| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/04/2004 | US20040041101 Exposure apparatus |
| 03/04/2004 | US20040041095 Methods and apparatus for electron beam inspection of samples |
| 03/04/2004 | US20040041009 Flip-chip bonding structure and method for making the same |
| 03/04/2004 | US20040041008 Wire bonding method, wire bonding apparatus and wire bonding program |
| 03/04/2004 | US20040041004 Semiconductor processing apparatus including plasma-resistant, welded aluminum structures |
| 03/04/2004 | US20040041003 Ultrasonic bonding method and device |
| 03/04/2004 | US20040041000 Capillary for wire bonding and method of wire bonding using it |
| 03/04/2004 | US20040040939 Inductively coupled plasma generating apparatus incorporating double-layered coil antenna |
| 03/04/2004 | US20040040934 Method of etching a photoresist layer disposed on a semiconductor substrate |
| 03/04/2004 | US20040040933 Wafer processing apparatus and a wafer stage and a wafer processing method |
| 03/04/2004 | US20040040932 Method and apparatus for processing substrate and plate used therein |
| 03/04/2004 | US20040040931 Plasma processing method and plasma processor |
| 03/04/2004 | US20040040930 Method for determining etching process conditions and controlling etching process |
| 03/04/2004 | US20040040885 Silicon wafer tower with inclined support teeth |
| 03/04/2004 | US20040040884 Latching mechanism for locking/unlocking the door of a wafer container |
| 03/04/2004 | US20040040857 Forming a ultra-thin seed barrier layer; overcoating recess structures |
| 03/04/2004 | US20040040855 Bonding pads; integrated circuit dies; multilayers; electroconductive and dielectric layers |
| 03/04/2004 | US20040040852 Plating method |
| 03/04/2004 | US20040040823 Conveying apparatus for plate-form members |
| 03/04/2004 | US20040040743 Multilayer modules with flexible substrates |
| 03/04/2004 | US20040040742 Mounting board and electronic device using the same |
| 03/04/2004 | US20040040740 Electric element built-in module and method for manufacturing the same |
| 03/04/2004 | US20040040694 Detachable heat sink |
| 03/04/2004 | US20040040665 Electrostatic chuck device |
| 03/04/2004 | US20040040664 Cathode pedestal for a plasma etch reactor |
| 03/04/2004 | US20040040663 Plasma processing apparatus |
| 03/04/2004 | US20040040662 Plasma processing method and apparatus for etching nonvolatile material |
| 03/04/2004 | US20040040661 Load port capable of coping with different types of cassette containing substrates to be processed |
| 03/04/2004 | US20040040660 High pressure processing chamber for multiple semiconductor substrates |
| 03/04/2004 | US20040040659 Semiconductor processing apparatus with integrated weighing device |
| 03/04/2004 | US20040040658 Semiconductor fabricating apparatus and method and apparatus for determining state of semiconductor fabricating process |
| 03/04/2004 | US20040040657 Sample processing apparatus and sample processing system |
| 03/04/2004 | US20040040655 Substrate processing device and processing method |
| 03/04/2004 | US20040040632 Susceptor plate for high temperature heat treatment |
| 03/04/2004 | US20040040587 Substrate detecting apparatus |
| 03/04/2004 | US20040040584 Substrate processing apparatus and substrate processing method drying substrate |
| 03/04/2004 | US20040040583 Semiconductor wafers; vertical stacked modules; ozone generator |
| 03/04/2004 | US20040040582 Removal photoresist film by blowing ozone; concurrent heating, discharging |
| 03/04/2004 | US20040040576 Wafer cleaning brush |
| 03/04/2004 | US20040040575 Brush for cleaning/scrubbing a substrate |
| 03/04/2004 | US20040040510 Semiconductor wafer susceptor |
| 03/04/2004 | US20040040509 Apparatus and method for preventing etchant condensation on wafer in a cooling chamber |
| 03/04/2004 | US20040040508 Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling |
| 03/04/2004 | US20040040505 Delivery of liquid precursors to semiconductor processing reactors |
| 03/04/2004 | US20040040504 Manufacturing apparatus |
| 03/04/2004 | US20040040501 Systems and methods for forming zirconium and/or hafnium-containing layers |
| 03/04/2004 | US20040040499 Exhaust monitoring cup |
| 03/04/2004 | US20040040495 Nitrogen sources for molecular beam epitaxy |
| 03/04/2004 | US20040040494 Systems and methods for forming strontium- and/or barium-containing layers |
| 03/04/2004 | US20040040493 Reduction of dislocation pile-up formation during relaxed lattice-mismatched epitaxy |
| 03/04/2004 | US20040040492 Substrate and manufacturing method therefor |
| 03/04/2004 | US20040040491 Silicon single crystal wafer for particle monitor |
| 03/04/2004 | US20040040380 Scalable, automated metrology system and method of making the system |
| 03/04/2004 | US20040040217 Polishing composition |
| 03/04/2004 | US20040040177 Substrate processing apparatus and substrate processing method drying substrate by spraying gas |
| 03/04/2004 | US20040040146 Heat sink manufacturing apparatus |
| 03/04/2004 | US20040040131 Substrate processing apparatus and substrate processing method |
| 03/04/2004 | DE19900807B4 Schaftlager Stem Bearing |
| 03/04/2004 | DE19512776B4 Verfahren zum Bilden eines feinen Musters A method of forming a fine pattern |
| 03/04/2004 | DE10337050A1 Wortleitungsgatekontakt für ein MBIT-Transistorarraylayout Word line gate contact for a MBIT transistor array layout |
| 03/04/2004 | DE10335814A1 Gerät zur Herstellung einer integrierten Schaltungsvorrichtung An apparatus for manufacturing an integrated circuit device |
