Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/09/2004US6815279 Manufacturing method of CMOS devices
11/09/2004US6815278 Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations
11/09/2004US6815277 Method for fabricating multiple-plane FinFET CMOS
11/09/2004US6815275 Methods for fabricating metal silicide structures using an etch stopping capping layer
11/09/2004US6815274 Resist protect oxide structure of sub-micron salicide process
11/09/2004US6815273 Method of manufacturing semiconductor devices
11/09/2004US6815272 Bottom gate-type thin-film transistor and method for manufacturing the same
11/09/2004US6815271 Semiconductor display devices and applications
11/09/2004US6815270 Thin film transistor formed by an etching process with high anisotropy
11/09/2004US6815269 Thin-film transistor and method for manufacturing the same
11/09/2004US6815268 Method for forming a gate in a FinFET device
11/09/2004US6815267 Thin film transistor with multiple gates using metal induced lateral crystallization and method of fabricating the same
11/09/2004US6815266 Method for manufacturing sidewall contacts for a chalcogenide memory device
11/09/2004US6815265 Method of fabricating a semiconductor device with a passivation film
11/09/2004US6815262 Apparatus and method for attaching an integrated circuit sensor to a substrate
11/09/2004US6815261 Encapsulation method in a molding machine for an electronic device
11/09/2004US6815260 Method of making semiconductor device
11/09/2004US6815259 Method of supporting a flexible substrate and method of manufacturing a semiconductor device
11/09/2004US6815258 Flip-chip package with underfill having low density filler
11/09/2004US6815257 Chip scale package and method of fabricating the same
11/09/2004US6815255 Semiconductor device and manufacturing method thereof
11/09/2004US6815254 Semiconductor package with multiple sides having package contacts
11/09/2004US6815253 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
11/09/2004US6815252 Method of forming flip chip interconnection structure
11/09/2004US6815250 Method for manufacturing infrared detector using diffusion of hydrogen plasma
11/09/2004US6815249 Surface-mount device and method for manufacturing the surface-mount device
11/09/2004US6815248 Material combinations for tunnel junction cap layer, tunnel junction hard mask and tunnel junction stack seed layer in MRAM processing
11/09/2004US6815247 Thin-film opto-electronic device and a method of making it
11/09/2004US6815246 Surface modification of silicon nitride for thick film silver metallization of solar cell
11/09/2004US6815242 Semiconductor device and method of manufacturing the same
11/09/2004US6815241 GaN structures having low dislocation density and methods of manufacture
11/09/2004US6815240 Thin film semiconductor device and manufacturing method thereof
11/09/2004US6815238 Method of manufacturing field emission device
11/09/2004US6815237 Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step
11/09/2004US6815236 Method of measuring a concentration of a material and method of measuring a concentration of a dopant of a semiconductor device
11/09/2004US6815235 Methods of controlling formation of metal silicide regions, and system for performing same
11/09/2004US6815234 Reducing stress in integrated circuits
11/09/2004US6815233 Method of simultaneous display of die and wafer characterization in integrated circuit technology development
11/09/2004US6815232 Method and apparatus for overlay control using multiple targets
11/09/2004US6815231 Method of testing and manufacturing nonvolatile semiconductor memory
11/09/2004US6815229 In situ monitoring of sheet resistivity of silicides during rapid thermal annealing using electrical methods
11/09/2004US6815228 Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method
11/09/2004US6815227 Method of fabricating a ferroelectric memory device
11/09/2004US6815226 Ferroelectric memory device and method of forming the same
11/09/2004US6815225 Method for forming capacitor of nonvolatile semiconductor memory device
11/09/2004US6815224 Low-temperature processing of a ferroelectric strontium bismuth tantalate layer, and fabrication of ferroelectric components using the layer
11/09/2004US6815223 Low thermal budget fabrication of ferroelectric memory using RTP
11/09/2004US6815222 Method for protecting capacitive elements during production of a semiconductor device
11/09/2004US6815221 Method for manufacturing capacitor of semiconductor memory device controlling thermal budget
11/09/2004US6815220 Magnetic layer processing
11/09/2004US6815219 Fabrication method and structure for ferroelectric nonvolatile memory field effect transistor
11/09/2004US6815218 Methods for manufacturing bioelectronic devices
11/09/2004US6815162 Passivation of porous semiconductors
11/09/2004US6815150 Photoresist stripping composition and process for stripping resist
11/09/2004US6815148 Prevents dimensional errors caused by the difference in the resist film thickness, which is ascribed to a level-difference portion of an underlying layer.
