| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/19/2004 | US20040031979 Strained-semiconductor-on-insulator device structures |
| 02/19/2004 | US20040031972 Stacked packages |
| 02/19/2004 | US20040031970 Process for retarding lateral diffusion of phosphorous |
| 02/19/2004 | US20040031968 Method for dense pixel fabrication and product thereof |
| 02/19/2004 | US20040031963 Conductive thin film for semiconductor device, semiconductor device, and method of manufacturing the same |
| 02/19/2004 | US20040031962 Display unit and method of fabricating the same |
| 02/19/2004 | US20040031961 Thin-film transistor |
| 02/19/2004 | US20040031960 Test key and method for validating the position of a word line overlaying a trench capacitor in DRAMS |
| 02/19/2004 | US20040031956 Heterogeneous bandgap structures for semiconductor devices and manufacturing methods therefor |
| 02/19/2004 | US20040031936 Fine stencil structure correction device |
| 02/19/2004 | US20040031932 Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| 02/19/2004 | US20040031853 Smart card having memory using a breakdown phenomena in an ultra-thin dielectric |
| 02/19/2004 | US20040031784 Hot plate unit |
| 02/19/2004 | US20040031783 Hot plate unit |
| 02/19/2004 | US20040031779 Method and system for calibrating a laser processing system and laser marking system utilizing same |
| 02/19/2004 | US20040031772 Preventing gate oxice thinning effect in a recess LOCOS process |
| 02/19/2004 | US20040031768 Magazine, tray component feeding device, and component mounting device |
| 02/19/2004 | US20040031699 Monitoring and analyzing signals generated by high energy current density in semiconductor substrates using computer programs, to prevent damage |
| 02/19/2004 | US20040031693 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus |
| 02/19/2004 | US20040031690 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| 02/19/2004 | US20040031680 One or more shields for use in a sputter reactor |
| 02/19/2004 | US20040031677 Vapor deposition of nitride layers on substrates, by feeding gases into vacuum chambers containing sputtering targets and coils, then applying power; nitriding |
| 02/19/2004 | US20040031621 Packaged microelectronic component assemblies |
| 02/19/2004 | US20040031570 Apparatus for bonding a chip using an insulating adhesive tape |
| 02/19/2004 | US20040031565 Gas distribution plate for processing chamber |
| 02/19/2004 | US20040031564 Alumina, zirconium silicate, feldspar, pottery stone, siliceous limestone, kaolin, gairome clay (Japan), and black soil; compressed into blocks, dehydrated; storing thermal energy after being roasted for a short time, releasing the energy to produce progressive temperature rise; skin rehabilitation |
| 02/19/2004 | US20040031520 Scoring the coating of a first coated base material at a temperature sufficiently high to part the coating and melt at least a portion of the first base material |
| 02/19/2004 | US20040031503 Substrate treatment apparatus and substrate treatment method |
| 02/19/2004 | US20040031476 Group encapsulated dicing chuck |
| 02/19/2004 | US20040031441 High-pressure treatment apparatus and high-pressure treatment method |
| 02/19/2004 | US20040031440 Forming thin films of silicon oxide on silicon wafers, by heating in furnaces having gas flow passageways, then purging with inert gases to remove impurities; oxidation |
| 02/19/2004 | US20040031340 Process condition sensing wafer and data analysis system |
| 02/19/2004 | US20040031338 Chamber wafer detection |
| 02/19/2004 | US20040031206 >/= 95% of total rare earth oxides (TREO) and has < 3% of fluorine; particle size distribution determined by a laser diffraction method is within a predetermined range |
| 02/19/2004 | US20040031168 Method and apparatus for drying substrate |
| 02/19/2004 | US20040031167 Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife |
| 02/19/2004 | US20040031145 Method for forming metal contacts on a substrate |
| 02/19/2004 | US20040031136 Method and apparatus for manufacturing electronic parts |
| 02/19/2004 | US20040031135 Semiconductor manufacturing apparatus control system |