| 03/04/2004 | DE10322733A1 Halbleiterspeichervorrichtung mit stabil erzeugter interner Spannung A semiconductor memory device with stable internal voltage generated |
| 03/04/2004 | DE10317376A1 Layoutdatensicherungsverfahren, Layoutdatenumwandlungsvorrichtung und Graphikverifizierungsvorrichtung Layout backup process, layout, graphics and data conversion device verification apparatus |
| 03/04/2004 | DE10316835A1 Halbleiterbaugruppe Semiconductor package |
| 03/04/2004 | DE10313881A1 Halbleiterspeichervorrichtung A semiconductor memory device |
| 03/04/2004 | DE10309390A1 Halbleiterspeichervorrichtung A semiconductor memory device |
| 03/04/2004 | DE10307991A1 Magnetische Dünnfilmspeichervorrichtung zum Durchführen des Lesebetriebs nach einem selbstreferenzierenden Verfahren Thin film magnetic memory device to perform the read operation according to a self-referencing process |
| 03/04/2004 | DE10261429A1 FeRAM mit neuer Signalleitungsstruktur FeRAM with new signal line structure |
| 03/04/2004 | DE10250778B3 Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures |
| 03/04/2004 | DE10239548A1 Vorrichtung und Verfahren zur Inspektion eines Objekts Apparatus and method for inspecting an object |
| 03/04/2004 | DE10238444A1 Production of monolithic integrated semiconductor circuit comprises fixing wafer to rigid substrate after preparing component structures with front side surfaces, and further processing |
| 03/04/2004 | DE10238135A1 Production of group II oxide film for semiconductor, e.g. (opto)electronic device based on p-doped zinc oxide, uses one gas phase epitaxy chamber to grow buffer layer, using given oxygen precursor, and main layer at higher temperature |
| 03/04/2004 | DE10237787A1 Schichtsystem mit einer Siliziumschicht und einer Passivierschicht, Verfahren zur Erzeugung einer Passivierschicht auf einer Siliziumschicht und deren Verwendung Layer system having a silicon layer and a passivation layer, method for producing a passivating layer on a silicon layer and the use thereof |
| 03/04/2004 | DE10237249A1 Verfahren zum selektiven Abtragen von Material aus der Oberfläche eines Substrats, Maskierungsmaterial für einen Wafer und Wafer mit einem Maskierungsmaterial A method for selectively removing material from the surface of a substrate, the masking material for a wafer and the wafer with a masking material |
| 03/04/2004 | DE10237247A1 Semiconductor wafer made from silicon as base material used in the production of electronic components has specified luminosity and roughness |
| 03/04/2004 | DE10237149A1 Switching device for X-ray imaging sensor, has storage capacity electrodes connected to ground wire on lower protecting insulation layer for shielding underlying thin film transistor region |
| 03/04/2004 | DE10236890A1 Integrierte Schaltungsanordnungen, insbesondere Kondensatoranordnungen, und zugehörige Herstellungsverfahren Integrated circuits, in particular capacitor arrays, and associated manufacturing method |
| 03/04/2004 | DE10233208A1 Halbleiterbauelement mit Grabenisolierung sowie zugehöriges Herstellungsverfahren Semiconductor component with grave insulation and manufacturing method thereof |
| 03/04/2004 | DE10230373B3 Triple wafer stack bonding method e.g. for mass production of micromechanical sensors, uses first clamping device for securing 2 stacked wafers prior to aligment of third wafer held by second clamping device |
| 03/04/2004 | DE10225972B3 Verfahren zum Aufschleuderbeschichten einer dicken Keramikschicht mit einem Sol-Gel-Verfahren A method for spin coating a thick ceramic layer with a sol-gel process |
| 03/04/2004 | DE10034309B4 Vorrichtung für die Reduktion von durch die thermische Ausdehnung in einem Substrat verursachten Grenzflächenspannungen A device for the reduction of the thermal expansion in a substrate caused interfacial tensions |
| 03/04/2004 | DE10011005B4 Multichip module and method for producing a multichip module |
| 03/04/2004 | CA2496032A1 Nanocrystal electron device |
| 03/03/2004 | EP1395101A1 Method of manufacturing electronic part and electronic part obtained by the method |
| 03/03/2004 | EP1394911A2 Fabrication process of a semiconductor diffraction grating |
| 03/03/2004 | EP1394866A1 Method for manufacturing group-iii nitride compound semiconductor device |
| 03/03/2004 | EP1394865A1 Iii group nitride based semiconductor element and method for manufacture thereof |
| 03/03/2004 | EP1394863A2 Zn1-xMgxSySe1-y pin photodiode and avalanche photodiode on P-GaAs substrate |
| 03/03/2004 | EP1394861A2 Double polysilicon bipolar transistor and method of manufacture therefor |
| 03/03/2004 | EP1394859A2 Display with suppression of leakage current in image acquisition |
| 03/03/2004 | EP1394856A2 Surface-mounted electronic component module and method for manufacturing the same |
| 03/03/2004 | EP1394853A2 Semiconductor memory device and method for manufacturing semiconductor device |
| 03/03/2004 | EP1394852A2 Semiconductor device and method of fabricating the same |
| 03/03/2004 | EP1394851A2 Semiconductor chip and fabrication method thereof |
| 03/03/2004 | EP1394850A1 Precision substrate storage container and retaining member therefor |
| 03/03/2004 | EP1394849A1 Cluster tool and method for controlling transport |
| 03/03/2004 | EP1394848A2 Etch process and etch stop layer for manufacturing of semiconductor wafers |
| 03/03/2004 | EP1394846A2 Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame |
| 03/03/2004 | EP1394845A2 Method for making an electric circuit including a polishing step |
| 03/03/2004 | EP1394844A1 Method of fabricating semiconductor device |