Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2004
03/09/2004US6702489 Inking apparatus with multi-positioning capability
03/09/2004US6702407 Color image display device, method of driving the same, and electronic equipment
03/09/2004US6702302 Nondamaging; minimizes particle loss; low flutter
03/09/2004US6702202 Method and apparatus for fluid delivery to a backside of a substrate
03/09/2004US6702099 Work conveying system
03/09/2004US6701972 Vacuum load lock, system including vacuum load lock, and associated methods
03/09/2004US6701942 Method of and apparatus for removing contaminants from surface of a substrate
03/09/2004US6701941 Method for treating the surface of a workpiece
03/09/2004US6701910 Film frame substrate fixture
03/09/2004US6701614 Method for making a build-up package of a semiconductor
03/04/2004WO2004019669A1 Mounting machine and controller of the mounting machine
03/04/2004WO2004019668A1 Perforated substrate, method for manufacturing same and full wafer contact board
03/04/2004WO2004019667A1 Method for forming bump on electrode pad with use of double-layered film
03/04/2004WO2004019658A1 Metal heater
03/04/2004WO2004019609A2 A cmos aps with stacked avalanche multiplication layer and low voltage readout electronics
03/04/2004WO2004019427A1 Organic field-effect transistor and method of manufacturing same
03/04/2004WO2004019415A1 GaN-TYPE ENHANCEMENT MOSFET USING HETERO STRUCTURE
03/04/2004WO2004019414A1 Tri-gate devices and methods of fabrication
03/04/2004WO2004019413A1 Method for creating a structure on a substrate
03/04/2004WO2004019410A1 Ferroelectric device and method of manufacturing such a device
03/04/2004WO2004019409A1 Compact mask programmable rom
03/04/2004WO2004019408A1 Contactless mask programmable rom
03/04/2004WO2004019407A1 Method of evaluating core based system-on-a-chip
03/04/2004WO2004019404A2 Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom
03/04/2004WO2004019403A2 Mechanical recycling of a wafer comprising a buffer layer, after having taken a layer therefrom
03/04/2004WO2004019402A1 Electrical component
03/04/2004WO2004019401A1 Method and apparatus for predicting device electrical parameters during fabrication
03/04/2004WO2004019400A1 Thin film transistor
03/04/2004WO2004019399A1 Gas supply system and treatment system
03/04/2004WO2004019398A1 Magnetron plasma-use magnetic field generation device
03/04/2004WO2004019397A1 Plasma processing device
03/04/2004WO2004019396A1 Plasma processing method and plasma processing device
03/04/2004WO2004019395A1 Polishing pad and polishing method
03/04/2004WO2004019394A1 Atomic layer deposition of cmos gates
03/04/2004WO2004019393A1 Composition for forming silicon film and method for forming silicon film
03/04/2004WO2004019392A2 Mbe growth of a semiconductor layer structure
03/04/2004WO2004019391A2 Semiconductor heterostructures having reduced dislocation pile-ups and related methods
03/04/2004WO2004019390A2 Mbe growth of an algan layer or algan multilayer structure
03/04/2004WO2004019389A1 Mark position detection device, mark position detection method, superimposing measurement device, and superimposing measurement method
03/04/2004WO2004019388A1 Method for fabricating semiconductor wafer
03/04/2004WO2004019387A1 Substrate processing system
03/04/2004WO2004019386A2 Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of rtp tool
03/04/2004WO2004019384A2 Semiconductor constructions with gated isolation regions having indium-doped sub-regions
03/04/2004WO2004019383A2 Self-aligned contacts to gates
03/04/2004WO2004019375A2 Bonded structures for use in semiconductor processing environments
03/04/2004WO2004019373A2 Nanocrystal electron device
03/04/2004WO2004019372A2 Contactless mask programmable rom
03/04/2004WO2004019368A2 Reduced volume plasma reactor
03/04/2004WO2004019147A2 Method for processing data based on the data context
03/04/2004WO2004019135A1 Method for aligning a substrate on a stage
03/04/2004WO2004019134A1 Removing solution
03/04/2004WO2004019133A2 Method for forming a masking layer on a substrate
03/04/2004WO2004019132A1 Photosensitive composition for interlayer dielectric and method of forming patterned interlayer dielectric
