Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2004
03/03/2004CN1479379A Semiconductor device and its making method
03/03/2004CN1479377A Capacitor of semiconductor device and its preparing method
03/03/2004CN1479376A Structure of storage device and its manufacturing method
03/03/2004CN1479375A 电容器 Capacitors
03/03/2004CN1479374A External discharge protection circuite
03/03/2004CN1479373A 半导体元件及半导体封装 Semiconductor elements and semiconductor packages
03/03/2004CN1479371A Packaging baseplate having electrostatic discharge protection
03/03/2004CN1479368A Flattening method of flas storage device
03/03/2004CN1479367A Method of manufacturing bicarrier complementary gold oxygen semi conductor on silicon insolator base
03/03/2004CN1479366A Manufacturing method of semiconductor memory device
03/03/2004CN1479365A Structure of L-type word line gap wall and its manufacturing method
03/03/2004CN1479364A Method of forming contact hole with exposed conductive pattern on semi conductor substrate
03/03/2004CN1479363A Method of conforming rear end manufacturing process
03/03/2004CN1479362A Method of forming shallow slot partition structure
03/03/2004CN1479360A Method of monstoring real defect through eliminating duplicate defect which does not influence acceptance raet
03/03/2004CN1479359A Packaging mould with electrostatic discharge protection
03/03/2004CN1479358A Packaging mould with electrostatic protection
03/03/2004CN1479357A Packaging method capable of proceeding electric defect test for top surface and botton surface of wafer
03/03/2004CN1479356A Manufacturing method of semiconductor assembly part capable of improving lattice defectin silicon build up crystal layer
03/03/2004CN1479355A Fluted plane bigrid structure MOS device and its manufacturing method
03/03/2004CN1479354A Method of preparing SON type field-effect transistor
03/03/2004CN1479353A Separating processing method for material layer
03/03/2004CN1479352A Method and device for deciding semiconductor making process state and semiconductor making device
03/03/2004CN1479351A No-scrape chemical mechanical grinding technology
03/03/2004CN1479350A Method of forming different thickness bigrid insulating layer
03/03/2004CN1479349A Flip-chip packaged scab technology
03/03/2004CN1479328A Aging circuit of capacitor
03/03/2004CN1479313A Semiconductor storing device and semiconductor integrated circuit
03/03/2004CN1479175A Method for etching surface material with induced chemical reaction by focused electron beam on surface
03/03/2004CN1479174A Photoetching device and method for manufacturing device
03/03/2004CN1479172A Pattern forming method and substrate treatment device
03/03/2004CN1479137A Semiclnductor display device and electronic device with the semiconductor display device
03/03/2004CN1479073A Distortion measurement method and exposure equipment
03/03/2004CN1478824A Electronic element for high frequency using low-dielectric loss angle tangent insulating material
03/03/2004CN1478800A Photoetch resist copolymer
03/03/2004CN1140932C Zinc oxide film, photoelectric element and process for production thereof
03/03/2004CN1140929C Non-volatile semiconductor memory featuring effective cell area reduction using contactless technology
03/03/2004CN1140927C Method for producing storage cell
03/03/2004CN1140926C Method for manufacturing DRAM cell capacitor
03/03/2004CN1140925C Semiconductor device and method for manufacturing thereof
03/03/2004CN1140924C Method for producing double-metal mosaic structure
03/03/2004CN1140923C Gap fill of semiconductor structure using doped silicate glasses with multi-step deposition/anneal process
03/03/2004CN1140922C Method for eliminating leakage current of shallow channel isolation area
03/03/2004CN1140921C Method for controlling cracking of ceramic thin film circuit
03/03/2004CN1140920C Double wafer structure without wafer holder
03/03/2004CN1140919C Activation method for reducing P-type film resistance by laser
03/03/2004CN1140918C Method for eliminating barried layer pore of semiconductor element
03/03/2004CN1140917C Method of making semiconductor structure containing metal oxide interface of silicon
03/03/2004CN1140916C Synthesis of half rotary coposite material
03/03/2004CN1140915C Method for obtaining large-area high-quality GaN self-supporting substrate
