| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/26/2004 | WO2004017377A2 Atomic layer deposition of high k metal oxides |
| 02/26/2004 | WO2004017373A2 Complementary analog bipolar transistors with trench-constrained isolation diffusion |
| 02/26/2004 | WO2004017371A2 Method for microfabricating structures using silicon-on-insulator material |
| 02/26/2004 | WO2004017368A2 Sidewall smoothing in high aspect ratio/deep etching using a discreet gas switching method |
| 02/26/2004 | WO2004017365A2 Deposition of amorphous silicon-containing films |
| 02/26/2004 | WO2004017361A2 Method for selectively removing material from the surface of a substrate, masking material for a wafer and wafer provided with a masking material |
| 02/26/2004 | WO2004017343A1 Capacitor unit and method for fabricating the same |
| 02/26/2004 | WO2004017335A1 Nanoporous materials and methods of formation thereof |
| 02/26/2004 | WO2004017143A2 Method for irradiating a resist |
| 02/26/2004 | WO2004017140A1 Mask blank manufacturing method, transfer mask manufacturing method, sputtering target for manufacturing mask blank |
| 02/26/2004 | WO2004017082A1 Semiconductor inspection device and semiconductor device manufacturing method |
| 02/26/2004 | WO2004017071A2 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor |
| 02/26/2004 | WO2004016829A2 Electrolytic copper plating solutions |
| 02/26/2004 | WO2004016827A1 Remover solution |
| 02/26/2004 | WO2004016825A1 Hafnium silicide target and method for preparation thereof |
| 02/26/2004 | WO2004016818A1 METHOD FOR PRODUCING Ag-OXIDE BASED ELECTRIC CONTACT MATERIAL AND ITS PRODUCT |
| 02/26/2004 | WO2004016723A1 Technique on ozone water for use in cleaning semiconductor substrate |
| 02/26/2004 | WO2004016672A2 Surface modification of cvd polymer films |
| 02/26/2004 | WO2004016664A1 Fluorinated polymers useful as photoresists, and processes for microlithography |
| 02/26/2004 | WO2004016546A2 Layer system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof |
| 02/26/2004 | WO2004016532A2 Modular belt carrier for electronic components |
| 02/26/2004 | WO2004016406A1 Imprint lithography processes and systems |
| 02/26/2004 | WO2004016368A1 Lead frame processing coining punch, method of manufacturing the coining punch, and lead frame |
| 02/26/2004 | WO2004016309A2 Catheter securement device |
| 02/26/2004 | WO2004003980A3 Interconnect structure and method for forming |
| 02/26/2004 | WO2003104343A3 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 02/26/2004 | WO2003100525A3 Method for determining wavefront aberrations |
| 02/26/2004 | WO2003099782A3 Acetal protected polymers and photoresists compositions thereof |
| 02/26/2004 | WO2003096386A3 Methods for forming low resistivity, ultrashallow junctions with low damage |
| 02/26/2004 | WO2003094224B1 Process for manufacturing substrates with detachment of a temporary support, and associated substrate |
| 02/26/2004 | WO2003094208A3 Method of isolating adjacent components of a semiconductor device |
| 02/26/2004 | WO2003087934A3 Interferometry system error compensation in twin stage lithography tools |
| 02/26/2004 | WO2003083942A3 Semiconductor device with components embedded in backside diamond layer |
| 02/26/2004 | WO2003081833B1 Floating-gate analog circuit |
| 02/26/2004 | WO2003081642A3 Power semiconductor device |
| 02/26/2004 | WO2003073494A3 Method of controlling metal etch processes, and system for accomplishing same |
| 02/26/2004 | WO2003065454A3 Split-gate power module and method for suppressing oscillation therein |
| 02/26/2004 | WO2003065451A9 Flip chip die bond pads, die bond pad placement and routing optimization |
| 02/26/2004 | WO2003064059A3 Integration of titanium and titanium nitride layers |
| 02/26/2004 | WO2003063044A3 Management system, method and apparatus for licensed delivery and accounting of electronic circuits |
| 02/26/2004 | WO2003062401A3 Compositions and methods for the detection, diagnosis and therapy of hematological malignancies |
| 02/26/2004 | WO2003060056A3 Assembly for cell-based assays |
| 02/26/2004 | WO2003059028A3 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby |
| 02/26/2004 | WO2003054247A3 Cleaning gas composition for semiconductor production equipment and cleaning method using the gas |
| 02/26/2004 | WO2003052016A3 Dual cure b-stageable adhesive for die attach |
| 02/26/2004 | WO2003049191A3 Bicmos structure, method for producing the same and bipolar transistor for a bicmos structure |
| 02/26/2004 | WO2003046952B1 Semiconductor component handling device having an electrostatic dissipating film |
| 02/26/2004 | WO2003046802A3 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof |
| 02/26/2004 | WO2003040828A3 Real-time prediction of and correction of proximity resist heating in raster scan particle beam lithography |
| 02/26/2004 | WO2003038892A3 Atomic-layer-deposited tantalum nitride and alpha-phase tantalum as barrier layers for copper metallization |
| 02/26/2004 | WO2003038869A9 Universal modular wafer transport system |
