| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/26/2004 | DE10301586B3 IC has separate supply voltage networks for different circuit stages coupled together via transistor coupling circuit |
| 02/26/2004 | DE10252049A1 Slurry for chemical/mechanical polishing of wafer, contains metal oxide abrasive particles, removal rate accelerator, anionic polymeric passivation agent, anionic passivation agent having one to twelve carbon, and water |
| 02/26/2004 | DE10247002B3 Multi-chambered continuous coating apparatus has several separate processing chambers with adjoining walls and easily replaceable circumferential seals between wall and support faces of sealing insert |
| 02/26/2004 | DE10239773B3 Cleaning a semiconductor wafer comprises treating the wafer under megasound with an aqueous solution containing ozone, and treating the wafer with an aqueous solution containing hydrofluoric acid and hydrochloric acid |
| 02/26/2004 | DE10237141A1 Strahlführungssystem, Abbildungsverfahren und Elektronenmikroskopiesystem Beam guidance system, imaging techniques and electron microscopy system |
| 02/26/2004 | DE10236678A1 Memory cell for dynamic random access memory comprises semiconductor substrate including island having top portion and sidewall portion(s), capacitor contiguous with sidewall portion, and transistor on top portion of island |
| 02/26/2004 | DE10236456A1 Retaining device for use in the manufacture of optical data disks, while they are subjected processing in a vacuum, comprises a fluid filled chamber that expands under the vacuum to ensure the disk is firmly retained |
| 02/26/2004 | DE10236422A1 Verfahren zur Charakterisierung einer Beleuchtungsquelle in einem Belichtungsgerät A method of characterizing an illumination source in an exposure apparatus |
| 02/26/2004 | DE10236239A1 Koordinaten-Messtisch Coordinate measuring table |
| 02/26/2004 | DE10236150A1 Method for forming opening in semiconductor substrate layer for manufacture of calibration standard for scanning microscopy, micromechanical sensor or other components |
| 02/26/2004 | DE10235981A1 Teilchenoptische Vorrichtung und Elektronenmikroskop A particle-optical and electron microscope |
| 02/26/2004 | DE10235771A1 Encapsulated chip and production process for smart labels has baseplate with conductive surrounding layer and cover plate with conductive surfaces |
| 02/26/2004 | DE10235072A1 EEPROM structure, has an additional gate or substrate capacitor on each cell |
| 02/26/2004 | DE10234931A1 Production of a gate electrode of a MOST comprises determining the height of a metal silicide layer formed in a crystalline layer, selecting a design height for the metal silicide layer, and further processing |
| 02/26/2004 | DE10234488A1 Stark dotierte Elektrode für einen Feldeffekttransistor und ein Verfahren zur Herstellung derselben Heavily doped electrode for a field effect transistor and a method of manufacturing the same |
| 02/26/2004 | DE10218381A1 Verfahren zur Herstellung einer oder mehrerer einkristalliner Schichten mit jeweils unterschiedlicher Gitterstruktur in einer Ebene einer Schichtenfolge A process for preparing one or more single-crystal layers each having a different lattice structure in a plane of a layer sequence |
| 02/26/2004 | DE10114861B4 Verfahren und Vorrichtung zum Entlacken eines Bereiches auf einem Maskensubstrat Method and apparatus for stripping paint an area on a mask substrate |
| 02/26/2004 | DE10107125B4 Verfahren zum Ausbilden von Kontaktlöchern in einer integrierten Schaltungsvorrichtung durch selektives Ätzen einer Isolationsschicht, um die zu einem Halbleiterbereich benachbarte selbstausrichtende Kontaktfläche zu vergrößern, und dadurch ausgebildeter Kontakt in einer integrierten Schaltungsvorrichtung A process for forming vias in an integrated circuit device by selectively etching an insulating layer, to enlarge the neighboring semiconductor region self-aligned to a contact surface, and thereby contact formed in an integrated circuit device |
