H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/28/2004	US20040213895 Method of manufacturing multilevel interconnection
10/28/2004	US20040213894 Imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance
10/28/2004	US20040213692 Adding iron-based alloy power having a certain value in thermal expansion coefficient into a matrix powder of pure copper phase powder and/or a precipitation hardening copper alloy powder; mixing the powders together; compacting the obtained powder mixture into a green compact and sintering
10/28/2004	US20040213660 Automatic transport system
10/28/2004	US20040213648 Substrate cassette mapper
10/28/2004	US20040213563 Pattern forming method and apparatus for fabricating semiconductor device
10/28/2004	US20040213530 Exposure apparatus
10/28/2004	US20040213071 Magneto-resistive element
10/28/2004	US20040213048 Nonvolatile memory having bit line discharge, and method of operation thereof
10/28/2004	US20040213046 Eeprom writing and reading method
10/28/2004	US20040213045 Semiconductor integrated circuit device
10/28/2004	US20040213039 Magnetic ring unit and magnetic memory device
10/28/2004	US20040213032 Ferroelectric memory device
10/28/2004	US20040213031 Non-volatile semiconductor memory device and electric device with the same
10/28/2004	US20040213029 Semiconductor memory and semiconductor integrated circuit
10/28/2004	US20040213028 Read only memory (rom) and method for forming the same
10/28/2004	US20040212970 [chip package structure]
10/28/2004	US20040212969 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/28/2004	US20040212947 Substrate support having heat transfer system
10/28/2004	US20040212946 High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
10/28/2004	US20040212933 Magnetoresistive device exhibiting small and stable bias fields independent of device size variation
10/28/2004	US20040212899 Objective with at least one aspheric lens
10/28/2004	US20040212812 Optical metrology of single features
10/28/2004	US20040212809 Beam delivery methods, and systems, and wafer edge exposure apparatus delivering a plurality of laser beams
10/28/2004	US20040212801 Wafer Alignment System Using Parallel Imaging Detection
10/28/2004	US20040212794 Driving unit, exposure apparatus using the same, and device fabrication method
10/28/2004	US20040212793 Projection exposure apparatus with line width calculator controlled diaphragm unit
10/28/2004	US20040212792 Exposure apparatus and device fabrication method
10/28/2004	US20040212791 Lithographic apparatus comprising a gas flushing system
10/28/2004	US20040212752 Semiconductor element and liquid crystal display device using the same
10/28/2004	US20040212544 Circuit chip connector and method of connecting a circuit chip
10/28/2004	US20040212404 Semiconductor integrated circuit device with differential output driver circuit, and system for semiconductor integrated circuit device
10/28/2004	US20040212402 Semiconductor integrated circuit having a function determination circuit
10/28/2004	US20040212391 Method for universal wafer carrier for wafer level die burn-in
10/28/2004	US20040212387 Apparatus for measuring voltage fluctuation waveform in semiconductor integrated circuit, and semiconductor integrated circuit having function for measuring voltage fluctuation waveform
10/28/2004	US20040212380 Failure analyzer
10/28/2004	US20040212377 Method for measuring resistivity of semiconductor wafer
10/28/2004	US20040212374 Current-to-voltage converting apparatus and impedance measuring apparatus
10/28/2004	US20040212205 Method and apparatus for handling semiconductor wafers and interleafs
10/28/2004	US20040212114 Method for forming insulation film and apparatus for forming insulation film
10/28/2004	US20040212102 Apparatus for conducting heat in a flip-chip assembly
10/28/2004	US20040212101 Flip chip interconnection structure
10/28/2004	US20040212098 Flip chip interconnection structure
10/28/2004	US20040212097 Flip chip package
10/28/2004	US20040212096 Multi-chips stacked package
10/28/2004	US20040212095 Method for forming contact openings on a MOS integrated circuit
10/28/2004	US20040212093 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
10/28/2004	US20040212090 Method of forming a conductive structure
10/28/2004	US20040212089 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
10/28/2004	US20040212088 Multi-chip package substrate for flip-chip and wire bonding
10/28/2004	US20040212087 Wiring substrate and electronic parts packaging structure
