Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2004
03/04/2004WO2003003413A3 Growing copper vias or lines within a patterned resist using a copper seed layer
03/04/2004WO2002102920A8 A silica and a silica-based slurry
03/04/2004WO2002089191A3 Improvement of titanium disilicide resistance in narrow active regions of semiconductor devices
03/04/2004WO2002075341A8 Semiconductor device and its test method
03/04/2004WO2002053320A9 Wafer support for chemical mechanical planarization
03/04/2004WO2002050922A9 Gate electrode with depletion suppression and tunable workfunction
03/04/2004WO2002049805A8 Polishing platen with pressurized membrane
03/04/2004WO2002023582A9 Faraday system for ion implanters
03/04/2004WO2001097261A3 Plate capacitor in an insulating trench
03/04/2004US20040044981 Reticle fabrication method
03/04/2004US20040044978 Pattern generation on a semiconductor surface
03/04/2004US20040044974 Extracting wiring parasitics for filtered interconnections in an integrated circuit
03/04/2004US20040044969 Functional block design method and apparatus
03/04/2004US20040044968 Semiconductor integrated circuits
03/04/2004US20040044967 Semiconductor intellectual property transmission system
03/04/2004US20040044936 Systems and methods for facilitating testing of pads of integrated circuits
03/04/2004US20040044511 Circuit simulation method
03/04/2004US20040044484 Method and apparatus for analyzing defect information
03/04/2004US20040044435 Method and system for handling substrates in a production line including a cluster tool and a metrology tool
03/04/2004US20040044419 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
03/04/2004US20040044163 Single source mixtures of metal siloxides
03/04/2004US20040043734 Semiconductor device
03/04/2004US20040043721 Gas removal method, gas removal system and plasma processing apparatus
03/04/2004US20040043713 Polishing machine
03/04/2004US20040043709 Process for machining a wafer-like workpiece
03/04/2004US20040043707 Method of polishing semiconductor wafer
03/04/2004US20040043705 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
03/04/2004US20040043702 Chemical-mechanical polishing slurry for polishing metal films
03/04/2004US20040043676 Suppression of leakage current in image acquisition
03/04/2004US20040043675 Multi-component integrated circuit contacts
03/04/2004US20040043656 Test structure
03/04/2004US20040043648 Electrical connector having a cored contact assembly
03/04/2004US20040043639 Method and apparatus for transferring heat from a substrate to a chuck
03/04/2004US20040043638 Semiconductor memory device and method for manufacturing semiconductor device
03/04/2004US20040043637 Method of forming silicon nitride deposited film
03/04/2004US20040043636 Systems and methods for forming tantalum oxide layers and tantalum precursor compounds
03/04/2004US20040043635 Systems and methods for forming metal oxides using metal diketonates and/or ketoimines
03/04/2004US20040043634 Systems and methods for forming metal-doped alumina
03/04/2004US20040043633 Systems and methods for forming refractory metal oxide layers
03/04/2004US20040043632 Systems and methods for forming metal oxides using alcohols
03/04/2004US20040043631 Method and apparatus for treating a semi-conductor substrate
03/04/2004US20040043630 Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides
03/04/2004US20040043629 Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
03/04/2004US20040043628 Method of forming an oxide film
03/04/2004US20040043627 Method of forming a low leakage dielectric layer providing an increased capacitive coupling
03/04/2004US20040043626 Method of forming a film on a semiconductor substrate
03/04/2004US20040043625 Systems and methods for forming metal oxides using metal compounds containing aminosilane ligands
03/04/2004US20040043624 Method of high selectivity wet etching of salicides
03/04/2004US20040043623 Method for fabricating a gate structure of a field effect transistor
03/04/2004US20040043622 Method for preventing hole and electron movement in NROM devices
03/04/2004US20040043621 Method and apparatus for endpoint detection in electron beam assisted etching
03/04/2004US20040043620 Method for removing residue from a magneto-resistive random access memory (MRAM) film stack using a dual mask
03/04/2004US20040043619 Method for forming conductive material in opening and structures regarding same
