Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/26/2004US20040038539 Reticle for creating resist-filled vias in a dual damascene process
02/26/2004US20040038538 Dual-gate structure and method of fabricating integrated circuits having dual-gate structures
02/26/2004US20040038537 Method of preventing or suppressing sidewall buckling of mask structures used to etch feature sizes smaller than 50nm
02/26/2004US20040038536 Semiconductor fabrication process for modifying the profiles of patterned features
02/26/2004US20040038535 Polysilicon opening polish
02/26/2004US20040038533 Isolated junction structure and method of manufacture
02/26/2004US20040038532 Method for drying microstructure member
02/26/2004US20040038531 Method of manufacturing semiconductor apparatus
02/26/2004US20040038530 Method for forming a conductive film and a conductive pattern of a semiconductor device
02/26/2004US20040038529 Process for producing integrated circuits
02/26/2004US20040038528 Method for forming an epitaxial cobalt silicide layer on MOS devices
02/26/2004US20040038526 Thermal process for reducing copper via distortion and crack
02/26/2004US20040038525 Enhanced atomic layer deposition
02/26/2004US20040038524 Method for forming a contact in a semiconductor process
02/26/2004US20040038523 Interconnect structures in a semiconductor device and processes of formation
02/26/2004US20040038522 Method of fabricating a semiconductor interconnect structure
02/26/2004US20040038521 Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene process
02/26/2004US20040038520 Method of manufacturing semiconductor device
02/26/2004US20040038519 Wiring method and element arranging method using the same, and method of production image display devices
02/26/2004US20040038518 Methods for forming metal interconnections for semiconductor devices using a buffer layer on a trench sidewall, and semiconductor devices so formed
02/26/2004US20040038517 Methods of forming cobalt silicide contact structures including sidewall spacers for electrical isolation and contact structures formed thereby
02/26/2004US20040038516 Method of manufacturing a semiconductor device
02/26/2004US20040038514 Method for forming low-k hard film
02/26/2004US20040038513 Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
02/26/2004US20040038511 Methods of fabricating silicide pattern structures
02/26/2004US20040038510 Method of manufacturing a semiconductor device
02/26/2004US20040038509 Chip scale surface mounted device and process of manufacture
02/26/2004US20040038508 Method for fabricating a semiconductor device having a tapered-mesa side-wall film
02/26/2004US20040038507 Method of producing an integrated circuit configuration
02/26/2004US20040038505 Ion implantation method, SOI wafer manufacturing method and ion implantation system
02/26/2004US20040038504 Ion implantation method and method for manufacturing SOI wafer
02/26/2004US20040038503 Method of disordering quantum well heterostructures
02/26/2004US20040038501 Semiconductor device and active matrix type display
02/26/2004US20040038500 Thin microelectronic substrates and methods of manufacture
02/26/2004US20040038499 Wafer table and semiconductor package manufacturing apparatus using the same
02/26/2004US20040038498 Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor
02/26/2004US20040038497 Method for fabricating large area flexible electronics
02/26/2004US20040038496 Method and system for bonding a semiconductor chip onto a carrier using micro-pins
02/26/2004US20040038495 Method of providing a thick thermal oxide in trench isolation
02/26/2004US20040038494 Manufacturing method of semiconductor integrated circuit device
02/26/2004US20040038493 Method for forming a trench isolation structure
02/26/2004US20040038492 Method of manufacturing a semiconductor device
02/26/2004US20040038491 Capacitor for semiconductor device and method for manufacturing the same
02/26/2004US20040038490 Method for manufacturing semiconductor device
02/26/2004US20040038489 Method to improve performance of microelectronic circuits
02/26/2004US20040038488 SOI device having increased reliability and reduced free floating body effects
02/26/2004US20040038487 Method for improving nitrogen profile in plasma nitrided gate dielectric layers
02/26/2004US20040038486 Plasma method and apparatus for processing a substrate
02/26/2004US20040038485 Semiconductor device for protecting electrostatic discharge and method of fabricating the same
02/26/2004US20040038484 Method for fabricating source/drain devices