| 02/26/2004 | DE10061248B4 Verfahren und Vorrichtung zur In-situ-Dekontamination eines EUV-Lithographiegerätes Method and apparatus for in situ decontamination of an EUV lithography device |
| 02/26/2004 | CA2465363A1 Electrolytic copper plating solutions |
| 02/26/2004 | CA2435675A1 On-p-gaas substrate zn1-xmgxsyse1-y pin photodiode and on-p-gaas substrate zn1-xmgxsyse1-yavalanche photodiode |
| 02/25/2004 | EP1392093A1 Method for manufacturing ceramic multilayered board |
| 02/25/2004 | EP1392091A2 Method and system for printing integrated circuit patterns |
| 02/25/2004 | EP1392089A1 Printed circuit board with self align bonding pads thereon |
| 02/25/2004 | EP1391946A2 Apparatus for permitting transfer of organic material from a donor web to form a layer in an oled device |
| 02/25/2004 | EP1391944A2 Solid state lighting using compressed fluid coatings |
| 02/25/2004 | EP1391942A1 Tunnel magnetoresistance element |
| 02/25/2004 | EP1391941A1 Production method for light emitting element absract: |
| 02/25/2004 | EP1391939A1 Method for manufacturing channel gate type field effect transistor |
| 02/25/2004 | EP1391938A2 Heterojunction bipolar transistor (hbt) having improved emitter-base grading structure |
| 02/25/2004 | EP1391937A2 Method for improving a semiconductor substrate having SiGe film and semiconductor device manufactured by using this method |
| 02/25/2004 | EP1391931A1 Soi substrate |
| 02/25/2004 | EP1391930A1 A method of forming a sharp tip on a floating gate in an asymmetrical non-volatile memory device using small in-situ doped polysilicon spacers |
| 02/25/2004 | EP1391929A2 Semiconductor device and manufacturing method for the same |
| 02/25/2004 | EP1391928A2 Chip assembly with at least two semiconductor chips and method of controlling the alignment of two adjacent semiconductor chips |
| 02/25/2004 | EP1391926A1 Heat sink and its manufacturing method |
| 02/25/2004 | EP1391925A2 Method of self-aligning a damascene gate structure to isolation regions |
| 02/25/2004 | EP1391924A1 Semiconductor device and its manufacturing method, circuit board, and electric apparatus |
| 02/25/2004 | EP1391923A1 Semiconductor device and its manufacturing method, circuit board and electronic apparatus |
| 02/25/2004 | EP1391922A2 Semiconductor device mounting method, semiconductor device mounting structure, electro optical device, electro-optical device manufacturing method and electronic device |
| 02/25/2004 | EP1391921A1 METHOD FOR PREPARING NITROGEN−DOPED AND ANNEALED WAFER AND NITROGEN−DOPED AND ANNEALED WAFER |
| 02/25/2004 | EP1391920A2 Method of fabricating an active matrix, optoelectronic visualisation devices and mask for such devices |
| 02/25/2004 | EP1391919A1 Ceramic heater for semiconductor manufactring/inspecting apparatus |
| 02/25/2004 | EP1391911A1 Microwave plasma generator |
| 02/25/2004 | EP1391894A2 Magnetic memory array and its read/write method |
| 02/25/2004 | EP1391844A2 Automatic recognition of an optically periodic structure in an integrated circuit design |
| 02/25/2004 | EP1391786A1 Chuck, lithographic apparatus and device manufacturing method |
| 02/25/2004 | EP1391785A1 Particle barrier for use in a lithographic projection apparatus |
| 02/25/2004 | EP1391738A2 Probe card |
| 02/25/2004 | EP1391540A2 Methods and apparatus for improved current density and feature fill control in ECD reactors |
| 02/25/2004 | EP1391491A1 Method of forming thick silica-based film |
| 02/25/2004 | EP1391470A1 Process for preparing polymer compound for resist |
| 02/25/2004 | EP1391429A1 Bismuth titanium silicon oxide, bismuth titanium silicon oxide thin film, and method for forming the thin film |
| 02/25/2004 | EP1391261A1 Lead-based solder alloys containing copper |
| 02/25/2004 | EP1391140A1 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
| 02/25/2004 | EP1390988A2 Method for producing optically transparent regions in a silicon substrate |
| 02/25/2004 | EP1390987A2 Method for structuring an oxide layer applied to a substrate material |
| 02/25/2004 | EP1390986A2 Integrated tunable capacitor |
