Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/23/2013CN103367427A Compound semiconductor device and method for manufacturing compound semiconductor device
10/23/2013CN103367426A Compound semiconductor device and manufacture method thereof
10/23/2013CN103367425A Compound semiconductor device and manufacture method thereof
10/23/2013CN103367424A Compound semiconductor device and manufacture method thereof
10/23/2013CN103367423A Semiconductor device and method for manufacturing semiconductor device
10/23/2013CN103367422A Compound semiconductor device and manufacture method thereof
10/23/2013CN103367421A Semiconductor device, nitride semiconductor crystal, method for manufacturing semiconductor device, and method for manufacturing nitride semiconductor crystal
10/23/2013CN103367420A Compound semiconductor device and manufacture method thereof
10/23/2013CN103367419A Compound semiconductor device and method of manufacturing the same
10/23/2013CN103367418A High electron mobility transistor and method of forming the same
10/23/2013CN103367416A Ion-implanted one-dimensional electron gas GaN-based HEMT (high electron mobility transistor) device and preparation method
10/23/2013CN103367414A Structure of vertically pinched-off junction field-effect transistor and manufacturing method thereof
10/23/2013CN103367413A Insulated gate bipolar transistor and manufacturing method thereof
10/23/2013CN103367409A Preparation method for germanium substrate and La-based high-dielectric constant gate dielectric material
10/23/2013CN103367408A Gate dielectric material based on silicon substrate high dielectric constant and preparation method for gate dielectric material
10/23/2013CN103367407A Electrical-free dummy gate
10/23/2013CN103367406A Integrated circuit (IC) including first memory cell transistor of read only memory (ROM) array and manufacturing method thereof
10/23/2013CN103367405A Semiconductor device and method for manufacturing the same
10/23/2013CN103367403A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/23/2013CN103367399A Transistor and method for forming same
10/23/2013CN103367398A Terminal guard ring and manufacturing method thereof
10/23/2013CN103367396A Super junction Schottky semiconductor device and preparation method thereof
10/23/2013CN103367395A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/23/2013CN103367394A Semiconductor device and manufacturing method
10/23/2013CN103367393A Transient voltage suppressing device and manufacturing technology method
10/23/2013CN103367392A Semiconductor on insulator structure and manufacturing method thereof
10/23/2013CN103367391A Pixel defining layer, manufacturing method thereof, display substrate and display device
10/23/2013CN103367389A 显示面板及其制造方法 Display panel and manufacturing method thereof
10/23/2013CN103367385A Semiconductor light emitting device, light emitting module and illumination apparatus
10/23/2013CN103367368A Multiple-time programming memory cells and methods for forming the same
10/23/2013CN103367364A Cmos及其制造方法 Cmos its manufacturing method
10/23/2013CN103367363A Semiconductor device and manufacturing method thereof
10/23/2013CN103367362A One-way conductive pressure device and manufacturing method thereof
10/23/2013CN103367352A Passive device cell and fabrication process thereof
10/23/2013CN103367350A Electronic module
10/23/2013CN103367348A Method and apparatus providing integrated circuit system with interconnected stacked device wafers
10/23/2013CN103367339A Chip-packaging method and chip-packaging structure
10/23/2013CN103367338A Chip arrangement, a method for forming a chip arrangement, a chip package and a method for forming a chip package
10/23/2013CN103367337A Semiconductor device and manufacturing method for same
10/23/2013CN103367334A Semiconductor package with through silicon via interconnect and method for fabricating the same
10/23/2013CN103367330A Testing structure of power semiconductor device and manufacture method of testing structure
10/23/2013CN103367323A Detection layout structure and detection method
10/23/2013CN103367321A Chip arrangement and a method for forming a chip arrangement
10/23/2013CN103367319A Through silicon via structure and method for fabricating the same
10/23/2013CN103367317A Semiconductor device, method for fabricating the same and system comprising the same
10/23/2013CN103367316A Reduction of OCD measurement noise by way of metal via slots
10/23/2013CN103367313A Electronic device and method for manufacturing the same
10/23/2013CN103367311A Interconnect structure and formation method thereof.
