio frequency application |
10/23/2013 | CN103367268A PCB based RF-power package window frame |
10/23/2013 | CN103367267A Solder-mounted board, production method therefor, and semiconductor device |
10/23/2013 | CN103367265A Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device |
10/23/2013 | CN103367263A Improved injection molding packaging structure and packaging method of high-power semiconductor modules |
10/23/2013 | CN103367262A Forming method of flash memory storage unit |
10/23/2013 | CN103367261A Forming method of semiconductor structure |
10/23/2013 | CN103367260A Logic transistor and non-volatile memory cell integration |
10/23/2013 | CN103367259A Process for semiconductor circuit |
10/23/2013 | CN103367258A Semiconductor circuit structure and process of making the same |
10/23/2013 | CN103367257A A memory manufacturing method |
10/23/2013 | CN103367256A Method for increasing height of source electrode of flash memory unit of discrete grid electrode by utilizing epitaxial layer |
10/23/2013 | CN103367255A Manufacture method of multiple-time programmable silicon-oxide-nitride-oxide-silicon |
10/23/2013 | CN103367254A Metal gate semiconductor device and method of fabricating same |
10/23/2013 | CN103367253A Fin type field effect transistor forming method |
10/23/2013 | CN103367252A Manufacturing method for two-layer silicon epitaxial wafer used for bipolar transistor |
10/23/2013 | CN103367251A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof |
10/23/2013 | CN103367250A Segmenting method of device wafer |
10/23/2013 | CN103367249A Method for manufacturing organic light-emitting display panel and organic light-emitting display panel |
10/23/2013 | CN103367248A Array substrate, preparation method of array substrate and display device |
10/23/2013 | CN103367247A Method for carrying out selective area deposition of silver nano particles on surface of PDMS (Polydimethylsiloxane) elastic body |
10/23/2013 | CN103367246A Improved system for electrical testing of through-silicon vias (tsvs), and corresponding manufacturing process |
10/23/2013 | CN103367245A Methods of forming semiconductor device |
10/23/2013 | CN103367244A Back-side MOM/MIM devices |
10/23/2013 | CN103367243A Shallow via formation by oxidation |
10/23/2013 | CN103367242A Combined trimmer and manufacturing method and chemical mechanical polishing method thereof |
10/23/2013 | CN103367241A Through silicon via exposing method |