| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/29/2004 | WO2004010458A2 Plasma implantation system and method with target movement |
| 01/29/2004 | WO2004010457A1 Method and apparatus for producing uniform processing rates |
| 01/29/2004 | WO2004010456A1 Plasma processing apparatus and plasma processing method |
| 01/29/2004 | WO2004010442A1 Solid material comprising a structure of almost-completely-polarised electronic orbitals, method of obtaining same and use thereof in electronics and nanoelectronics |
| 01/29/2004 | WO2004010436A1 Multi-state mram with improved storage density |
| 01/29/2004 | WO2004010223A1 Photosensitive composition for interlayer dielectric and method of forming patterned interlayer dielectric |
| 01/29/2004 | WO2004010222A2 Method for the production of photoresist structures |
| 01/29/2004 | WO2004010220A1 Nozzle assembly for applying a liquid to a substrate |
| 01/29/2004 | WO2004010200A1 Catadioptric multi-mirror systems for protection lithography |
| 01/29/2004 | WO2004010167A2 Holographic surface mask etching and optical structures |
| 01/29/2004 | WO2004010164A2 Catadioptric projection objective |
| 01/29/2004 | WO2004010114A2 Device for wafer inspection |
| 01/29/2004 | WO2004009878A2 Electrochemical processing cell |
| 01/29/2004 | WO2004009862A2 Substrate loading and unloading station with buffer |
| 01/29/2004 | WO2004009861A2 Method to form ultra high quality silicon-containing compound layers |
| 01/29/2004 | WO2004009730A1 Composition and process for wet stripping removal of sacrificial anti-reflective material |
| 01/29/2004 | WO2004009719A1 Polishing composition containing conducting polymer |
| 01/29/2004 | WO2004009718A1 Method of polishing a substrate with a polishing system containing conducting polymer |
| 01/29/2004 | WO2004009515A1 Carbon composite material |
| 01/29/2004 | WO2004009489A2 Fabrication of 3d photopolymeric devices |
| 01/29/2004 | WO2004009480A1 Shatterproof ultra-thin glass and the handling thereof |
| 01/29/2004 | WO2004009299A2 Loading and unloading device for a coating unit |
| 01/29/2004 | WO2004009291A1 Polishing pad for endpoint detection and related methods |
| 01/29/2004 | WO2004009289A2 Rising after chemical-mechanical planarization process applied on a wafer |
| 01/29/2004 | WO2004008827A2 Atomic layer deposition of high k dielectric films |
| 01/29/2004 | WO2003096387A3 High efficiency solid-state light source and methods of use and manufacture |
| 01/29/2004 | WO2003092058A3 Method for producing one or more monocrystalline layers, each with a different lattice structure, on one plane of a series of layers |
| 01/29/2004 | WO2003075342A3 Methodology for repeatable post etch cd in a production tool |
| 01/29/2004 | WO2003069016A3 In-line deposition processes for circuit fabrication |
| 01/29/2004 | WO2003063226A3 Oxide layer on a gaas-based semiconductor structure and method of forming the same |
| 01/29/2004 | WO2003063214B1 Process for preparation of separable semiconductor assemblies, particularly to form substrates for electronics, optoelectronics and optics |
| 01/29/2004 | WO2003053791A3 Apparatus and method for monitoring environment within a container |
| 01/29/2004 | WO2003052801A3 Wafer pad assembly |
| 01/29/2004 | WO2003044602A3 Laser beam pattern generator with compensation of rotational scan errors |
| 01/29/2004 | WO2003043073A3 A method of depositing low k barrier layers |
| 01/29/2004 | WO2003041150A3 Two-step etching method for hard mask removal |
| 01/29/2004 | WO2003038877A3 Low temperature formation of backside ohmic contacts for vertical devices |
| 01/29/2004 | WO2003038479A3 Structures and methods for reducing aberration in optical systems |
| 01/29/2004 | WO2003023826A3 Methods and apparatus for holding a substrate in a pressure chamber |
| 01/29/2004 | WO2003019627A3 Cmp process involving frequency analysis-based monitoring |
| 01/29/2004 | WO2003009348A3 Facilities connection bucket for pre/facilitation of wafer fabrication equipment |
| 01/29/2004 | WO2002103703A3 Semiconductor device |
| 01/29/2004 | WO2002099851A3 Temperature controlled vacuum chuck |
| 01/29/2004 | WO2002089183A3 Holding device for wafers |
| 01/29/2004 | WO2002071448A3 Single transistor ferroelectric memory cell |
| 01/29/2004 | US20040019871 Method for estimating remaining film thickness distribution, method for designing patterning mask using the method for estimating remaining film thickness distribution, and method for manufacturing semiconductor devices by using patterning mask designed by using the method for estimating remaining film thickness distribution |
| 01/29/2004 | US20040019870 Method for creating mask pattern for circuit fabrication and method for verifying mask pattern for circuit fabrication |
| 01/29/2004 | US20040019863 Circuit verification apparatus, circuit verification program, and circuit verification method |