11/09/2004US6815146 Fluoropolymer with monomers formed by cyclopolymerization of a fluorinated diene and polymerization of an acrylic monomer and an acid-generating compound
11/09/2004US6815145 Photoresists useful in micro-lithography; for pattern formation on semiconductor wafers
11/09/2004US6815142 Pre-baking; forming film resist overlaying layer containing water soluble acid and photo base generator; exposure to light beams; after-baking and development; dimensional uniformity; rectangular patterns
11/09/2004US6815140 Positive resist composition
11/09/2004US6815110 Fuel cell and power chip technology
11/09/2004US6815077 Low temperature, low-resistivity heavily doped p-type polysilicon deposition
11/09/2004US6815073 Use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass to enhance the reliability of the electrical connection of a silver-based conductor film
11/09/2004US6815046 Method of producing ceramic multilayer substrate
11/09/2004US6815002 Method for dispensing liquid crystal using plurality of liquid crystal dispensing devices
11/09/2004US6814917 Alumina sintered body and process for producing the same
11/09/2004US6814893 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
11/09/2004US6814879 Coating method using a solution containing a solvent which is incapable of dissolving the first resist.
11/09/2004US6814839 Interference layer system
11/09/2004US6814838 Induction coil generates treatment plasma in discharge chamber located in interior of coil; with slotted screen; semiconductors
11/09/2004US6814835 Apparatus and method for supplying chemicals in chemical mechanical polishing systems
11/09/2004US6814833 Providing termination groups selected from identical-with si-oh, identical-with si-(oh)2, -si-(oh)3, and -o-si-(oh)3, and combinations thereof on the opposing surfaces and placing the opposing surfaces in contact
11/09/2004US6814832 Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance
11/09/2004US6814812 Double acting cold trap
11/09/2004US6814811 Semiconductor wafer and vapor phase growth apparatus
11/09/2004US6814809 Temperature adjuster used before exposure provides uniform temperature over many substrates to be transferred to the exposing apparatus for less thermal effects to exposing processing, for high yields; photolithography
11/09/2004US6814808 Carrier for semiconductor wafers
11/09/2004US6814801 Method for producing semi-insulating resistivity in high purity silicon carbide crystals
11/09/2004US6814778 Mapping defects using raster scan and blanking system; rapidly and accurately making repairs
11/09/2004US6814767 Polishing composition
11/09/2004US6814766 Polishing composition and polishing method employing it
11/09/2004US6814582 Rear interconnect blade for rack mounted systems
11/09/2004US6814572 Heat treating method and heat treating device
11/09/2004US6814507 Substrate treating apparatus
11/09/2004US6814296 Integrated circuit and associated design method with antenna error control using spare gates
11/09/2004US6814274 Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method
11/09/2004US6814239 High-purity standard particle production apparatus, method and particles
11/09/2004US6814121 Bonding apparatus
11/09/2004US6814087 Accelerated plasma clean
11/09/2004US6813828 Method for deconstructing an integrated circuit package using lapping
11/09/2004US6813804 Apparatus and method for cleaning probe card contacts
11/09/2004CA2356465C Thermoelectric material and method of manufacturing the same
11/09/2004CA2351430C Wavelength-insensitive radiation coupling for multi-quantum well sensor based on intersubband absorption
11/04/2004WO2004095662A2 Bandgap engineering
11/04/2004WO2004095644A1 Durable electronic assembly with conductive adhesive
11/04/2004WO2004095603A2 Method of producing membrane electrode assemblies
11/04/2004WO2004095600A2 Deposition of permanent polymer structures for oled fabrication
11/04/2004WO2004095585A1 Nonvolatile semiconductor storage device and method for manufacturing nonvolatile semiconductor storage device
11/04/2004WO2004095584A1 Bipolar transistor and method for the production thereof
11/04/2004WO2004095583A2 Radiation-hardened transistor fabricated by modified cmos process
11/04/2004WO2004095582A1 A high density mim capacitor with reduced voltage dependence in semiconductor dies