Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2013
12/05/2013US20130320443 Deep Silicon Via As A Drain Sinker In Integrated Vertical DMOS Transistor
12/05/2013US20130320442 Transistor device and method for manufacturing the same
12/05/2013US20130320438 Semiconductor device and method for manufacturing the same
12/05/2013US20130320437 Power MOSFET and Methods for Forming the Same
12/05/2013US20130320436 Semiconductor device and method for fabricating the same
12/05/2013US20130320435 Trench Power MOSFET
12/05/2013US20130320433 Vertical channel transistor with self-aligned gate electrode and method for fabricating the same
12/05/2013US20130320431 Vertical Power MOSFET and Methods for Forming the Same
12/05/2013US20130320430 Vertical Power MOSFET and Methods of Forming the Same
12/05/2013US20130320429 Processes and structures for dopant profile control in epitaxial trench fill
12/05/2013US20130320427 Gated circuit structure with self-aligned tunneling region
12/05/2013US20130320424 Semiconductor device and method of manufacturing the same
12/05/2013US20130320423 Wrap-around fin for contacting a capacitor strap of a dram
12/05/2013US20130320422 Finfet contacting a conductive strap structure of a dram
12/05/2013US20130320418 Self-Aligned Implantation Process for Forming Junction Isolation Regions
12/05/2013US20130320413 Semiconductor structure and method for forming the same
12/05/2013US20130320412 Isolated insulating gate structure
12/05/2013US20130320411 Borderless contacts for metal gates through selective cap deposition
12/05/2013US20130320410 Metal gate electrode of a semiconductor device
12/05/2013US20130320409 Source and drain architecture in an active region of a p-channel transistor by tilted implantation
12/05/2013US20130320408 Semiconductor structure and fabricating method thereof
12/05/2013US20130320404 Gallium nitride to silicon direct wafer bonding
12/05/2013US20130320402 pHEMT HBT INTEGRATED EPITAXIAL STRUCTURE AND A FABRICATION METHOD THEREOF
12/05/2013US20130320399 Embedded planar source/drain stressors for a finfet including a plurality of fins
12/05/2013US20130320398 Latch-up robust scr-based devices
12/05/2013US20130320397 Fully Isolated LIGBT and Methods for Forming the Same
12/05/2013US20130320376 Frame holder
12/05/2013US20130320358 Semiconductor device and a method of manufacturing the same
12/05/2013US20130320352 Ohmic Contact to Semiconductor Layer
12/05/2013US20130320350 Compound Semiconductor Transistor with Self Aligned Gate
12/05/2013US20130320349 In-situ barrier oxidation techniques and configurations
12/05/2013US20130320345 Method of forming an active pattern, display substrate formed by the same, and method of manufacturing the display substrate
12/05/2013US20130320342 Ultra-large grain polycrystalline semiconductors through top-down aluminum induced crystallization (taic)
12/05/2013US20130320341 Three dimensional memory structure
12/05/2013US20130320340 Circuit technique to electrically characterize block mask shifts
12/05/2013US20130320336 Oxide Semiconductor Sputtering Target, Method Of Manufacturing Thin-Film Transistors Using The Same, And Thin Film Transistor Manufactured Using The Same
12/05/2013US20130320335 Semiconductor device and method for manufacturing the same
12/05/2013US20130320327 Thin film transistor and method of forming the same
12/05/2013US20130320098 Wireless integrated circuit device and method of manufacturing the same
12/05/2013US20130319907 Wafer container with door guide and seal
12/05/2013US20130319744 Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe
12/05/2013US20130319614 High lateral to vertical ratio etch process for device manufacturing
12/05/2013US20130319613 Cut-very-last dual-epi flow
12/05/2013US20130319612 Plasma chamber having an upper electrode having controllable valves and a method of using the same
12/05/2013US20130319484 Substrate treating apparatus and substrate treating method
12/05/2013US20130319476 Liquid treatment apparatus and liquid treatment method
12/05/2013US20130319457 Apparatus and method for cleaning substrate
12/05/2013US20130319332 Housing and substrate processing apparatus including the same
12/05/2013US20130319330 Liquid feeding device and resist developing device
12/05/2013US20130319329 Plasma-activated deposition of conformal films
12/05/2013US20130319290 Organoaminodisilane precursors and methods for depositing films comprising same
12/05/2013US20130319129 Mold compound compatibility test system and methods thereof
12/05/2013DE112012000510T5 FET mit verspanntem Kanal mit Source/Drain-Puffern FET with strained channel with source / drain buffers
12/05/2013DE112007002213B4 Symmetrischer bipolarer Flächentransistor und Verfahren zur Herstellung Balanced bipolar junction transistor and methods for making
12/05/2013DE102013209685A1 Source- und Drainarchitektur in einem aktiven Gebiet eines P-Kanaltransistors durch schräge Implantation Source and drain architecture in an active region of a P-channel transistor by oblique implantation
12/05/2013DE102013208318A1 Vorrichtungen auf Thyristorbasis, die widerstandsfähig gegen den Latch-Up-Effekt sind Thyristor-based devices that are resistant to the Latchup
12/05/2013DE102013105763A1 Halbleitervorrichtung und verfahren zum herstellen einer halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
12/05/2013DE102013105714A1 Monolithisch integrierter HEMT und Stromschutzvorrichtung Monolithically integrated HEMT and overcurrent protection device
12/05/2013DE102013105713A1 Verbindungshalbleitertransistor mit selbstanordnendem Gate Compound semiconductor transistor with gate selbstanordnendem
12/05/2013DE102013105635A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