| 01/29/2004 | US20040019840 Connection verification apparatus for verifying interconnection between multiple logic blocks |
| 01/29/2004 | US20040019830 Test apparatus of semiconductor integrated circuit with hold error preventing function |
| 01/29/2004 | US20040019818 Semiconductor device |
| 01/29/2004 | US20040019452 Methods for compensating for a test temperature deviation |
| 01/29/2004 | US20040019442 Film thickness measuring method, relative dielectric constant measuring method, film thickness measuring apparatus, and relative dielectric constant measuring apparatus |
| 01/29/2004 | US20040019127 UV-curable pressure-sensitive adhesive composition and its pressure-sensitive adhesive sheet |
| 01/29/2004 | US20040018949 Semiconductor process residue removal composition and process |
| 01/29/2004 | US20040018807 Polishing pad conditioner and chemical-mechanical polishing apparatus having the same |
| 01/29/2004 | US20040018806 Wafer polisher |
| 01/29/2004 | US20040018805 Polishing pad and method of manufacture |
| 01/29/2004 | US20040018803 Methods for resist stripping and cleaning surfaces substantially free of contaminants |
| 01/29/2004 | US20040018796 Method of manufacturing display device |
| 01/29/2004 | US20040018754 Conductive contact structure and process |
| 01/29/2004 | US20040018752 Method for manufacturing electrical contact element for testing electro device and electrical contact element thereby |
| 01/29/2004 | US20040018751 Thermal processing apparatus for substrate employing photoirradiation |
| 01/29/2004 | US20040018750 Method for deposition of nitrogen doped silicon carbide films |
| 01/29/2004 | US20040018749 Method of decreasing brittleness of single crystals, semiconductor wafers, and solid-state devices |
| 01/29/2004 | US20040018748 Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion |
| 01/29/2004 | US20040018747 Deposition method of a dielectric layer |
| 01/29/2004 | US20040018746 Infrared thermopile detector system for semiconductor process monitoring and control |
| 01/29/2004 | US20040018745 Positioning substrate for semiconductor process |
| 01/29/2004 | US20040018744 Method for fabrication a semiconductor device having an organic insulating layer |
| 01/29/2004 | US20040018743 Method for removing photoresist after metal layer etching in a semiconductor device |
| 01/29/2004 | US20040018742 Forming bilayer resist patterns |
| 01/29/2004 | US20040018741 Method For Enhancing Critical Dimension Uniformity After Etch |
| 01/29/2004 | US20040018739 Methods for etching using building blocks |
| 01/29/2004 | US20040018738 Method for fabricating a notch gate structure of a field effect transistor |
| 01/29/2004 | US20040018737 Method of manufacturing semiconductor devices |
| 01/29/2004 | US20040018736 Method of forming a trench isolation |
| 01/29/2004 | US20040018735 Method of depositing an oxide film by chemical vapor deposition |
| 01/29/2004 | US20040018734 Anisotropic dry etching technique for deep bulk silicon etching |
| 01/29/2004 | US20040018733 Method of planarizing a surface of a semiconductor wafer |
| 01/29/2004 | US20040018732 Method for protecting a wafer backside from etching damage |
| 01/29/2004 | US20040018731 Method of preventing autodoping |
| 01/29/2004 | US20040018730 Effective solution and process to wet-etch metal-alloy films in semiconductor processing |
| 01/29/2004 | US20040018728 Chemical mechanical polishing solution for platinum |
| 01/29/2004 | US20040018727 Manufacturing method for semiconductor devices |
| 01/29/2004 | US20040018726 Patterned thin film and method of forming same |
| 01/29/2004 | US20040018725 Unitary interconnection structures integral with a dielectric layer and fabrication methods thereof |
| 01/29/2004 | US20040018724 Plating method |
| 01/29/2004 | US20040018723 Formation of boride barrier layers using chemisorption techniques |
| 01/29/2004 | US20040018722 Method for manufacturing semiconductor device |
| 01/29/2004 | US20040018721 Method for forming a dual damascene wiring pattern in a semiconductor device |
| 01/29/2004 | US20040018719 Metal planarization system |
| 01/29/2004 | US20040018718 Plug structure having low contact resistance and manufacturing method thereof |
| 01/29/2004 | US20040018717 Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens |
| 01/29/2004 | US20040018716 Semiconductor device and production method therefor |
| 01/29/2004 | US20040018715 Method of cleaning a surface of a material layer |
| 01/29/2004 | US20040018714 Sacrificial metal spacer damascene process |
| 01/29/2004 | US20040018713 Semiconductor component having encapsulated, bonded, interconnect contacts and method of fabrication |
| 01/29/2004 | US20040018712 Method of forming a through-substrate interconnect |
| 01/29/2004 | US20040018711 Methods for fabricating three dimensional integrated circuits |