10/23/2013CN103367310A Interconnect structure and method for forming the same
10/23/2013CN103367309A Silicon-penetrating through hole with control electrode and manufacturing method thereof
10/23/2013CN103367307A Through-silicon via and forming method thereof
10/23/2013CN103367306A Output/input interface of chip packaging structure and configuration method thereof
10/23/2013CN103367304A Package substrate, flip-chip type package and manufacturing method thereof
10/23/2013CN103367300A Lead frame, semiconductor device, and method for manufacturing lead frame
10/23/2013CN103367299A Device and method for power interconnection of semiconductor module
10/23/2013CN103367298A Semiconductor packaging structure and packaging method thereof
10/23/2013CN103367296A Electronic substrate and method for manufacturing integrated circuit with electronic substrate
10/23/2013CN103367295A Semiconductor device and manufacturing method for same
10/23/2013CN103367294A Rotated semiconductor device fan-out wafer level packages and methods of manufacturing the same
10/23/2013CN103367292A Electrode body, wiring substrate, and semiconductor device
10/23/2013CN103367291A Package on package structures and methods for forming the same
10/23/2013CN103367290A Bonding pad structure with dense via array
10/23/2013CN103367288A An electronic device and a method of manufacturing the same
10/23/2013CN103367287A Packaging substrate, semiconductor package and fabrication method thereof
10/23/2013CN103367286A Semiconductor device and assembly method thereof
10/23/2013CN103367285A Through via structure and manufacturing method thereof
10/23/2013CN103367283A Semiconductor device and method of fabricating the same
10/23/2013CN103367282A Semiconductor chip and packaging structure and formation method of packaging structure
10/23/2013CN103367281A Semiconductor structure with through silicon via and test circuit and method for manufacturing semiconductor structure
10/23/2013CN103367280A Through silicon via structure and manufacture method thereof
10/23/2013CN103367274A Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package
10/23/2013CN103367271A Semiconductor packages and methods of formation thereof
10/23/2013CN103367270A Aluminum silicon carbide composite material with laser welding layer and preparing method of aluminum silicon carbide composite material
10/23/2013CN103367269A Separation mixed substrate for radio frequency application
10/23/2013CN103367268A PCB based RF-power package window frame
10/23/2013CN103367267A Solder-mounted board, production method therefor, and semiconductor device
10/23/2013CN103367265A Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
10/23/2013CN103367263A Improved injection molding packaging structure and packaging method of high-power semiconductor modules
10/23/2013CN103367262A Forming method of flash memory storage unit
10/23/2013CN103367261A Forming method of semiconductor structure
10/23/2013CN103367260A Logic transistor and non-volatile memory cell integration
10/23/2013CN103367259A Process for semiconductor circuit
10/23/2013CN103367258A Semiconductor circuit structure and process of making the same
10/23/2013CN103367257A A memory manufacturing method
10/23/2013CN103367256A Method for increasing height of source electrode of flash memory unit of discrete grid electrode by utilizing epitaxial layer
10/23/2013CN103367255A Manufacture method of multiple-time programmable silicon-oxide-nitride-oxide-silicon
10/23/2013CN103367254A Metal gate semiconductor device and method of fabricating same
10/23/2013CN103367253A Fin type field effect transistor forming method
10/23/2013CN103367252A Manufacturing method for two-layer silicon epitaxial wafer used for bipolar transistor
10/23/2013CN103367251A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
10/23/2013CN103367250A Segmenting method of device wafer
10/23/2013CN103367249A Method for manufacturing organic light-emitting display panel and organic light-emitting display panel
10/23/2013CN103367248A Array substrate, preparation method of array substrate and display device
10/23/2013CN103367247A Method for carrying out selective area deposition of silver nano particles on surface of PDMS (Polydimethylsiloxane) elastic body
10/23/2013CN103367246A Improved system for electrical testing of through-silicon vias (tsvs), and corresponding manufacturing process
10/23/2013CN103367245A Methods of forming semiconductor device
10/23/2013CN103367244A Back-side MOM/MIM devices
10/23/2013CN103367243A Shallow via formation by oxidation
10/23/2013CN103367242A Combined trimmer and manufacturing method and chemical mechanical polishing method thereof
10/23/2013CN103367241A Through silicon via exposing method