Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/26/2004US20040036102 Trench capacitor and method for fabricating the treanch capacitor
02/26/2004US20040036101 Vertical transistor dram structure and its manufacturing methods
02/26/2004US20040036100 Structure and method of fabricating embedded dram having a vertical device array and a bordered bitline contact
02/26/2004US20040036099 Dual-sided capacitor and method of formation
02/26/2004US20040036098 Semiconductor device including a capacitor
02/26/2004US20040036097 Dual-sided capacitor and method of formation
02/26/2004US20040036095 DRAM cell with enhanced SER immunity
02/26/2004US20040036094 Semiconductor device and an electonic device
02/26/2004US20040036088 Static semiconductor memory device
02/26/2004US20040036084 Method and device for identifying the version of integrated circuits and use controling operating sequences
02/26/2004US20040036083 Semiconductor integrated circuit device, design method for semiconductor integrated circuit device, design aiding device for semiconductor integrated circuit device, program, and program recording medium
02/26/2004US20040036082 Heterojunction bipolar transistor(HBT) having improved emitter-base grading structure
02/26/2004US20040036081 Chip-type LED and process of manufacturing the same
02/26/2004US20040036078 High density electrical and electronic apparatus having light emmiting diodes or phototubes bonded to radiation transparent substrate supports and dielectric films coverings; accuracy
02/26/2004US20040036076 Semiconductor device and method of manufacturing same
02/26/2004US20040036074 Optical interconnection integrated circuit, method of manufacturing optical interconnection integrated circuit, electro-optical apparatus, and electronic apparatus
02/26/2004US20040036073 Thin film transistor array panel
02/26/2004US20040036071 Semiconductor device and method of fabricating the same
02/26/2004US20040036070 Thin film transistor array substrate and manufacturing method thereof
02/26/2004US20040036069 Glass attachment over micro-lens arrays
02/26/2004US20040036068 Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration
02/26/2004US20040036051 Integrated capacitor with enhanced capacitance density and method of fabricating same
02/26/2004US20040036041 Device for assembling components on a substrate
02/26/2004US20040036038 Method and apparatus for plasma doping
02/26/2004US20040036037 Illumination system with a plurality of light sources
02/26/2004US20040036035 Positioning system for use in lithographic apparatus
02/26/2004US20040035917 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
02/26/2004US20040035913 Apparatus of clamping semiconductor devices using sliding finger supports
02/26/2004US20040035909 For use with electronic/flip chip packaging; requires reflow temperatures compatible with circuit board assembly processes; improved reliability over eutectics under high temperature processing
02/26/2004US20040035908 Filling device and method for filling balls in the apertures of a ball-receiving element
02/26/2004US20040035907 Apparatus and method for dispensing solder
02/26/2004US20040035849 Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate
02/26/2004US20040035848 Ceramic heater and process for temperature control thereof
02/26/2004US20040035847 Fast heating and cooling apparatus for semiconductor wafers
02/26/2004US20040035846 Ceramic heater for semiconductor manufacturing and inspecting equipment
02/26/2004US20040035826 Comprises fluorocarbon gases; photoresists; for high aspect ratio contact holes; semiconductors
02/26/2004US20040035825 Comprises alkynyl-fluorocarbon compounds; semiconductors; for producing high aspect ratio apertures
02/26/2004US20040035820 Fabrication of MEMS devices with spin-on glass
02/26/2004US20040035717 Electrolysis reduction by the cathode, electrochemical process by dipping in an acidic solution, etching chromium-based undercoatings away; forming a carrier tape for semiconductor chips
02/26/2004US20040035712 An electrical apparatus comprising tank, chucks, shaft and drives, for electrodepositing a copper layer on a substrate, cleaning or etching, uniformity deposition from a solution
02/26/2004US20040035710 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
02/26/2004US20040035709 Methods for repairing defects on a semiconductor substrate
