H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/04/2004	US20040220770 Pass/fail judgment device, pass/fail judgment program, pass/fail judgment method, and multivariate statistics analyzer
11/04/2004	US20040220754 Method and apparatus for the analysis of scratches on semiconductor wafers
11/04/2004	US20040220693 Synthesizing semiconductor process flow models
11/04/2004	US20040220361 Method of removing sealant used for the protection of electric or electronic part
11/04/2004	US20040220066 removal polymeric material using quaternizating ammonium silicate
11/04/2004	US20040220065 stripping photoresists
11/04/2004	US20040219867 Apparatus and method for controlling fluid material composition on a polishing pad
11/04/2004	US20040219865 Substrate polishing apparatus
11/04/2004	US20040219803 Arrangement for transferring information/structures to wafers
11/04/2004	US20040219802 Method of fabricating dielectric layer
11/04/2004	US20040219801 Partially transparent photovoltaic modules
11/04/2004	US20040219800 Thermal oxidation process control by controlling oxidation agent partial pressure
11/04/2004	US20040219799 Method for manufacturing semiconductor device
11/04/2004	US20040219798 Deep trench self-alignment process for an active area of a partial vertical cell
11/04/2004	US20040219797 Plasma etching method and plasma etching unit
11/04/2004	US20040219796 Plasma etching process
11/04/2004	US20040219795 Method to improve breakdown voltage by H2 plasma treat
11/04/2004	US20040219794 Damascene structure with integral etch stop layer
11/04/2004	US20040219793 Method and apparatus for treating article to be treated
11/04/2004	US20040219792 Method for removing photoresist
11/04/2004	US20040219790 Etching methods, RIE methods, and methods of increasing the stability of photoresist during RIE
11/04/2004	US20040219789 Cleaning of native oxide with hydrogen-containing radicals
11/04/2004	US20040219788 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
11/04/2004	US20040219787 Pixellated devices such as active matrix liquid crystal displays and methods of manufacturing such
11/04/2004	US20040219786 Methods of removing material from a semiconductor substrate
11/04/2004	US20040219784 Methods for forming atomic layers and thin films including tantalum nitride and devices including the same
11/04/2004	US20040219783 Copper dual damascene interconnect technology
11/04/2004	US20040219782 Semiconductor device and method of manufacturing same
11/04/2004	US20040219781 Semiconductor device and method of fabricating the same
11/04/2004	US20040219780 Manufacturing method of semiconductor device
11/04/2004	US20040219779 Method and structure to improve reliability of copper interconnects
11/04/2004	US20040219778 Method for manufacturing metal structure using trench
11/04/2004	US20040219777 Method of manufacturing semiconductor device with interconnections and interconnection contacts and a device formed thereby
11/04/2004	US20040219776 Method for forming metal lines in a semiconductor device
11/04/2004	US20040219775 Lead free bump and method of forming the same
11/04/2004	US20040219774 Method for forming conductive bump and device formed with such a conductive bump
11/04/2004	US20040219773 Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method
11/04/2004	US20040219772 Apparatus for manufacturing a semiconductor device and method of forming the same
11/04/2004	US20040219771 Pattern forming method and pattern forming device
11/04/2004	US20040219770 Laser trimming problem suppressing semiconductor device manufacturing apparatus and method
11/04/2004	US20040219769 Method and structure for improving latch-up immunity using non-dopant implants
11/04/2004	US20040219768 Mask for forming polysilicon and a method for fabricating thin film transistor using the same
11/04/2004	US20040219767 SiGe rectification process
11/04/2004	US20040219766 Method and apparatus for preparing a plurality of dice in wafers
11/04/2004	US20040219765 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
11/04/2004	US20040219764 Vacuum package fabrication of integrated circuit components
11/04/2004	US20040219763 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
11/04/2004	US20040219762 Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
11/04/2004	US20040219761 Semiconductor device formed over a multiple thickness buried oxide layer, and methods of making same
11/04/2004	US20040219759 Semiconductor apparatus having contacts of multiple heights and method of making same
11/04/2004	US20040219758 Method of forming a silicon dioxide layer