| 02/26/2004 | WO2003036718A3 Pattern for improved visual inspection of semiconductor devices |
| 02/26/2004 | WO2003036679A3 Wafer pedestal tilt mechanism and cooling system |
| 02/26/2004 | WO2003032492A3 A reconfigurable integrated circuit with a scalable architecture |
| 02/26/2004 | WO2003028101A3 Method of producing a contact system on the rear face of a component with stacked substrates |
| 02/26/2004 | WO2003023794A9 Method for trimming resistors |
| 02/26/2004 | WO2003001570A3 Silicon nanoparticle electronic switches |
| 02/26/2004 | WO2002103753A3 Nanoelectronic interconnection and addressing |
| 02/26/2004 | WO2002084422A3 System and method for dividing flow |
| 02/26/2004 | WO2002082530A3 In-situ thickness measurement for use in semiconductor processing |
| 02/26/2004 | WO2002067319A8 Copper interconnect structure having diffusion barrier |
| 02/26/2004 | WO2002047151B1 Method for making a semiconductor chip using an integrated rigidity layer |
| 02/26/2004 | WO2002044927A3 Hardware configuration for parallel data processing without cross communication |
| 02/26/2004 | WO2002043103A8 Extraction and deceleration of low energy beam with low beam divergence |
| 02/26/2004 | WO2002041402A3 Discrete and packaged power devices for radio frequency (rf) applications and methods of forming same |
| 02/26/2004 | WO2002039498A3 Methods and systems for positioning substrates |
| 02/26/2004 | US20040040006 Design method for integrated circuit having scan function |
| 02/26/2004 | US20040040002 Automatic recognition of an optically periodic structure in an integrated circuit design |
| 02/26/2004 | US20040040001 Providing set of initial characteristic values associated with semiconductor device, performing fabrication process on device, collecting data, replacing initial value with fabrication data, predicting new data based on modified value |
| 02/26/2004 | US20040039997 Method for multi-threshold voltage cmos process optimization |
| 02/26/2004 | US20040039584 Method of selecting mask manufacturer of photomask |
| 02/26/2004 | US20040039486 Specimen sensing and edge gripping end effector |
| 02/26/2004 | US20040039473 Integrated circuit profile value determination |
| 02/26/2004 | US20040039472 Novel methodology to obtain integrated process results prior to process tools being installed |
| 02/26/2004 | US20040039469 Flexible dispatching system and method for coordinating between a manual automated dispatching mode |
| 02/26/2004 | US20040039219 Chemical vapor deposition by dosing with a stabilizer of free-radical inhibitors, end-capping agents and mixtures; forming low-dielectric constant thin films which lower power consumption, reduces cross-talk, and shortens signal delay |
| 02/26/2004 | US20040039153 Photosensitive compositions based on polycyclic polymers |
| 02/26/2004 | US20040039127 Electronic device using low dielectric loss tangent insulators for high frequency signals |
| 02/26/2004 | US20040038840 Useful for stripping photoresists and cleaning organic and inorganic compounds from a semiconductor substrate |
| 02/26/2004 | US20040038839 Organic stripping composition and method of etching oxide using the same |
| 02/26/2004 | US20040038808 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| 02/26/2004 | US20040038632 Conditioner of chemical-mechanical polishing station |
| 02/26/2004 | US20040038624 Multiprobe detection system for chemical-mechanical planarization tool |
| 02/26/2004 | US20040038600 Liquid crystal display device having improved TFTs and a fabrication method thereof |
| 02/26/2004 | US20040038555 Manufacture method for semiconductor device with patterned film of ZrO2 or the like |
| 02/26/2004 | US20040038554 Composite dielectric forming methods and composite dielectrics |
| 02/26/2004 | US20040038553 Method for forming bottle trench |
| 02/26/2004 | US20040038552 Method for fabricating bulbous-shaped vias |
| 02/26/2004 | US20040038551 Method for controlling the temperature of a gas distribution plate in a process reactor |
| 02/26/2004 | US20040038550 Thin interface layer to improve copper etch stop |
| 02/26/2004 | US20040038549 Semiconductor apparatus fabrication method |
| 02/26/2004 | US20040038548 System for, and method of, etching a surface on a wafer |
| 02/26/2004 | US20040038547 Method of etching a metal layer using a mask, a metallization method for a semiconductor device, a method of etching a metal layer, and an etching gas |
| 02/26/2004 | US20040038546 Process variation resistant self aligned contact etch |
| 02/26/2004 | US20040038545 Plasma processes for depositing low dielectric constant films |
| 02/26/2004 | US20040038544 Method for processing a semiconductor wafer using double-side polishing |
| 02/26/2004 | US20040038543 Methods for selective removal of material from wafer alignment marks |
| 02/26/2004 | US20040038542 Process to reduce substrate effects by forming channels under inductor devices and around analog blocks |
| 02/26/2004 | US20040038541 Method for etching a hard mask layer and a metal layer |
| 02/26/2004 | US20040038540 Trench etch process for low-k dielectrics |