Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/21/2004US20040209415 Semiconductor device employing a method for forming a pattern using a crystal structure of a crystalline material
10/21/2004US20040209414 Two position anneal chamber
10/21/2004US20040209412 Manufacturing method for field-effect transistor
10/21/2004US20040209411 Enhanced transistor gate using e-beam radiation
10/21/2004US20040209410 Beam irradiation apparatus, beam irradiation method, and method for manufacturing thin film transistor
10/21/2004US20040209409 Manufacturing method for semiconductor device
10/21/2004US20040209408 Method of forming a thin film transistor on a transparent plate
10/21/2004US20040209407 Thin film transistor array gate electrode for liquid crystal display device
10/21/2004US20040209406 Methods of selectively bumping integrated circuit substrates and related structures
10/21/2004US20040209403 One-component hot setting epoxy resin composition and semiconductor mounting underfill material
10/21/2004US20040209402 Method for making Group III nitride devices and devices produced thereby
10/21/2004US20040209401 Arrangement structure applying to sawing a package panel
10/21/2004US20040209400 Process and apparatus for packaging a tape substrate
10/21/2004US20040209399 Electronic parts packaging structure and method of manufacturing the same
10/21/2004US20040209398 Semiconductor package, method of manufacturing the same, and semiconductor device
10/21/2004US20040209395 Method of plating metal layer over isolated pads on semiconductor package substrate
10/21/2004US20040209391 Method of integrating the fabrication process for integrated circuits and mem devices
10/21/2004US20040209390 III group nitride based semiconductor element and method for manufacture thereof
10/21/2004US20040209389 Manufacturing method for liquid crystal display panels having high aperture ratio
10/21/2004US20040209388 Organic thin film transistor array substrate and method of producing the same
10/21/2004US20040209387 Method for making a package structure with a cavity
10/21/2004US20040209386 Semiconductor laser light source with photocurrent feedback control for single mode operation
10/21/2004US20040209385 Method for making carbon nanotube-based field emission device
10/21/2004US20040209384 Low temperature chemical vapor deposition process for forming bismuth-containing ceramic thin films useful in ferroelectric memory devices
10/21/2004US20040209355 Systems and devices for photoelectrophoretic transport and hybridization of oligonucleotides
10/21/2004US20040209201 development of photoresist coatings on wafers, cleaning the developer solutions, then transferring the wafer to the electron beam radiation unit before the rinsing solution and the resist dry, then irradiaotion in the presence of inert gases; preventing deformation and breaking of patterns
10/21/2004US20040209200 Coating compositions for use with an overcoated photoresist
10/21/2004US20040209194 first ultraviolet-light radiating units for radiating ultraviolet light having a wavelength not exceeding 200 nm; and second ultraviolet-light radiating units for radiating ultraviolet light having a wavelength longer than 200 nm.
10/21/2004US20040209193 better exposure profiles for the resulting ICs and improved chip yield and increased throughput by reducing the need to alter settings and/or switch reticles between exposures.
10/21/2004US20040209190 forming a mask having pattern forming openings on a workpiece surface, and then supplying and solidifying a liquid pattern material in the openings; does not require reduced pressure environment during manufacture and can be used for forming patterns near atmospheric pressure
10/21/2004US20040209187 the polymer has a controlled ratio of silanol groups to Si atoms of 0.01 to 1.5., especially from trichlorosilanes with fluoroalcohol, fluoromethylsulfonamide, or fluorocarboxylic acid groups and a norbornane ring
10/21/2004US20040209186 oxime sulfonates, e.g., 2-[Cyano-(5-n-propanesulfonyloxyimino-5H-thiophen-2-ylidene)-methyl]-benzoic acid methyl ester with high stability and good solubility in the field of chemically amplified photoresists.