11/04/2004	US20040219757 Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same
11/04/2004	US20040219756 Applying epitaxial silicon in disposable spacer flow
11/04/2004	US20040219755 Method for forming transistors with ultra-short gate feature
11/04/2004	US20040219754 Method for fabricating semiconductor device using high dielectric material
11/04/2004	US20040219753 Method of manufacturing semiconductor device
11/04/2004	US20040219752 Method of forming a low resistance semiconductor device and structure therefor
11/04/2004	US20040219751 Simplified twin monos fabrication method with three extra masks to standard CMOS
11/04/2004	US20040219750 Quantum structure and forming method of the same
11/04/2004	US20040219749 Method of manufacturing semiconductor device
11/04/2004	US20040219748 Method of manufacturing a semiconductor device
11/04/2004	US20040219747 Method for forming vertical transistor and trench capacitor
11/04/2004	US20040219746 Systems and methods for forming metal oxide layers
11/04/2004	US20040219745 Memory device for reducing skew of data and address
11/04/2004	US20040219744 Integrated circuit devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate and methods of forming the same
11/04/2004	US20040219743 Method of forming organic spacers and using organic spacers to form semiconductor device features
11/04/2004	US20040219742 Memory cell and method for forming the same
11/04/2004	US20040219741 Low-temperature polysilicon thin film transistor having buried LDD structure and process for producing same
11/04/2004	US20040219738 Method of providing a structure using self-aligned features
11/04/2004	US20040219737 Method and apparatus for processing a workpiece with a plasma
11/04/2004	US20040219736 Semiconductor device and method of manufacturing the same
11/04/2004	US20040219735 Epitaxial semiconductor deposition methods and structures
11/04/2004	US20040219734 Non-volatile memory device
11/04/2004	US20040219733 Method to provide a triple well in an epitaxially based CMOS or BiCMOS process
11/04/2004	US20040219730 Method of forming semiconductor compound film for fabrication of electronic device and film produced by same
11/04/2004	US20040219729 Flash memory device
11/04/2004	US20040219728 Extreme ultraviolet light generating device, exposure apparatus using the same and semiconductor manufacturing method
11/04/2004	US20040219727 Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device
11/04/2004	US20040219726 Methods of fabricating contact regions for FET incorporating SiGe
11/04/2004	US20040219725 Vertical dual gate field effect transistor
11/04/2004	US20040219724 Methods of fabricating MOS field effect transistors with pocket regions
11/04/2004	US20040219723 [low temperature polysilicon thin film transistor and method of manufacturing the same]
11/04/2004	US20040219722 Method for forming a double-gated semiconductor device
11/04/2004	US20040219721 Method for forming pattern of stacked film
11/04/2004	US20040219719 Device having resin package and method of producing the same
11/04/2004	US20040219718 Structure and method of direct chip attach
11/04/2004	US20040219716 Microelectronic assemblies having low profile connections
11/04/2004	US20040219715 Bump formed on semiconductor device chip and method for manufacturing the bump
11/04/2004	US20040219714 Non-contact data carrier and method of fabricating the same
11/04/2004	US20040219713 Elimination of RDL using tape base flip chip on flex for die stacking
11/04/2004	US20040219712 Semiconductor package and method of fabricating same
11/04/2004	US20040219709 Method for fabricating complementary metal oxide semiconductor image sensor
11/04/2004	US20040219708 Method of manufacturing CMOS image sensor by means of double masking process
11/04/2004	US20040219707 Method for fabricating complementary metal oxide semiconductor image sensor having redundancy module
11/04/2004	US20040219706 System and method of fabricating micro cavities
11/04/2004	US20040219705 Fabrication of a microchip-based electrospray device
11/04/2004	US20040219703 Method of making a long wavelength indium gallium arsenide nitride (InGaAsN) active region
11/04/2004	US20040219702 Method for manufacturing group-III nitride compound semiconductor, and group-III nitride compound semiconductor device
11/04/2004	US20040219700 Method of manufacturing a light emitting semiconductor package
11/04/2004	US20040219697 Contact structure for an electrically operated II/VI semiconductor element and process for the production thereof

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