Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/26/2004US20040038047 Polysiloxane reaction product of silica and a hydrolyzate of an alkoxysilane and a readily decomposable resin
02/26/2004US20040038024 Adhesive tape for polishing pad and polishing tape
02/26/2004US20040038021 Resin containing as cross-linking component a compound having a plurality of styrene groups, for example, 1,2-bis(vinylphenyl)ethane; low dielectric constant, low dielectric dissipation factor
02/26/2004US20040037999 Fabrication method
02/26/2004US20040037973 Deposition and chamber treatment methods
02/26/2004US20040037959 Nanolithography, forming a pattern on a substrate by using a coated tip pen, coated with a compound, atomic force microscope imaging, drawing
02/26/2004US20040037692 Mobile holder for a wafer
02/26/2004US20040037691 End-effectors and transfer devices for handling microelectronic workpieces
02/26/2004US20040037690 Method and apparatus for transferring a thin plate
02/26/2004US20040037682 Substrate holder, plating apparatus, and plating method
02/26/2004US20040037677 Substrate treating apparatus
02/26/2004US20040037676 Substrate loading and unloading apparatus
02/26/2004US20040037675 Wafer handling system
02/26/2004US20040037543 Light irradiation type thermal processing apparatus
02/26/2004US20040037458 Method for recognizing a pattern of an alignment mark on a wafer
02/26/2004US20040037388 Illumination system particularly for microlithography
02/26/2004US20040037347 Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of rtp tool
02/26/2004US20040037339 Laser discharge chamber passivation by plasma
02/26/2004US20040037336 Semiconductor laser device of III-V group compound and fabrication method therefor
02/26/2004US20040037150 disabling a high voltage generator responsive to a mode signal; and applying an external voltage to the semiconductor memory device through a pad responsive to the disabling
02/26/2004US20040037147 Non-volatile memory device and fabrication method thereof
02/26/2004US20040037139 reduced in chip size with a reduction in chip cost
02/26/2004US20040037134 Selective polysilicon stud growth
02/26/2004US20040037127 utilize differential pFET floating gate transistors to store information
02/26/2004US20040037116 Structure and operating method for nonvolatile memory cell
02/26/2004US20040037113 Non-volatile semiconductor memory device having an increased access speed while maintaining the production yield
02/26/2004US20040037110 Thin film magnetic memory device conducting read operation and write operation in parallel
02/26/2004US20040036991 Ultra-high resolution imaging devices
02/26/2004US20040036985 Structures and methods for reducing polarization aberration in integrated circuit fabrication systems
02/26/2004US20040036977 Optical illumination device, exposure device and exposure method
02/26/2004US20040036971 Methods for reducing polarization aberration in optical systems
02/26/2004US20040036969 Crystallization apparatus, optical member for use in crystallization apparatus, crystallization method, manufacturing method of thin film transistor, and manufacturing method of matrix circuit substrate of display
02/26/2004US20040036961 Structures and methods for reducing polarization aberration in optical systems
02/26/2004US20040036883 Projection exposure apparatus
02/26/2004US20040036865 Surface inspecting apparatus
02/26/2004US20040036864 System for detecting anomalies and/or features of a surface
02/26/2004US20040036863 Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface
02/26/2004US20040036861 Probe apparatus
02/26/2004US20040036849 Exposure apparatus, surface position adjustment unit, mask, and device manufacturing method
02/26/2004US20040036848 Lithographic apparatus and device manufacturing method
02/26/2004US20040036822 Electro-optical device
02/26/2004US20040036786 CMOS aps with stacked avalanche multiplication layer and low voltage readout electronics
02/26/2004US20040036731 Method for the printing of homogeneous electronic material with a multi-ejector print head
02/26/2004US20040036544 Bipolar transistor, oscillation circuit, and voltage controlled oscillator
02/26/2004US20040036519 Self-aligned vertical transistor dram structure and its manufacturing methods
02/26/2004US20040036518 Semiconductor integrated circuit device
02/26/2004US20040036510 Clock signal propagation gate and semiconductor integrated circuit including same
02/26/2004US20040036507 Semiconductor integrated circuit having logic circuit comprising transistors with lower threshold voltage values and improved pattern layout
