H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/02/2004	US6811157 Metallic gasket for vacuum device and method of producing thereof
11/02/2004	US6811040 Wafer holding apparatus
11/02/2004	US6811029 Wafer support attachment for a semi-conductor wafer transport container
11/02/2004	US6811028 Packing apparatus for plasma display panel module
11/02/2004	US6810888 Reduced pressure created by fluid on upper surface of rotary disk, discharged outwardly by centrifugal force due to rotation of disk, allows treatment of wafer and recovery of liquid; separate recovery paths for multiple liquid treatments
11/02/2004	US6810887 Method for cleaning semiconductor fabrication equipment parts
11/02/2004	US6810814 Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus
11/02/2004	US6810797 Method of resin-sealing electronic parts, and stencil printing plate used therefor
11/02/2004	US6810580 System for forming conductor wire on a substrate board
11/02/2004	US6810548 Cleaning apparatus
11/01/2004	CA2463645A1 Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction
10/2004
10/28/2004	WO2004093515A1 Device for working and/or machining semiconductor chips or components and a transfer and reversing module
10/28/2004	WO2004093274A1 Method of manufacturing semiconductor device
10/28/2004	WO2004093238A1 Integrated passive devices fabricated utilizing multi-layer, organic laminates
10/28/2004	WO2004093201A1 Compound semiconductor wafer and process for producing the same
10/28/2004	WO2004093199A1 Ballistic semiconductor device
10/28/2004	WO2004093198A1 Methods to form metal lines using selective electrochemical deposition
10/28/2004	WO2004093197A2 Method for forming structures in finfet devices
10/28/2004	WO2004093193A1 Method for fabricating semiconductor device
10/28/2004	WO2004093192A1 Semiconductor device and its manufacturing method
10/28/2004	WO2004093190A2 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components
10/28/2004	WO2004093189A1 Helical microelectronic contact and method for fabricating same
10/28/2004	WO2004093186A1 Metal-base circuit board and its manufacturing method
10/28/2004	WO2004093185A2 Electrical interconnect structures for integrated circuits and methods of manufacturing the same
10/28/2004	WO2004093184A1 Semiconductor device and method of manufacturing the device
10/28/2004	WO2004093182A1 Process for forming dual metal gate structures
10/28/2004	WO2004093181A1 Method for forming a gate in a finfet device and thinning a fin in a channel region of the finfet device
10/28/2004	WO2004093180A1 Flexible carbon-based ohmic contacts for organic transistors
10/28/2004	WO2004093179A1 Method for forming high dielectric film
10/28/2004	WO2004093177A1 Polishing pad and method for producing same
10/28/2004	WO2004093176A1 Method for plasma etching using periodic modulation of gas chemistry
10/28/2004	WO2004093175A1 Hydrogen plasma downflow processing method and hydrogen plasma downflow processing apparatus
10/28/2004	WO2004093174A1 Laser processing apparatus and laser processing method
10/28/2004	WO2004093173A1 Susceptor and vapor growth device
10/28/2004	WO2004093172A1 Resist stripping method and device
10/28/2004	WO2004093171A1 Pattern forming apparatus and pattern forming method
10/28/2004	WO2004093170A1 Developing method and developing device
10/28/2004	WO2004093169A1 Process for fabrication of a ferrocapacitor
10/28/2004	WO2004093168A1 A process for fabrication of ferroelectric devices with reduced hydrogen ion damage
10/28/2004	WO2004093167A2 Substrate support having temperature controlled surface
10/28/2004	WO2004093166A2 Chamber and associated methods for wafer processing
10/28/2004	WO2004093165A2 A method and apparatus for process control in time division multiplexed tdm etch processes
10/28/2004	WO2004093162A2 Silicon substrate comprising positive etching profiles with a defined slope angle, and production method
10/28/2004	WO2004093161A1 Device and method for thermal treatment
10/28/2004	WO2004093157A2 Diffusion bonding method for microchannel plates
10/28/2004	WO2004093152A2 Carrier with ultraphobic surfaces
10/28/2004	WO2004093151A2 Tray carrier with ultraphobic surfaces
10/28/2004	WO2004093150A2 Method for treating semiconductor processing components and components formed thereby
10/28/2004	WO2004093147A2 Wafer carrier cleaning system
10/28/2004	WO2004093145A2 Voltage tunable photodefinable dielectric and method of manufacture therefore
