| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/24/2004 | US6696338 Method for forming ruthenium storage node of semiconductor device |
| 02/24/2004 | US6696337 Multilayer connecting conductor in edge circuit zones |
| 02/24/2004 | US6696336 Double sided container process used during the manufacture of a semiconductor device |
| 02/24/2004 | US6696335 Method for forming a diffusion region |
| 02/24/2004 | US6696334 Method for formation of a differential offset spacer |
| 02/24/2004 | US6696333 Method of making integrated circuit with MOSFETs having bi-layer metal gate electrodes |
| 02/24/2004 | US6696332 Bilayer deposition to avoid unwanted interfacial reactions during high K gate dielectric processing |
| 02/24/2004 | US6696331 Method of protecting a stacked gate structure during fabrication |
| 02/24/2004 | US6696329 Method of manufacturing semiconductor device |
| 02/24/2004 | US6696328 CMOS gate electrode using selective growth and a fabrication method thereof |
| 02/24/2004 | US6696327 Method for making a semiconductor device having a high-k gate dielectric |
| 02/24/2004 | US6696326 Cleaning method to prevent watermarks |
| 02/24/2004 | US6696325 Method of transferring a thin film device onto a plastic sheet and method of forming a flexible liquid crystal display |
| 02/24/2004 | US6696324 Contact structures of wirings and methods for manufacturing the same, and thin film transistor array panels including the same and methods for manufacturing the same |
| 02/24/2004 | US6696323 Method of manufacturing semiconductor device having trench filled up with gate electrode |
| 02/24/2004 | US6696319 Providing a semiconductor device; providing a switching device; forming the electrical contact devices; applying attachment element to surfaces; pressing flexible contact elements onto the contact areas, and securely connecting |
| 02/24/2004 | US6696318 Methods for forming a die package |
| 02/24/2004 | US6696317 Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin |
| 02/24/2004 | US6696315 Semiconductor device configuration with cavities of submicrometer dimensions and method of fabricating structured cavities |
| 02/24/2004 | US6696313 Preparing substrate; growing a superlattice strained layer by alternately depositing two semiconductor materials having different lattice constant by a predetermined cycle; forming a quantum-dot active layer including quantum dots |
| 02/24/2004 | US6696312 Robust electrode patterning in OLED devices |
| 02/24/2004 | US6696309 Methods for making electrooptical device and driving substrate therefor |
| 02/24/2004 | US6696306 Methods of fabricating layered structure and semiconductor device |
| 02/24/2004 | US6696305 Metal post manufacturing method |
| 02/24/2004 | US6696228 Use of ethylene carbonate and/or propylene carbonate treatment using ozone, for the stripping and removal of resist films |
| 02/24/2004 | US6696224 Forming layer to be etched over semiconductor substrate, forming imaging layer over layer to be etched, removing selected regions of imaging layer to leave pattern of openings extending partially into imaging layer, etching |
| 02/24/2004 | US6696222 Having a conductive structure and a low-k dielectric layer covering the conductive structure. |
| 02/24/2004 | US6696220 Template for room temperature, low pressure micro-and nano-imprint lithography |
| 02/24/2004 | US6696219 Positive resist laminate |
| 02/24/2004 | US6696218 Resin which has a polymerization unit derived from p-hydroxystyrene and a polymerization unit having a group unstable against acid, and a dialkanesulfonate of isopropylidenedicyclohexanol |
| 02/24/2004 | US6696217 Acrylated ester polymer |
| 02/24/2004 | US6696216 Thiophene-containing photo acid generators for photolithography |
| 02/24/2004 | US6696139 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring board |
| 02/24/2004 | US6696108 Placing article to be processed in reaction container and simultaneously supplying at least two high-frequency powers having mutually different frequencies to the same high frequency electrode to generate plasma in reaction container |
| 02/24/2004 | US6696103 Aluminium nitride ceramics and method for preparing the same |
| 02/24/2004 | US6696034 Method for producing hydrophobic silica fine powder |
| 02/24/2004 | US6696006 Mold for flashless injection molding to encapsulate an integrated circuit chip |
| 02/24/2004 | US6695962 Used to deposit, polish, or electro-polish metal films on a substrate, or to remove such metal films from such a substrate |
| 02/24/2004 | US6695957 Simultaneous electrical and fluid connection for anode |
| 02/24/2004 | US6695955 Method of forming polycrystalline silicon for liquid crystal display device |
| 02/24/2004 | US6695954 If a film consisting of only the sputtered material is to be formed on a substrate, then the gas within the chamber is nonreactive, on the other hand, a nitride or oxide film formed by chemical reaction of target and reactive gas |
| 02/24/2004 | US6695947 Device for manufacturing semiconductor device and method of manufacturing the same |
| 02/24/2004 | US6695946 Cooling system |
| 02/24/2004 | US6695926 Treatment method of semiconductor wafers and the like and treatment system for the same |