02/26/2004US20040036491 Probe card
02/26/2004US20040036489 Electron microscopic inspection apparatus
02/26/2004US20040036181 Connection of integrated circuit to a substrate
02/26/2004US20040036179 Flip-chip device strengthened by substrate metal ring
02/26/2004US20040036178 Flip-chip mounted integrated circut card element
02/26/2004US20040036177 Semiconductor device for applying well bias and method of fabricating the same
02/26/2004US20040036175 Semiconductor device and wiring forming method in semiconductor device
02/26/2004US20040036174 Semiconductor device having a wire bond pad and method therefor
02/26/2004US20040036171 Method and apparatus for enabling a stitch wire bond in the absence of discrete bump formation, semiconductor device assemblies and electronic systems including same
02/26/2004US20040036170 Double bumping of flexible substrate for first and second level interconnects
02/26/2004US20040036164 Semiconductor device and its manufacturing method
02/26/2004US20040036161 Semiconductor heat exchangers having thermoconductive sheets comprising metals, ceramics or glass and channels for fluid or gas flow; dissipation
02/26/2004US20040036160 Packaged die on PCB with heat sink encapsulant and methods
02/26/2004US20040036158 Tab tape, method of making same and semiconductor device
02/26/2004US20040036156 Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation, and method of forming semiconductor device assembly including same
02/26/2004US20040036153 Stress balanced semiconductor packages, method of fabrication and modified mold segment
02/26/2004US20040036149 Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive
02/26/2004US20040036146 Phototransistor device with fully depleted base region
02/26/2004US20040036145 Method of making bipolar transistor with integrated base contact and field plate
02/26/2004US20040036143 Integrated capacitor and method of making same
02/26/2004US20040036142 Electrical and electronic apparatus comprises substrates having silicide layers and isolation grooves on the surfaces; high speed transistors
02/26/2004US20040036140 Semiconductor device and method of manufacturing same
02/26/2004US20040036139 Semiconductor integrated circuit device and method of manufacturing the same
02/26/2004US20040036138 High voltage power MOSFET having low on-resistance
02/26/2004US20040036137 Nickel bonding cap over copper metalized bondpads
02/26/2004US20040036131 Electrostatic discharge protection devices having transistors with textured surfaces
02/26/2004US20040036130 Methods of forming quantum dots of group iv semiconductor materials
02/26/2004US20040036129 Atomic layer deposition of CMOS gates with variable work functions
02/26/2004US20040036128 Multi-gate carbon nano-tube transistors
02/26/2004US20040036127 Tri-gate devices and methods of fabrication
02/26/2004US20040036126 Tri-gate devices and methods of fabrication
02/26/2004US20040036125 Integrated circuit devices including a multi-layer poly film cell pad contact hole and methods of forming the same
02/26/2004US20040036123 Thin dielectric layers and non-thermal formation thereof
02/26/2004US20040036122 Semiconductor device
02/26/2004US20040036121 Semiconductor device and a method of producing the same
02/26/2004US20040036119 Cross diffusion barrier layer in polysilicon
02/26/2004US20040036118 Concurrent Fin-FET and thick-body device fabrication
02/26/2004US20040036117 Semiconductor constructions
02/26/2004US20040036116 Semiconductor constructions
02/26/2004US20040036115 High-voltage transistor with buried conduction layer
02/26/2004US20040036114 Buried transistors for silicon on insulator technology
02/26/2004US20040036113 Silicon carbide n channel MOS semiconductor device and method for manufacturing the same
02/26/2004US20040036112 Method to improve the coupling ratio of top gate to floating gate in flash
02/26/2004US20040036111 Semiconductor device and a fabrication method thereof
02/26/2004US20040036110 Semiconductor memory device and method for fabricating the same
02/26/2004US20040036109 Memory cell and memory device
02/26/2004US20040036108 High coupling floating gate transistor
02/26/2004US20040036107 Semiconductor device and method of manufacturing the same
02/26/2004US20040036106 High coupling floating gate transistor
02/26/2004US20040036105 Ferroelectric capacitor
02/26/2004US20040036104 Semiconductor memory device
02/26/2004US20040036103 Memory device and method of manufacturing the same