| 02/25/2004 | EP1390984A1 Floating gate memory device using composite molecular material |
| 02/25/2004 | EP1390983A1 Group-iii nitride based high electron mobility transistor (hemt) with barrier/spacer layer |
| 02/25/2004 | EP1390981A2 Bitline contacts in a memory cell array |
| 02/25/2004 | EP1390978A2 Semiconductor memory device and method for the production thereof |
| 02/25/2004 | EP1390977A2 Method for fabricating vertical transistor trench capacitor dram cells |
| 02/25/2004 | EP1390976A1 Layered hard mask and dielectric materials and methods therefor |
| 02/25/2004 | EP1390975A2 Flexure based translation stage |
| 02/25/2004 | EP1390974A2 Arrangement and method for detecting defects on a substrate in a processing tool |
| 02/25/2004 | EP1390973A1 A method concerning a junction barrier schottky diode, such a diode and use thereof |
| 02/25/2004 | EP1390972A2 Method of fabicating low-dielectric constant interlevel dielectric films for beol interconnects with enhanced adhesion and low-defect density |
| 02/25/2004 | EP1390971A1 Method for removing polysilane from a semiconductor without stripping |
| 02/25/2004 | EP1390970A1 Masking technique for producing semiconductor components, in particular a buried heterostructure (bh) laser diode |
| 02/25/2004 | EP1390969A2 Device for heating substrates with side screens and/or secondary reflectors |
| 02/25/2004 | EP1390968A1 Smooth multipart substrate support member for cvd |
| 02/25/2004 | EP1390967A2 Method of sealing wafer backside for full-face electrochemical plating |
| 02/25/2004 | EP1390964A1 Dipole ion source |
| 02/25/2004 | EP1390955A2 Laser plasma from metals and nano-size particles |
| 02/25/2004 | EP1390850A2 Emulator with switching network connections |
| 02/25/2004 | EP1390820A2 Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer |
| 02/25/2004 | EP1390813A2 Microlithograpic projection illumination system, optical system, method for the production of a microlithographic projection lens system and microlithographic structuring method |
| 02/25/2004 | EP1390783A2 Lens system consisting of fluoride crystal lenses |
| 02/25/2004 | EP1390765A1 Method for manufacturing a silicon sensor and a silicon sensor |
| 02/25/2004 | EP1390692A1 Periodic patterns and technique to control misalignment |
| 02/25/2004 | EP1390690A2 Cyclic error reduction in average interferometric position measurements |
| 02/25/2004 | EP1390558A1 Penning discharge plasma source |
| 02/25/2004 | EP1390552A1 Nickel-titanium sputter target alloy |
| 02/25/2004 | EP1390309A1 Method for producing titania-doped fused silica extreme ultraviolet lithography substrates glass |
| 02/25/2004 | EP1390176A1 Integrated endpoint detection system with optical and eddy current monitoring |
| 02/25/2004 | EP1390174A1 Apparatus and method for controlling temperature uniformity of substrates |
| 02/25/2004 | EP1390134A2 Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| 02/25/2004 | EP1235953B1 Mini batch furnace |
| 02/25/2004 | EP0913001B1 Multi-layer film capacitor structures and method |
| 02/25/2004 | EP0865670B1 Semiconductor device with special emitter connection |
| 02/25/2004 | EP0840942B1 GaAs SUBSTRATE WITH COMPOSITIONALLY GRADED AlGaAsSb BUFFER FOR FABRICATION OF HIGH-INDIUM FETS |
| 02/25/2004 | EP0802234B1 Silicone die attach adhesive and method for fabrication of semiconductor devices |
| 02/25/2004 | CN2604212Y Toy gyro game unit |
| 02/25/2004 | CN1478309A Field effect transistors and materials and methods for their manufacture |
| 02/25/2004 | CN1478306A Light-emitting device and its manufacturing method and visible-light-emitting device |
| 02/25/2004 | CN1478303A Self-aligned non-volatile memory cell |
| 02/25/2004 | CN1478302A Silicon carbide power MOSFETS having shorting channel and methods of fabrication them |
| 02/25/2004 | CN1478301A Substrate with semiconductor layer, electronic component, electronic circuit, printable composition and method for production thereof |
| 02/25/2004 | CN1478300A Information memory device and electrionic apparatus with mounted information memory device |