03/03/2004CN1140914C Method for mfg. semiconductor structure having crystalline alkaline earth metal oxide interface with silicon
03/03/2004CN1140913C Workpiece vibration damper
03/03/2004CN1140891C Process for preparing organic electroluminescent device with quantum trap
03/02/2004US6701512 Focus monitoring method, exposure apparatus, and exposure mask
03/02/2004US6701510 Computer readable medium with definition of interface recorded thereon, verification method for feasibility to connect given circuit and method of generating signal pattern
03/02/2004US6701509 Integrated circuit power and ground routing
03/02/2004US6701504 Block based design methodology
03/02/2004US6701502 Integrated circuit device, arrangement/wiring method thereof, arrangement/wiring apparatus thereof, and recording medium
03/02/2004US6701500 Logic circuit module, method for designing a semiconductor integrated circuit using the same, and semiconductor integrated circuit
03/02/2004US6701497 Method for effective capacitance calculation of interconnect portion and delay calculation of electronic circuit
03/02/2004US6701259 Defect source identifier
03/02/2004US6701204 System and method for finding defective tools in a semiconductor fabrication facility
03/02/2004US6701202 Performance evaluation method for plasma processing apparatus
03/02/2004US6701199 Methodology to obtain integrated process results prior to process tools being installed
03/02/2004US6700914 Vertical cavity surface emitting laser device
03/02/2004US6700826 Semiconductor apparatus
03/02/2004US6700815 Refresh scheme for dynamic page programming
03/02/2004US6700771 Decoupling capacitor for high frequency noise immunity
03/02/2004US6700763 Protected dual-voltage microcircuit power arrangement
03/02/2004US6700715 Oscillation damping system
03/02/2004US6700663 Method of monitoring a laser crystallization process
03/02/2004US6700648 Method for controlling a processing apparatus
03/02/2004US6700646 Lithographic apparatus, method of manufacturing a device, and device manufactured thereby
03/02/2004US6700643 Device for exposure of a peripheral area of a film circuit board
03/02/2004US6700642 Laser exposure apparatus
03/02/2004US6700631 Method of separating thin-film device, method of transferring thin-film device, thin-film device, active matrix substrate, and liquid crystal display device
03/02/2004US6700600 Beam positioning in microlithography writing
03/02/2004US6700474 Dual layer; easily integrated into an existing cmos, bipolar, or bicmos process flow
03/02/2004US6700458 Device and method for coupling two circuit components which have different impedances
03/02/2004US6700437 Semiconductor device including logic circuit and macro circuit which has a function for stopping a direct current
03/02/2004US6700435 Local supply generator for a digital CMOS integrated circuit having an analog signal processing circuitry
03/02/2004US6700433 Drain activated/deactivated AC coupled bandpass RF switch
03/02/2004US6700429 Semiconductor device
03/02/2004US6700412 Semiconductor device
03/02/2004US6700406 Multi-valued logical circuit with less latch-up
03/02/2004US6700385 Apparatus and method for detection and measurement of environmental parameters
03/02/2004US6700363 Reference voltage generator
03/02/2004US6700330 EL display device and electronic device
03/02/2004US6700249 Direct drive vertical lift and rotation stage
03/02/2004US6700211 Method for forming conductors in semiconductor devices
03/02/2004US6700210 Electronic assemblies containing bow resistant semiconductor packages
03/02/2004US6700209 Partial underfill for flip-chip electronic packages
03/02/2004US6700208 Surface mounting substrate having bonding pads in staggered arrangement
03/02/2004US6700205 Semiconductor devices having contact plugs and local interconnects
03/02/2004US6700203 Semiconductor structure having in-situ formed unit resistors
03/02/2004US6700202 Reducing the oxidized interface with a hydrogen containing plasma and introducing second-layer-forming compounds
03/02/2004US6700200 Reliable via structures having hydrophobic inner wall surfaces
03/02/2004US6700199 Gold-silver bonding wire for semiconductor device
03/02/2004US6700198 Resin for semiconductor wire
03/02/2004US6700196 Programmable multi-chip module