02/26/2004US20040035708 A surface treatment by forming an ultra-thin metal seed layer on the barrier layer, manufacture of integrated circuits, electrochemical application of the copper interconnect structures, metallization
02/26/2004US20040035707 For plating copper onto semiconductor wafer; methods apply to patterned metal layers plated onto seed layer partially protected by overlying photoresist; sealing performed by engaging seal against photoresist to prevent corrosion
02/26/2004US20040035695 Flow diffuser to be used in electro-chemical plating system
02/26/2004US20040035694 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
02/26/2004US20040035692 Sputtering process comprising impressing DC magnetic field of first magnetic polarity parallel to central axis, injecting sputter working gas into chamber, electrically biasing target to excite working gas into plasma for sputtering, RF biasing
02/26/2004US20040035605 Electrically active patterns are applied using colloidal suspension of nanoparticles that exhibit a desired electrical characteristic; nanoparticles are surrounded by insulative shells that may be removed by application of energy
02/26/2004US20040035569 Device and method for feeding treating air
02/26/2004US20040035554 Heatsink, method of manufacturing the same and cooling apparatus using the same
02/26/2004US20040035532 Etching apparatus for use in manufacturing a semiconductor device and shield ring for upper electrode thereof
02/26/2004US20040035531 Apparatus for controlling the temperature of a gas distribution plate in a process reactor
02/26/2004US20040035530 Sheet-fed treating device
02/26/2004US20040035529 Monitoring a process and compensating for radiation source fluctuations
02/26/2004US20040035525 Production method for bonded substrates
02/26/2004US20040035519 Microelectronic joining processes
02/26/2004US20040035493 Clean box, clean transfer method and system
02/26/2004US20040035451 Ultrasonic cleaner and wet treatment nozzle comprising the same
02/26/2004US20040035450 Apparatus for cleaning the edges of wafers
02/26/2004US20040035449 Wet cleaning facility having bubble-detecting device
02/26/2004US20040035448 Selective treatment of microelectronic workpiece surfaces
02/26/2004US20040035441 Apparatus and method for cleaning substrate
02/26/2004US20040035365 Plasma processing apparatus
02/26/2004US20040035364 Plasma processing apparatus and method for asssembling the plasma processing apparatus
02/26/2004US20040035362 Atomic layer deposition method and semiconductor device fabricating apparatus having rotatable gas injectors
02/26/2004US20040035361 Apparatus and method for forming deposited film
02/26/2004US20040035360 Manufacturing apparatus
02/26/2004US20040035359 Heat-treating apparatus and heat-treating method
02/26/2004US20040035354 Process for removing contaminant from a surface and composition useful therefor
02/26/2004US20040035353 Manufacturing of organized molecular monolayers and adapted substrate
02/26/2004US20040035202 Method and device for the metered delivery of low volumetric flows of liquid
02/26/2004US20040035153 Method of producing a glass substrate for a mask blank, method of producing a mask blank, method of producing a transfer mask, method of producing a semiconductor device, glass substrate for a mask blank, mask blank, and transfer mask
02/26/2004US20040034976 Transfer robot and inspection method for thin substrate
02/26/2004DE20316284U1 Handler for holding and transport of wafer between input and output units and process stations in vacuum processing installation in semiconductor manufacture., consisting of elongated flat main body of carbon fibre compound material
02/26/2004DE20216832U1 Clean room for biotechnology, has a filter ventilator unit for feeding clean air to a work area and two modules interlinked but sealed
02/26/2004DE19511869B4 Verfahren und Anordnung zur Responseanalyse von Halbleitermaterialien mit optischer Anregung Method and system for response analysis of semiconductor materials with optical excitation
02/26/2004DE10337542A1 Bitleitungs-Vorladeschaltung für ein Halbleiterspeicherbauelement Bit line precharge circuit for a semiconductor memory device
02/26/2004DE10335385A1 Read only memory cell for storing two bits of data, has one terminal connected to ground voltage line and selection signal lines, or not connected to any of signal lines, and cell storing two bits of data based on connection