02/26/2004US20040038483 Methods of forming semiconductor constructions
02/26/2004US20040038482 Technique for fabricating logic elements using multiple gate layers
02/26/2004US20040038481 Trench MOSFET having implanted drain-drift region and process for manufacturing the same
02/26/2004US20040038480 Method of manufacture of a PCRAM memory cell
02/26/2004US20040038479 Structure and fabricating method with self-aligned bit line contact to word line in split gate flash
02/26/2004US20040038478 Dual-damascene bit line structures for microelectronic devices and methods of fabricating microelectronic devices
02/26/2004US20040038477 Haze-free BST films
02/26/2004US20040038476 Selective polysilicon stud growth
02/26/2004US20040038475 Method and apparatus for a linearized output driver and terminator
02/26/2004US20040038474 Integrated metal-insulator-metal capacitor and metal gate transistor
02/26/2004US20040038473 Symmetric inducting device for an integrated circuit having a ground shield
02/26/2004US20040038472 On-p-GaAs substrate Zn1-xMgxSySe1-y pin photodiode and on-p-GaAs substrate Zn1-xMgxSySe1-y avalanche photodiode
02/26/2004US20040038471 Semiconductor device and method of manufacturing the same
02/26/2004US20040038469 Method of processing a semiconductor wafer
02/26/2004US20040038468 Forming strained source drain junction field effect transistors
02/26/2004US20040038467 Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same
02/26/2004US20040038466 Method of self-aligning a damascene gate structure to isolation regions
02/26/2004US20040038465 Method of manufacturing a semiconductor device
02/26/2004US20040038464 Multiple-plane FinFET CMOS
02/26/2004US20040038463 Semiconductor device and method of manufacturing the same
02/26/2004US20040038462 Process for growing a dielectric layer on a silicon-containing surface using a mixture of N2O and O3
02/26/2004US20040038461 Semiconductor device on silicon-on-insulator and method for manufacturing the semiconductor device
02/26/2004US20040038460 Methods of forming transistor gates; and methods of forming programmable read-only memory constructions
02/26/2004US20040038459 Field effect transistors and materials and methods for their manufacture
02/26/2004US20040038457 Stress balanced semiconductor packages, method of fabrication and modified mold segment
02/26/2004US20040038456 Vertical mold die press machine
02/26/2004US20040038454 Inspection system setup techniques
02/26/2004US20040038453 Integrated circuit metallization using a titanium/alminum alloy
02/26/2004US20040038452 Connection between semiconductor unit and device carrier
02/26/2004US20040038451 Method suitable for forming a microelectronic device package
02/26/2004US20040038448 Semiconductor device and method for fabricating the same
02/26/2004US20040038446 Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device
02/26/2004US20040038444 Thin film semiconductor device and manufacturing method thereof
02/26/2004US20040038443 Method and apparatus for increasing digital color imaging utilizing tandem RGB photodiodes
02/26/2004US20040038442 Optically interactive device packages and methods of assembly
02/26/2004US20040038441 Thin film transistor and method of manufacturing the same
02/26/2004US20040038440 Method of manufacturing a semiconductor laser
02/26/2004US20040038438 Method for reducing surface roughness of polysilicon films for liquid crystal displays
02/26/2004US20040038436 Method of manufacturing a semiconductor integrated circuit device
02/26/2004US20040038435 Method of forming a metal silicide gate in a standard MOS process sequence
02/26/2004US20040038433 Semiconductor copper line cutting method
02/26/2004US20040038155 Topcoat process to prevent image collapse
02/26/2004US20040038154 Separation-material composition for photo-resist and manufacturing method of semiconductor device
02/26/2004US20040038150 Novel resins and photoresist compositions comprising same
02/26/2004US20040038139 Method and system for realtime CD microloading control
02/26/2004US20040038136 Method of making a photomask
02/26/2004US20040038135 Photolithographic mask and methods for producing a structure and of exposing a wafer in a projection apparatus
02/26/2004US20040038060 Fine structure composite and drying method of fine structure using the same
02/26/2004US20040038052 Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
02/26/2004US20040038048 Organic silicate polymer having a flexible organic bridge unit in the network