03/04/2004WO2004019128A2 Projection optical system and method for photolithography and exposure apparatus and method using same
03/04/2004WO2004019123A1 Manufacture of electronic devices comprising thin-film circuit elements
03/04/2004WO2004019122A1 Thin film transistor array panel and liquid crystal display including the panel
03/04/2004WO2004019108A1 Device and method for inspecting an object
03/04/2004WO2004019079A2 Continuous direct-write optical lithography
03/04/2004WO2004019077A2 Structures and methods for reducing retardance
03/04/2004WO2004018743A1 Diboride single crystal substrate, semiconductor device using this and its manufacturing method
03/04/2004WO2004018719A1 Negative volume expansion lead-free electrical connection
03/04/2004WO2004018573A2 Method of coating a surface with an organic film
03/04/2004WO2004018353A1 Utilisation of waste gas streams
03/04/2004WO2004018348A2 Layer system comprising a silicon layer and a passivation layer, method for producing a passivation layer on a silicon layer and the use of said system and method
03/04/2004WO2004008486A3 Wafer bonding of thinned electronic materials and circuits to high performance substrates
03/04/2004WO2004006327A3 Transfer of a thin layer from a wafer comprising a buffer layer
03/04/2004WO2004006311A3 Transfer of a thin layer from a wafer comprising a buffer layer
03/04/2004WO2004006299A3 Method for dynamic sensor configuration and runtime execution
03/04/2004WO2004004927A8 Nanostructures and methods for manufacturing the same
03/04/2004WO2003107411A3 Porous dielectric films with a non-porous surface
03/04/2004WO2003105229A3 Resistor network such as a resistor ladder network and a method for manufacturing such a resistor network
03/04/2004WO2003105196A3 Method for controlling etch bias of carbon doped oxide films
03/04/2004WO2003105189A3 Strained-semiconductor-on-insulator device structures
03/04/2004WO2003101621A3 Application of a coating forming material onto at least one substrate
03/04/2004WO2003100837A3 Large substrate test system
03/04/2004WO2003098848A3 Method and apparatus for optimizing distributed multiplexed bus interconnects
03/04/2004WO2003096391A3 System and method for controlling wafer temperature
03/04/2004WO2003096122A3 Method for producing a unit comprising three-dimensional surface structuring and use of said method
03/04/2004WO2003090257B1 Method for the production of thin metal-containing layers having low electrical resistance
03/04/2004WO2003081712A3 Grating element for filtering wavelengths ≤ 100nm
03/04/2004WO2003075345A3 Raised extension structure for high performance cmos
03/04/2004WO2003074974A3 Evaluating a multi-layered structure for voids
03/04/2004WO2003072669A3 Polishing composition
03/04/2004WO2003069263A9 System for detecting anomalies and/or features of a surface
03/04/2004WO2003060995A3 Bonding device and method for production thereof
03/04/2004WO2003056918A3 Automated foot bath apparatus and method
03/04/2004WO2003054965A3 Non-volatile memory and method of forming thereof
03/04/2004WO2003054964A3 Monos device having buried metal silicide bit line
03/04/2004WO2003054921B1 Method for the production of iii-v laser components
03/04/2004WO2003052796A3 Automatic multi-channel etching system
03/04/2004WO2003050817A3 Segmented write line architecture
03/04/2004WO2003045840A3 Mesoporous materials and methods
03/04/2004WO2003043059A3 Advanced process control for immersion processing
03/04/2004WO2003036719A3 Micro- or nano-electronic component comprising a power source and means for protecting the power source
03/04/2004WO2003031912A3 Tuning fork gyroscope
03/04/2004WO2003012833A3 Process and apparatus for mounting semiconductor components to substrates and parts therefor
03/04/2004WO2003010823A3 Semiconductor structures, devices and method of fabrication
03/04/2004WO2003009382A3 Semiconductor structures with integrated control components
03/04/2004WO2003008157A9 Centering double side edge grip end effector with integrated mapping sensor
03/04/2004WO2003005412A3 Method and apparatus for production line screening