02/26/2004DE10334819A1 Silicon carbide semiconductor device used in electronics comprises a silicon carbide substrate having an error-aligned surface with a specified outer axial direction
02/26/2004DE10334416A1 Halbleiterbaugruppe Semiconductor package
02/26/2004DE10334406A1 Production of a contact for an integrated semiconductor device comprises forming a dielectric intermediate layer film on a semiconductor substrate, forming a polysilicon film and antireflection film on the film, and further processing
02/26/2004DE10334101A1 Semiconductor storage device used as a DRAM device comprises a cell transistor structure with word lines having an n-diffusion layer with an n-carrier concentration which is higher on the region close to the word line of one cell
02/26/2004DE10333819A1 Gateansteuerungsschaltung in Leistungsmodulen Gate drive circuit in power modules
02/26/2004DE10332865A1 Vorrichtung zum Trocknen von Halbleitersubstraten unter Verwendung des Azeotrop-Effekts und ein Trocknungsverfahren, das diese Vorrichtung verwendet An apparatus for drying of semiconductor substrates using the azeotrope-effect and a drying method using this apparatus
02/26/2004DE10332651A1 Holographic lithography in three-dimensional photo lacquer body, employs multi-faced optical entry element, having planar- or curved surfaces
02/26/2004DE10332188A1 Inline-System für einen Halbleiterpackungs-Montageprozess und Chipvereinzelungs-Folienanbringungseinheit Inline system for a semiconductor package assembly process and chip singulation film mounting unit
02/26/2004DE10331560A1 Halbleitervorrichtung mit einem Verbundbereich und ein Verfahren zur Herstellung derselben A semiconductor device comprising a composite region and a method of manufacturing the same
02/26/2004DE10330459A1 Geringer Kupferanteil zum Verringern von Kurzschlüssen in AICu-Leitungen Low copper content of reducing short-circuits in AlCu lines
02/26/2004DE10328872A1 Paraelektrisches Material für ein Halbleiterbauelement und Herstellungsverfahren desselben Thereof paraelectric material for a semiconductor device and manufacturing method
02/26/2004DE10328578A1 Hartmaske aus amorphen Kohlenstoff-Wasserstoff-Schichten Hard mask of amorphous carbon-hydrogen layers
02/26/2004DE10328350A1 Isolierende Deckschicht und leitende Deckschicht in Halbleiterbauelementen mit magnetischen Materiallagen Insulating layer and conductive top layer in semiconductor devices with magnetic material layers
02/26/2004DE10326352A1 Vorrichtung mit einer Elektrode für die Bildung einer Kugel am Ende eines Drahtes Device with an electrode for forming a ball at the end of a wire
02/26/2004DE10321470A1 Schutz vor elektrischer Entladung eines Dünnfilmresonators Protecting against electrostatic discharge a thin film resonator
02/26/2004DE10318394A1 Automatisches Prüfsystem und Vorrichtung für integrierte Schaltungen unter Verwendung eines integrativen Computers und ein Verfahren für dieselben Automatic testing system and apparatus for integrated circuits using an integrated computer and a method for the same
02/26/2004DE10314516A1 Halbleiter-Bauelement Semiconductor component
02/26/2004DE10313926A1 Halbleiterbauelement mit einem auf Zellen beruhenden Grundelementaggregat, welches ein vorspringendes Teil in einem aktiven Gebiet aufweist A semiconductor device having a cell based base member unit having a projecting part in an active region
02/26/2004DE10311314A1 Halbleitervorrichtung mit Isolator und Verfahren zu ihrer Herstellung A semiconductor device comprising insulator, and processes for their preparation
02/26/2004DE10309598A1 Halbleitervorrichtung mit verkleinertem eingebautem Treiber A semiconductor device having a reduced built-drivers
02/26/2004DE10306557A1 Verfahren zum Herstellen eines elektrischen Leiterrahmens, Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements und Leiterrahmenstreifen A method of manufacturing an electrical lead frame method for producing a surface-mountable semiconductor device and lead frame strip
02/26/2004DE10305824A1 Musterlayoutverfahren einer Photomaske für den Mustertransfer und Photomaske für den Mustertransfer Pattern layout method of a photomask for pattern transfer and photomask for pattern transfer