10/28/2004	US20040212086 Semiconductor apparatus and production method thereof
10/28/2004	US20040212084 Thick film millimeter wave transceiver module
10/28/2004	US20040212083 Method to prevent die attach adhesive contamination in stacked chips
10/28/2004	US20040212082 Method to prevent die attach adhesive contamination in stacked chips
10/28/2004	US20040212081 Process for fabricating a power hybrid module
10/28/2004	US20040212077 High-frequency module, method of manufacturing thereof and method of molding resin
10/28/2004	US20040212076 Multilayer substrate
10/28/2004	US20040212075 Semiconductor device including a wiring board with a three-dimensional wiring pattern
10/28/2004	US20040212067 Multi-chips stacked package
10/28/2004	US20040212061 Electronic circuit device
10/28/2004	US20040212059 Circuit device and method for manufacturing the same
10/28/2004	US20040212056 [chip package structure]
10/28/2004	US20040212054 System and method of reducing die attach stress and strain
10/28/2004	US20040212051 Ball grid array package with patterned stiffener layer
10/28/2004	US20040212050 Film carrier tape for mounting an electronic part, process for producing the same, and screen for solder resist coating
10/28/2004	US20040212049 Semiconductor device and manufacturing method thereof
10/28/2004	US20040212048 Semiconductor structures, and methods of forming rugged semiconductor-containing surfaces
10/28/2004	US20040212046 Controlling diffusion in doped semiconductor regions
10/28/2004	US20040212045 Bipolar transistor and method of producing same
10/28/2004	US20040212044 Bipolar transistor and a method of manufacturing the same
10/28/2004	US20040212043 Triply implanted complementary bipolar transistors
10/28/2004	US20040212041 Semiconductor device and method of manufacturing the same
10/28/2004	US20040212040 Semiconductor integrated circuit device and method of manufacturing the same
10/28/2004	US20040212039 Semiconductor device
10/28/2004	US20040212038 Integrated inductor in semiconductor manufacturing
10/28/2004	US20040212036 Method of eliminating residual carbon from flowable oxide fill
10/28/2004	US20040212035 Strained-channel transistor and methods of manufacture
10/28/2004	US20040212034 Semiconductor device, manufacturing method of the same and semiconductor module
10/28/2004	US20040212033 Semiconductor device and method for manufacturing the same
10/28/2004	US20040212028 Thin film membrane structure
10/28/2004	US20040212027 Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
10/28/2004	US20040212025 High k oxide
10/28/2004	US20040212024 Metal oxide semiconductor field effect transistors (MOSFETs) including recessed channel regions and methods of fabricating the same
10/28/2004	US20040212023 Semiconductor memory device including MOS transistors each having a floating gate and a control gate
10/28/2004	US20040212022 Semiconductor device and method for manufacturing the same
10/28/2004	US20040212021 High voltage integrated circuit
10/28/2004	US20040212019 Semiconductor device and a method of manufacturing the same
10/28/2004	US20040212018 Semiconductor device formed in semiconductor layer on insulating film
10/28/2004	US20040212016 Semiconductor device and method for evaluating characteristics of the same
10/28/2004	US20040212013 Semiconductor device
10/28/2004	US20040212011 Silicon carbide mosfets with integrated antiparallel junction barrier schottky free wheeling diodes and methods of fabricating the same
10/28/2004	US20040212010 Semiconductor integrated circuit device incorporating memory cell transistor and logic transistor, and method of manufacturing the same
10/28/2004	US20040212009 Method of operating a semiconductor memory array of floating gate memory cells with horizontally oriented edges
10/28/2004	US20040212008 Semiconductor memory device including MOS transistors each having a floating gate and a control gate
10/28/2004	US20040212007 Method of forming different oxide thickness for high voltage transistor and memory cell tunnel dieletric
10/28/2004	US20040212006 Non-volatile memory cells utilizing substrate trenches
10/28/2004	US20040212005 Twin eeprom memory transistors with subsurface stepped floating gates
10/28/2004	US20040212004 Mirror image non-volatile memory cell transistor pairs with single poly layer
10/28/2004	US20040212003 Mirror image memory cell transistor pairs featuring poly floating spacers

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