Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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10/23/2013 | CN103367240A Copper-pollution prevention method in back-thinning process of through silicon via |
10/23/2013 | CN103367239A Exposing method for through silicon via |
10/23/2013 | CN103367238A Low-K dielectric layer and formation method thereof |
10/23/2013 | CN103367237A Semiconductor structure formation method |
10/23/2013 | CN103367236A Method for exposing through silicon via |
10/23/2013 | CN103367235A Contact hole forming method |
10/23/2013 | CN103367234A Semiconductor structure forming method |
10/23/2013 | CN103367233A Damascus structure manufacturing method |
10/23/2013 | CN103367232A Method for forming semiconductor structure |
10/23/2013 | CN103367231A Integrated circuit structure having air-gap trench isolation and related design structure |
10/23/2013 | CN103367230A Manufacturing method for structure of extremely thin silicon on insulator and manufacturing method for semiconductor device |
10/23/2013 | CN103367229A Water supplementing device and method of acid corrosion technology for removing silicon nitride |
10/23/2013 | CN103367228A Groove isolating method |
10/23/2013 | CN103367227A Semiconductor device manufacturing method |
10/23/2013 | CN103367226A Manufacturing method of semiconductor device |
10/23/2013 | CN103367225A Trench preparation method |
10/23/2013 | CN103367224A Method for forming trenches in substrate |
10/23/2013 | CN103367223A Substrate treatment apparatus and substrate treatment method |
10/23/2013 | CN103367222A Multiple-substrate-magazine lifting and rotating system |
10/23/2013 | CN103367221A Wafer bonding removing and bonding technology and system |
10/23/2013 | CN103367220A A protection belt stripping method and a protection belt stripping apparatus |
10/23/2013 | CN103367219A Forming method of chip with adhesive membrane |
10/23/2013 | CN103367218A Wafer suction method, wafer suction stage, and wafer suction system |
10/23/2013 | CN103367217A Silicon-chip absorption device and absorption method thereof |
10/23/2013 | CN103367216A Aqueduct and electrostatic chuck therewith |
10/23/2013 | CN103367215A Substrate positioning lifting device for plasma etching equipment |
10/23/2013 | CN103367214A Automatic positioning method for mounting and packaging radiating cover |
10/23/2013 | CN103367213A Hot plate and device and method for automatic positioning of hot plate wafer |
10/23/2013 | CN103367212A Wafer storage method |
10/23/2013 | CN103367211A LED (Light Emitting Diode) chip cleaning basket |
10/23/2013 | CN103367210A Chip bearing disc for full-automatic LED chip dry etching machine |
10/23/2013 | CN103367209A Liquid assisted laser lift-off method |
10/23/2013 | CN103367208A Back bonding platform for superchip |
10/23/2013 | CN103367207A Apparatus for processing substrate |
10/23/2013 | CN103367206A Multi-radiofrequency impedance control for plasma uniformity tuning |
10/23/2013 | CN103367205A Apparatus for processing substrate |
10/23/2013 | CN103367204A Double-track double-control diode TMTT (IEEE Transactions on Microwave Theory and Techniques) machine |
10/23/2013 | CN103367203A Substrate processing apparatus and substrate processing method |
10/23/2013 | CN103367202A Substrate processing apparatus and substrate processing method |
10/23/2013 | CN103367201A 热处理装置 Heat treatment device |
10/23/2013 | CN103367200A Litho cluster and modulization to enhance productivity |
10/23/2013 | CN103367199A Sintering equipment for crystalline silicon solar cell |
10/23/2013 | CN103367198A An etching apparatus and an etching method |
10/23/2013 | CN103367197A Wafer surface processing system |
10/23/2013 | CN103367196A Cleaning buffering device of solar photovoltaic assembly |
10/23/2013 | CN103367195A Transmission chamber top cover applicable to semiconductor equipment with multiple processing chambers |
10/23/2013 | CN103367194A Device and method for correcting transmission position of wafer |
10/23/2013 | CN103367193A Method and device for testing trap density and position of gate oxide layer |
10/23/2013 | CN103367192A Method for detecting under-etching and deficiency defect of through hole |
10/23/2013 | CN103367191A Failpoint locating method |
10/23/2013 | CN103367190A Method for detecting integrating degree of photoresist and silicon nitride thin films by applying vacuum environments |