12/05/2013DE102013105567A1 Halbleitervorrichtung mit Trenchstrukturen A semiconductor device with trench structures
12/05/2013DE102013105470A1 Elektrostatisches Chuck-System und Verfahren The electrostatic chuck system and method
12/05/2013DE102013103581A1 Semiconductor device i.e. semiconductor chip, has under bump metallization layer in electrical contact with contact pad, and passivation film arranged between contact pad and under bump metallization layer
12/05/2013DE102013008456A1 In-situ Sperren-Oxidationstechniken und -gestaltungen In-situ oxidation barrier techniques and designs
12/05/2013DE102012221025A1 Halbleitereinrichtung und Herstellungsverfahren derselben A semiconductor device and manufacturing method thereof
12/05/2013DE102012209325A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module
12/05/2013DE102012209278A1 Suszeptor Susceptor
12/05/2013DE102012209270A1 Method for manufacturing circuit arrangement with vertical cavity surface emitting laser arrays, involves applying wafer element on substrate arrangement, and separating wafer element after application for obtaining semiconductor components
12/05/2013DE102012209034A1 Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul Electronics module and to methods for producing such electronics module, as well as electronic control device with such a electronics module
12/05/2013DE102012109921A1 Vertikaler Leistungs-MOSFET und Verfahren zu dessen Herstellung Vertical power MOSFET and method of manufacturing the
12/05/2013DE102012104882A1 Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Leiterrahmenverbund und optoelektronisches Halbleiterbauteil A process for the production of optoelectronic semiconductor components, lead frame and optoelectronic composite semiconductor device
12/05/2013DE102012104844A1 System for monitoring and control of photoactive components,has test system that is provided with optical measuring device, monitoring and evaluation system and adjustable diaphragm
12/05/2013DE102012103571B4 Halbleiterstruktur mit Silicium-Durchkontaktierung und verringerter Elektromigration sowie Verfahren zur Herstellung einer solchen Semiconductor structure having silicon-via and reduced electromigration as well as methods for producing such
12/05/2013DE102012011014A1 Method for monitoring thermal coupling of LEDs and/or LED components at cooling surfaces in industrial production area, involves monitoring measuring process by multifunction digital/analog card and/or multi-channel measuring card
12/05/2013DE102012010940A1 Device for wet treatment of substrates e.g. silicon wafer, has support elements on which substrate support is pointed up and down, such that substrates are in parallel state at constant, limiting distance force
12/05/2013DE102007022338B4 Herstellungsverfahren für ein Leistungshalbleiterbauelement mit Metallkontaktschicht Manufacturing method for a power semiconductor component with a metal contact layer
12/05/2013DE102006004826B4 Metall- und Cyanid-Ionen-freie Ätzlösung zur nasschemischen Strukturierung von Metallschichten in der Halbleiterindustrie und deren Verwendung in einem Ätzverfahren Metal and cyanide ion-free etching solution for wet-chemical structuring of metal layers in the semiconductor industry, and their use in an etching method
12/05/2013DE10043600B4 Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf einem oder mehreren, insbesondere ebenfalls kristallinen Substraten Device for depositing in particular crystalline layers on one or more, in particular likewise crystalline substrates
12/04/2013EP2669963A2 Wafer-level light emitting diode package and method for manufacturing thereof
12/04/2013EP2669951A1 Method for producing semiconductor device, and semiconductor device
12/04/2013EP2669939A1 Fabrication process of an integrated circuit having trench isolations with different depths
12/04/2013EP2669938A2 Semiconductor device with an oxide solder flow prevention area on a substrate and corresponding manufacturing method
12/04/2013EP2669937A1 METHOD FOR MANUFACTURING Sn ALLOY BUMP
12/04/2013EP2669936A1 Discrete semiconductor device package and manufacturing method
12/04/2013EP2669935A2 Packaging substrate having interposer
12/04/2013EP2669934A1 Semiconductor device
12/04/2013EP2669933A1 Gallium nitride-based semiconductor device and method for producing semiconductor device
12/04/2013EP2669932A1 Method for manufacturing a transistor comprising semiconductor nanoscale patterns using block copolymers
12/04/2013EP2669931A1 Driving system and driving method, light exposure device and light exposure method, and driving system designing method
12/04/2013EP2669929A1 High-performance ion source and method for generating an ion beam
12/04/2013EP2669737A1 Composition for forming resist underlayer films, containing silicon that bears diketone-structure-containing organic group
12/04/2013EP2669411A1 Silicon melt contacting member and process for production thereof, and process for production of crystalline silicon
12/04/2013EP2669344A1 Adhesive composition and semiconductor device using same
12/04/2013EP2669215A1 Welded liner
12/04/2013EP2669214A1 Storage system with a blow molded collapsible liner
12/04/2013EP2669213A1 Liner-based storage system
12/04/2013EP2668664A1 Integrated circuit comprising an electrical through-plating and method for producing an electrical through-plating
12/04/2013EP2668663A1 Thermal diffusion chamber
12/04/2013EP2668662A2 Semiconductor device and method for growing semiconductor crystal
12/04/2013EP2668661A1 Method for the permanent bonding of wafers
1 ... 406 407 408 409 410 411 412 413 414 415 416 417 418 419 420 421 422 423 424 425 426 ... 6590