| 02/19/2004 | DE20318211U1 Automated system to spray electronic components with protective lacquer with components fed from magazine |
| 02/19/2004 | DE20220258U1 Production of a semiconductor component used in the production of substrate-less luminescent diodes comprises separating a semiconductor layer from a substrate by irradiating with a laser beam having a plateau-shaped spatial beam profile |
| 02/19/2004 | DE20215401U1 Verbund aus einem Dünnstsubsrat und einem Trägersubstrat mit lösbarem Verbindungsmittel Composite of a Dünnstsubsrat and a carrier substrate with releasable connecting means |
| 02/19/2004 | DE19956354B4 Verfahren zum Ausgleich von nicht rotationssymmetrischen Abbildungsfehlern in einem optischen System A method for compensating for non-rotationally symmetric aberrations in an optical system |
| 02/19/2004 | DE19906815B4 Flüssigkristallanzeige und Verfahren zur Herstellung derselben Liquid crystal display and method of manufacturing the same |
| 02/19/2004 | DE19903200B4 Verfahren zum Korrigieren des Maskenlayouts bei der Herstellung von Strukturen auf der Oberfläche eines Halbleiterwafers A method of correcting the mask layout in the manufacture of structures on the surface of a semiconductor wafer |
| 02/19/2004 | DE19804971B4 Analyseverfahren für wasserlösliche Verunreinigungen in einer Reinraumatmosphäre bei der Herstellung von Halbleiterbauelementen und Vorrichtung zur Durchführung dieses Verfahrens Analysis method for water soluble contaminants in a clean room atmosphere in the manufacture of semiconductor devices and apparatus for carrying out this method |
| 02/19/2004 | DE19781558B4 Schaltungskomponente für ein IC-Gehäuse und Verfahren zu deren Herstellung Circuit component for an IC package and process for their preparation |
| 02/19/2004 | DE19736204B4 Dünnschichttransistor, Flüssigkristallanzeige mit Dünnschichttransistor und Herstellungsverfahren dafür Thin film transistor liquid crystal display with thin film transistor and manufacturing method thereof |
| 02/19/2004 | DE19510318B4 Verfahren und Vorrichtung zur Herstellung epitaktischer Schichten Method and apparatus for producing epitaxial layers |
| 02/19/2004 | DE10330490A1 Metal-insulator-metal integrated circuit capacitor for integrated circuit devices, comprises pair of capacitors on integrated circuit substrate that are electrically connected in antiparallel |
| 02/19/2004 | DE10237084A1 Electrically conductive frame with a semiconductor light diode, to illuminate a mobile telephone keypad, has a layered structure with the electrical connections and an encapsulated diode chip in very small dimensions |
| 02/19/2004 | DE10236626A1 Selective movement device for component holders in circuit board assembly device, uses activation of electromagnet for coupling each holder for movement with stroke element |
| 02/19/2004 | DE10236493A1 Alternative dry cleaning medium with diverse applications, contains carbon dioxide and nitrous oxide in fifty-fifty proportions |
| 02/19/2004 | DE10236491A1 Alternative dry cleaning medium with diverse applications, contains carbon dioxide and nitrous oxide in fifty-fifty proportions |
| 02/19/2004 | DE10236485A1 Alternative dry cleaning medium with diverse applications, contains carbon dioxide and nitrous oxide in fifty-fifty proportions |
| 02/19/2004 | DE10235372A1 Electrical component, especially micromechanical silicon chip, has layer transparency enabling welding with laser beam with power density in joining plane increased to melt layers by absorption |
| 02/19/2004 | DE10235332A1 Multiple layer switch support used in flip-chip technology comprises a semiconductor chip and/or a discrete component, a rewiring layer, an insulating layer with through-structures, and outer contact surfaces |
| 02/19/2004 | DE10233760A1 Halbleiter-Schaltungsstruktur sowie Verfahren zur Herstellung einer Halbleiter-Schaltungsstruktur Semiconductor circuit structure and method for fabricating a semiconductor circuit structure |