10/23/2013 | CN103367189A Testing system and testing method thereof |
10/23/2013 | CN103367188A Wafer yield analysis method and system thereof |
10/23/2013 | CN103367187A Detection method of ion beam uniformity |
10/23/2013 | CN103367186A IGBT (insulated gate bipolar transistor) chip bonding method |
10/23/2013 | CN103367185A Method for manufacturing carbon nano tube flexible micro-bumps through transfer method |
10/23/2013 | CN103367184A Diode chip preparation technology |
10/23/2013 | CN103367183A Double-swing-arm die bonder welding head mechanism and die bonder |
10/23/2013 | CN103367182A Anisotropic conductive adhesive printing technology |
10/23/2013 | CN103367181A Method and device for bonding a substrate |
10/23/2013 | CN103367180A A semiconductor package structure and a manufacture method thereof |
10/23/2013 | CN103367179A Wire bonding method |
10/23/2013 | CN103367178A Stacked semiconductor package |
10/23/2013 | CN103367177A Multi-chip-laminated modularized high-speed storage integrated circuit package mold |
10/23/2013 | CN103367176A Manufacturing method for semiconductor device |
10/23/2013 | CN103367175A MDOF (multiple degrees of freedom) bond head for reversely bonding chip |
10/23/2013 | CN103367174A Method for fabricating a semiconductor device and semiconductor device |
10/23/2013 | CN103367173A Method for manufacturing semiconductor device and semiconductor device |
10/23/2013 | CN103367172A Bonding wire fixing method |
10/23/2013 | CN103367171A Dispensing Tool, toolkit and method for manufacturing semiconductor components |
10/23/2013 | CN103367170A Substrate and method for manufacturing substrate used for at least one power semiconductor device |
10/23/2013 | CN103367169A Ultrathin buried die module and method of manufacturing thereof |
10/23/2013 | CN103367168A Clamping piece supplying device used for clamping piece combining equipment and clamping piece combining equipment |
10/23/2013 | CN103367167A Method for manufacturing semiconductor device |
10/23/2013 | CN103367166A Thin film transistor preparation method and system, thin film transistor and array substrate |
10/23/2013 | CN103367165A Thin film transistor, manufacturing method thereof, array substrate and display |
10/23/2013 | CN103367164A Grid electrode and preparation method thereof |
10/23/2013 | CN103367163A MOSFET with selective dopant deactivation underneath gate |
10/23/2013 | CN103367162A Manufacturing method of fin-shaped field effect transistor |
10/23/2013 | CN103367161A Formation method for fin field effect transistor |
10/23/2013 | CN103367160A Formation method for fin field effect transistor |
10/23/2013 | CN103367159A Semiconductor structure formation method |
10/23/2013 | CN103367158A Mos晶体管及其制造方法 Mos transistor and its manufacturing method |
10/23/2013 | CN103367157A Preparation method of super junction MOSFET |
10/23/2013 | CN103367156A Method for forming semiconductor device and method for forming fin field effect transistor |
10/23/2013 | CN103367155A Methods for forming NMOS transistor and MOS transistor |
10/23/2013 | CN103367154A Transistor and method for forming same |
10/23/2013 | CN103367153A Fin field effect transistor and method for forming same |
10/23/2013 | CN103367152A Method for forming semiconductor device and fin field effect transistor |
10/23/2013 | CN103367151A A MOS device with a source/drain region close to a channel region and a method for producing the same |
10/23/2013 | CN103367150A Double layer polycrystalline gate groove type MOS transistor preparation method |
10/23/2013 | CN103367149A Field oxide layer isolation structure of LDMOS transistor and preparation method thereof |
10/23/2013 | CN103367148A 晶体管及其制造方法 Transistor and its manufacturing method |
10/23/2013 | CN103367147A Manufacturing method of fin type semiconductor device |
10/23/2013 | CN103367146A Manufacturing method of semiconductor device |
10/23/2013 | CN103367145A Trench VDMOS device and manufacturing method thereof |
10/23/2013 | CN103367144A Trench-type structure of junction electric-field shielding power MOSFET and manufacturing method |
10/23/2013 | CN103367143A Method for forming MOS device with multiple threshold voltages through identical process |
10/23/2013 | CN103367142A Compound semiconductor device and method of manufacturing the same |
10/23/2013 | CN103367141A Manufacturing method for MOS capacitor and MOS capacitor |