10/28/2004	WO2004093142A2 Light emitting device methods
10/28/2004	WO2004093128A2 Lead frame structure with aperture or groove for flip chip in a leaded molded package
10/28/2004	WO2004093100A2 Method for producing soldering globules on an electrical component
10/28/2004	WO2004093084A2 Mram architecture and a method and system for fabricating mram memories utilizing the architecture
10/28/2004	WO2004092865A2 Selection method, exposure method, selection device, exposure device, and device manufacturing method
10/28/2004	WO2004092831A2 Photoresists and methods for use thereof
10/28/2004	WO2004092816A1 Liquid crystal display
10/28/2004	WO2004092623A2 Fluid handling component with ultraphobic surfaces
10/28/2004	WO2004092566A2 Metal seal packaging for organic light emitting diode device
10/28/2004	WO2004092453A2 METHOD FOR GROWING SINGLE CRYSTAL GaN ON SILICON
10/28/2004	WO2004092442A1 Electrochemical method for the direct nanostructured deposition of material onto a substrate, and semiconductor component produced according to said method
10/28/2004	WO2004092441A2 Methods for producing silicon nitride films by vapor-phase growth
10/28/2004	WO2004092252A1 Organic siloxane resins and insulating film using the same
10/28/2004	WO2004092238A1 Resin for under-layer material, under-layer material, laminate and method for forming resist pattern
10/28/2004	WO2004092103A1 Polyphenol compounds, esterified quinone diazides, and positive photoresist compositions
10/28/2004	WO2004092075A1 Anti-biofilm forming structure and method of manufacturing the same
10/28/2004	WO2004091838A2 Method of soldering or brazing articles having surfaces that are difficult to bond
10/28/2004	WO2004091834A1 Electronic component and its fabrication by selective laser sintering
10/28/2004	WO2004091808A2 Ultraphobic surface for high pressure liquids
10/28/2004	WO2004091792A2 Microfluidic device with ultraphobic surfaces
10/28/2004	WO2004082015A8 Electrostatic chuck for wafer metrology and inspection equipment
10/28/2004	WO2004081994A9 Substrate support lift mechanism
10/28/2004	WO2004079824A3 Charge-trapping memory arrays
10/28/2004	WO2004077569A3 Integrated semiconductor circuit comprising a transistor and a strip conductor
10/28/2004	WO2004075249A3 Buffer structure for modifying a silicon substrate
10/28/2004	WO2004073032A3 Integrally formed bake plate unit for use in wafer fabrication system
10/28/2004	WO2004070788A3 Method for depositing a low dielectric constant film
10/28/2004	WO2004068578A3 Method for producing bit lines for ucp flash memories
10/28/2004	WO2004066397A3 Rugged fred and fabrication
10/28/2004	WO2004064172A3 An enhancement mode metal-oxide-semiconductor field effect transistor and method for forming the same
10/28/2004	WO2004032236A3 Method and apparatus to fabricate an on-chip decoupling capacitor
10/28/2004	WO2004019128A3 Projection optical system and method for photolithography and exposure apparatus and method using same
10/28/2004	WO2004010512A3 Heteroatom-containing diamondoid transistors
10/28/2004	WO2004006291A3 Patterning method
10/28/2004	WO2004002955A3 Photosensitive compositions
10/28/2004	WO2003096378A3 Display driver ic, display module and electrical device incorporating a graphics engine
10/28/2004	WO2003087771A3 Method for making a molecularly smooth surface
10/28/2004	WO2002001610A3 Apparatus and method for electro chemical deposition
10/28/2004	US20040216081 Application-specific testing methods for programmable logic devices
10/28/2004	US20040216074 Structures and methods for selectively applying a well bias to portions of a programmable device
10/28/2004	US20040216069 Method of designing low-power semiconductor integrated circuit
10/28/2004	US20040216067 Method of determining arrangement of wire in semiconductor intergrated circuit
10/28/2004	US20040216065 Convergence technique for model-based optical and process correction
10/28/2004	US20040216021 Semiconductor apparatus
10/28/2004	US20040215418 Wafer shape evaluating method, wafer, and wafer selecting method
10/28/2004	US20040215417 Method of inkless wafer blind assembly
10/28/2004	US20040215410 System and method for fingerprinting of semiconductor processing tools
10/28/2004	US20040215405 Mold transfer pressure measurement and inline control
10/28/2004	US20040215365 Processing system
10/28/2004	US20040215350 Attachment of RFID modules to antennas

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