03/04/2004US20040043618 Method for endpoint detection during etch
03/04/2004US20040043617 Partitioned wafer boat for constant wafer backside emmissivity
03/04/2004US20040043616 Method for processing a semiconductor wafer including back side grinding
03/04/2004US20040043615 Manufacturing method of a semiconductor substrate provided with a through hole electrode
03/04/2004US20040043614 Semiconductor chip and fabrication method thereof
03/04/2004US20040043613 Cerium-based abrasive, production process thereof
03/04/2004US20040043612 Etching method in a semiconductor processing and etching system for performing the same
03/04/2004US20040043611 Method of reducing a defect level after chemically mechanically polishing a copper-containing substrate by rinsing the substrate with an oxidizing solution
03/04/2004US20040043610 Compositions for removal of processing byproducts and method for using same
03/04/2004US20040043609 Method of fabricating semiconductor device
03/04/2004US20040043608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof
03/04/2004US20040043607 Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures
03/04/2004US20040043606 System and method for optimized laser annealing smoothing mask
03/04/2004US20040043605 Method of reducing oxidation of metal structures using ion implantation, and device formed by such method
03/04/2004US20040043604 Systems and methods for forming refractory metal nitride layers using disilazanes
03/04/2004US20040043602 Semiconductor device and method for manufacturing the same
03/04/2004US20040043601 Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer
03/04/2004US20040043600 Systems and methods for forming refractory metal nitride layers using organic amines
03/04/2004US20040043599 Method for manufacturing thin-film multilayer electronic component and thin-film multilayer electronic component
03/04/2004US20040043598 Method for creating a damascene interconnect using a two-step electroplating process
03/04/2004US20040043597 Method of etching insulating film and method of forming interconnection layer
03/04/2004US20040043596 Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method
03/04/2004US20040043595 Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes
03/04/2004US20040043594 Semiconductor device having a polysilicon line structure with increased metal silicide portions and method for forming the polysilicon line structure of a semiconductor device
03/04/2004US20040043593 Method for fabricating semiconductor device
03/04/2004US20040043592 Method of forming a gate contact in a semiconductor device
03/04/2004US20040043591 Design layout method for metal lines of an integrated circuit
03/04/2004US20040043590 Method for semiconductor gate line dimension reduction
03/04/2004US20040043589 Method for fabricating source/drain devices
03/04/2004US20040043588 Method for fabricating n-type carbon nanotube device
03/04/2004US20040043587 Angled implant in a fabrication technique to improve conductivity of a base material
03/04/2004US20040043586 Sacrificial deposition layer as screening material for implants into a wafer during the manufacture of a semiconductor device
03/04/2004US20040043584 Semiconductor device and method of making same
03/04/2004US20040043583 Method of forming nanocrystals in a memory device
03/04/2004US20040043582 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
03/04/2004US20040043581 Methods for filling shallow trench isolations having high aspect ratios
03/04/2004US20040043580 Protection in integrated circuits
03/04/2004US20040043578 Platinum stuffed with silicon oxide as a diffusion oxygen barrier for semiconductor devices
03/04/2004US20040043577 Silicon nanocrystal capacitor and process for forming same
03/04/2004US20040043576 Method of fabricating a bipolar transistor using selective epitaxially grown SiGe base layer
03/04/2004US20040043575 High temperature drop-off of a substrate
03/04/2004US20040043574 Protruding spacers for self-aligned contacts
03/04/2004US20040043573 Reverse metal process for creating a metal silicide transistor gate structure
03/04/2004US20040043572 Semiconductor device manufacturing method
03/04/2004US20040043570 Semiconductor device and process for producing the same
03/04/2004US20040043569 Atomic layer deposited HfSiON dielectric films
03/04/2004US20040043568 Electrostatic discharge protection device and method of manufacturing the same