| 02/19/2004 | DE10233663A1 Production of a SOI substrate comprises preparing a SOI substrate by embedding a trenched oxide layer between a crystalline silicon layer and a silicon substrate |
| 02/19/2004 | DE10233190A1 Monitoring of process object property deviation from desired property, involves interrupting process on detection of phase deviation until deviation identifier of other phase is provided to monitoring program |
| 02/19/2004 | DE10231964A1 Halbleiterbauelement mit stressaufnehmender Halbleiterschicht sowie zugehöriges Herstellungsverfahren Semiconductor component with stress-absorbing semiconductor layer and manufacturing method thereof |
| 02/19/2004 | DE10231407A1 Bipolartransistor Bipolar transistor |
| 02/19/2004 | DE10213577B3 Verfahren zum simultanen Laserstrahllöten A method for simultaneous laser brazing |
| 02/19/2004 | DE10206687B4 Vorrichtung und Verfahren zur lichtinduzierten chemischen Behandlung eines Werkstücks Apparatus and method for light-induced chemical treatment of a workpiece |
| 02/18/2004 | EP1389897A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo |
| 02/18/2004 | EP1389800A2 Method for removal of residue from a film stack using a sacrificial mask layer |
| 02/18/2004 | EP1389799A1 Method for production of a layered structure with nanocrystals in a dielectric layer |
| 02/18/2004 | EP1389798A1 Capacitor element and production thereof |
| 02/18/2004 | EP1389797A2 Particle-optical apparatus, electron microscopy system and electron lithography system |
| 02/18/2004 | EP1389794A2 Beam guiding system, imaging method, and system for electron microscopy |
| 02/18/2004 | EP1389780A2 Semiconductor integrated circuit device |
| 02/18/2004 | EP1389746A2 Process solutions containing surfactants |
| 02/18/2004 | EP1389745A1 Acetylenic diol surfactant solutions and methods of using same |
| 02/18/2004 | EP1389505A2 Polishing apparatus |
| 02/18/2004 | EP1389496A1 Method for cleaning surface of substrate |
| 02/18/2004 | EP1389407A1 Method for producing a contact substrate, and corresponding contact substrate |
| 02/18/2004 | EP1389348A2 Structure and method to preserve sti during etching |
| 02/18/2004 | EP1389347A1 Method for contacting an electrical component with a substrate comprising a conducting structure |
| 02/18/2004 | EP1389346A2 Dispensing process for fabrication of microelectronic packages |
| 02/18/2004 | EP1389345A1 Chip scale package with flip chip interconnect |
| 02/18/2004 | EP1389335A1 Device and method for using complementary bits in a memory array |
| 02/18/2004 | EP1389315A2 Hierarchical built-in self-test for system-on-chip design |
| 02/18/2004 | EP1389158A1 Dual laser cutting of wafers |
| 02/18/2004 | EP1190006B1 Slurry composition and method of chemical mechanical polishing using same |
| 02/18/2004 | EP1100630B1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 02/18/2004 | EP1084482B1 Method for producing an integrated circuit card and card produced according to said method |
| 02/18/2004 | EP1050074B1 Anisotropic etching of organic-containing insulating layers |
| 02/18/2004 | EP1018167B1 THE METHOD OF FABRICATION OF SEMICONDUCTING COMPOUNDS OF NITRIDES AIII-BV OF p- AND n-TYPE ELECTRIC CONDUCTIVITY |
| 02/18/2004 | EP0895655B1 Device for treating substrates in a fluid container |
| 02/18/2004 | EP0853345B1 METHOD FOR FORMING CdTe FILM |
| 02/18/2004 | EP0768676B1 A semiconductor memory with sequential clocked access codes for test mode entry |
| 02/18/2004 | CN2603952Y Ferric oxide photo-etching mask printing plate |
| 02/18/2004 | CN1476742A Magazine, tray component feeding device, and component mounting device |
| 02/18/2004 | CN1476670A Surface acoustic wave device, its mfg. method, and electronic circuit device |
| 02/18/2004 | CN1476640A Light-emitting device and its mfg. method |
| 02/18/2004 | CN1476639A Semiconductor device and its mfg. method |
| 02/18/2004 | CN1476638A Semiconductor device and apparatus for communication system |
| 02/18/2004 | CN1476637A Fabrication of semiconductor devices |
| 02/18/2004 | CN1476636A Molecule component |
| 02/18/2004 | CN1476635A Integrated circuit configuration that is protected agaist analysis, and method for producing configuration |