10/21/2004US20040209177 High-resolution overlay alignment for imprint lithography processes;semiconductor wafer
10/21/2004US20040209175 Mask, method of producing mask, and method of producing semiconductor device
10/21/2004US20040209174 Mask, method of producing mask, and method of producing semiconductor device
10/21/2004US20040209172 Defect correction method for a photomask
10/21/2004US20040209171 inspected by disposing dummy inspection patterns having the same pattern as at least a part of the mask pattern portion, inside and/or outside an area of the mask pattern portion and comparing the portion of the mask pattern portion with the dummy inspection pattern portion
10/21/2004US20040209170 Method and apparatus for providing optical proximity features to a reticle pattern for deep sub-wavelength optical lithography
10/21/2004US20040209108 An adhesive material joining a metal terminal and a ceramic member, containing indium metal adhesive layer with high bonding strength, prevents crack formation in the ceramic material
10/21/2004US20040209005 film forming by generating a plasma of a silicon compound gas, an oxidizing gas, and a rare gas where the partial pressure of the rare gas such as xenon is specified; making silicon oxide (SiO2) or metal oxide films; making semiconductor device which has a small current leakage
10/21/2004US20040209001 spray wheel configured to accommodate device-holding fixtures having a standard geometric shapes such as a rectangular or square shaped fixture; thermal spray process for tamper resistant layers on electronics
10/21/2004US20040209000 dip coating apparatus for magnetic or magnetooptic recording media such as hard disks, including a viscosity control system for monitoring and maintaining the viscosity of a dip coating liquid supplied to said dip coating vessel
10/21/2004US20040208815 Method for treating semiconductor processing components and components formed thereby
10/21/2004US20040208791 Ultraphobic surface for high pressure liquids
10/21/2004US20040208718 Machine for processing electrodes formed on a plate-like workpiece
10/21/2004US20040208470 Cladding for high temperature optical component and method of making same
10/21/2004US20040208286 EUV, XUV, and X-ray wavelength sources created from laser plasma produced from liquid metal solutions
10/21/2004US20040208218 Semiconductor light emitting element and method for producing the same
10/21/2004US20040208214 Semiconductor optical device and method for manufacturing the same
10/21/2004US20040208206 Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device
10/21/2004US20040208071 Semiconductor memory device
10/21/2004US20040208054 Magnetic random access memory
10/21/2004US20040208053 High output nonvolatile magnetic memory
10/21/2004US20040208052 Thin film magnetic memory device capable of conducting stable data read and write operations
10/21/2004US20040208049 Semiconductor memory device including a double-gate dynamic random access memory cell having reduced current leakage
10/21/2004US20040208046 Semiconductor integrated circuit
10/21/2004US20040208040 Method of modulating threshold voltage of a mask ROM
10/21/2004US20040207961 MR (magnetoresistance) device and magnetic recording device
10/21/2004US20040207856 Design system of alignment marks for semiconductor manufacture
10/21/2004US20040207838 Wafer chuck with integrated reference sample
10/21/2004US20040207837 Apparatus for integrated monitoring of wafers and for process control in semiconductor manufacturing and a method for use thereof
10/21/2004US20040207830 Method, system, and apparatus for management of reaction loads in a lithography system
10/21/2004US20040207829 Illuminator controlled tone reversal printing
10/21/2004US20040207828 Exposure apparatus and device fabrication method
10/21/2004US20040207827 Method and apparatus for aerial image improvement in projection lithography using a phase shifting aperture
10/21/2004US20040207826 Exposure apparatus and device fabrication method
10/21/2004US20040207824 Lithographic apparatus and device manufacturing method
10/21/2004US20040207789 Electro-optical device
10/21/2004US20040207785 Reflective-transmission type thin film transistor liquid crystal display
10/21/2004US20040207777 Electro-optical device
10/21/2004US20040207584 Flat panel display with improved white balance
10/21/2004US20040207583 Flat panel display with improved white balance
10/21/2004US20040207582 Flat panel display with improved white balance
10/21/2004US20040207507 Method for trimming resistors
10/21/2004US20040207461 Internal step-down power supply circuit
10/21/2004US20040207458 Voltage booster power supply circuit
10/21/2004US20040207455 Semiconductor integrated circuit
10/21/2004US20040207432 Electronic circuit device
10/21/2004US20040207429 Semiconductor integrated circuit and circuit design apparatus
10/21/2004US20040207424 High resolution analytical probe station
10/21/2004US20040207421 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
10/21/2004US20040207415 Semiconductor device tester
10/21/2004US20040207308 Method and apparatus for simultaneously depositing and observing materials on a target
10/21/2004US20040207288 Method of producing lead zirconate titanate-based thin film, dielectric device and dielectric thin film
10/21/2004US20040207271 Linear motor, moving stage system, exposure apparatus, and device manufacturing method
10/21/2004US20040207269 Lithographic apparatus and motor for use in the apparatus
10/21/2004US20040207134 Method of manufacturing ceramic laminated body
10/21/2004US20040207100 Semiconductor latches and sram devices
10/21/2004US20040207099 Semiconductor device having increased gaps between gates
10/21/2004US20040207098 Semiconductor device and method of manufacturing the same
10/21/2004US20040207096 having reduced self and mutual capacitance of bonded wires, made by coating the wires with a foamed polymer effectively having a very low dielectric constant
10/21/2004US20040207095 Semiconductor integrated circuit device with a metallization structure
10/21/2004US20040207094 Package substrate and a flip chip mounted semiconductor device
10/21/2004US20040207093 Method of fabricating an alloy cap layer over CU wires to improve electromigration performance of CU interconnects
10/21/2004US20040207092 Copper to aluminum interlayer interconnect using stud and via liner
10/21/2004US20040207091 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics
10/21/2004US20040207090 Low capacitance wiring layout and method for making same
10/21/2004US20040207089 Semiconductor device, method of manufacturing three-dimensional stacking type semiconductor device, circuit board, and electronic instrument
10/21/2004US20040207088 Semiconductor device and method for manufacturing the same
10/21/2004US20040207087 Substrate having a planarization layer and method of manufacture therefor, substrate for electro-optical device, electro-optical device, and electronic apparatus