| 02/24/2004 | US6695925 Immersion in aqueous solution containing 12% hydrogen peroxide (h2o2), sodium and potassium ions; immersing in water tank; immersing in isopropyl alcohol; drying with heated nitrogen gas |
| 02/24/2004 | US6695922 Film forming unit |
| 02/24/2004 | US6695921 Hoop support for semiconductor wafer |
| 02/24/2004 | US6695914 System for processing a workpiece |
| 02/24/2004 | US6695903 Screen-printable masking paste comprising: one or more silanes, solvents, an acid and water, and one or more additives |
| 02/24/2004 | US6695886 Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of RTP tool |
| 02/24/2004 | US6695687 Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate |
| 02/24/2004 | US6695684 Chemical mechanical polishing apparatus having a cleaner for cleaning a conditioning disc and method of conditioning a polishing pad of the apparatus |
| 02/24/2004 | US6695683 Semiconductor device washing apparatus and a method of washing a semiconductor device |
| 02/24/2004 | US6695682 Polishing method and polishing apparatus |
| 02/24/2004 | US6695681 Endpoint detection system for wafer polishing |
| 02/24/2004 | US6695680 Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same |
| 02/24/2004 | US6695572 Method and apparatus for minimizing semiconductor wafer contamination |
| 02/24/2004 | US6695546 Single drive aligner elevation apparatus for an integrated circuit handler |
| 02/24/2004 | US6695200 Bumps made with adhesive film instead of gold plating |
| 02/24/2004 | US6695042 Adjustable pedestal thermal interface |
| 02/24/2004 | US6695032 Method and apparatus for forming cover tape of tape feeder |
| 02/24/2004 | US6695030 Apparatus for permitting transfer of organic material from a donor web to form a layer in an OLED device |
| 02/24/2004 | US6695003 Gas isolation box |
| 02/24/2004 | US6694809 Flow controller |
| 02/24/2004 | US6694792 Substrate treatment process |
| 02/24/2004 | US6694707 Apparatus and method for populating transport tapes |
| 02/24/2004 | US6694613 Method for producing a printed-circuit board having projection electrodes |
| 02/24/2004 | US6694608 Part mounter |
| 02/24/2004 | CA2314922C Device for producing excited/ionized particles in a plasma |
| 02/19/2004 | WO2004016063A1 Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board |
| 02/19/2004 | WO2004016055A1 An electronic product, a body and a method of manufacturing |
| 02/19/2004 | WO2004015854A2 Monolithic, software-definable circuit including a power amplifier |
| 02/19/2004 | WO2004015791A2 Magnetoresistant device and magnetic memory device further comme nts |
| 02/19/2004 | WO2004015782A1 Insulated gate field effect transistor having passivated schottky barriers to the channel |
| 02/19/2004 | WO2004015781A1 Method for manufacturing compound semiconductor wafer and compound semiconductor device |
| 02/19/2004 | WO2004015780A1 Field effect transistor |
| 02/19/2004 | WO2004015776A2 Electrostatic discharge protection circuitry and method of operation |
| 02/19/2004 | WO2004015771A2 Semiconductor device and method of manufacturing the same |
| 02/19/2004 | WO2004015770A1 Multi-layer circuit carrier and production thereof |
| 02/19/2004 | WO2004015766A1 Method of fabricating a heat exchanger for regulating the temperature of multiple integrated circuit modules |
| 02/19/2004 | WO2004015764A2 Vertical system integration |
| 02/19/2004 | WO2004015763A1 Wafer rotation device and edge flaw inspection apparatus having the device |
| 02/19/2004 | WO2004015760A1 Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
| 02/19/2004 | WO2004015759A2 A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine |
| 02/19/2004 | WO2004015758A1 Semiconductor device and method for manufacturing the same |
| 02/19/2004 | WO2004015757A1 Method and apparatus for completely or partly covering at least one electronic component with a compound |
| 02/19/2004 | WO2004015756A1 Submount and semiconductor device |
| 02/19/2004 | WO2004015755A1 Method for fabricating a self-aligned bipolar transistor and related structure |
| 02/19/2004 | WO2004015754A2 Method for oxidation of a layer and corresponding holder device for a substrate |
| 02/19/2004 | WO2004015753A1 Laser machinining |
| 02/19/2004 | WO2004015752A1 Method and apparatus for polishing wafer |
| 02/19/2004 | WO2004015750A1 Heat treatment method and heat treatment apparatus |
| 02/19/2004 | WO2004015749A1 Strain compensated semiconductor structures and methods of fabricating strain compensated semiconductor structures |
| 02/19/2004 | WO2004015747A1 Processing device for wafers and method for processing thereof |
| 02/19/2004 | WO2004015745A2 A dmos device with a programmable threshold voltage |
| 02/19/2004 | WO2004015742A2 High rate deposition in a batch reactor |
| 02/19/2004 | WO2004015741A2 Notch-free etching of high aspect soi structures using alternating deposition and etching and pulsed plasma |
| 02/19/2004 | WO2004015737A1 Symmetric beamline and methods for generating a mass-analyzed ribbon ion beam |
| 02/19/2004 | WO2004015736A2 Low loss rf bias electrode for a plasma reactor with enhanced wafer edge rf coupling and highly efficient wafer cooling |
| 02/19/2004 | WO2004015732A1 Method and apparatus for bootstrapping a programmable antifuse circuit |