| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 11/04/2004 | WO2004095579A1 Method of producing semiconductor integrated circuit device on soi substrate |
| 11/04/2004 | WO2004095578A1 Semiconductor device and production method therefor |
| 11/04/2004 | WO2004095576A1 Semiconductor device |
| 11/04/2004 | WO2004095573A1 Wafer scale package and method of assembly |
| 11/04/2004 | WO2004095572A1 A method of fabricating a cmos device with dual metal gate electrodes |
| 11/04/2004 | WO2004095571A1 Substrate processing method and substrate processing apparatus |
| 11/04/2004 | WO2004095569A1 Method of filling high aspect ratio, small dimension gaps and formulations useful therein |
| 11/04/2004 | WO2004095568A1 Device for applying semiconductor treatment to treatment subject substrate |
| 11/04/2004 | WO2004095567A1 Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material |
| 11/04/2004 | WO2004095566A1 Semiconductor manufacturing system |
| 11/04/2004 | WO2004095565A1 Semiconductor device comprising extensions produced from material with a low melting point |
| 11/04/2004 | WO2004095564A1 Method of manufacturing a semiconductor device with a bipolar transistor |
| 11/04/2004 | WO2004095563A1 Surface modification method and surface modification apparatus for interlayer insulating film |
| 11/04/2004 | WO2004095562A1 Semiconductor device and process for producing the same |
| 11/04/2004 | WO2004095561A1 Compensation for heterogeneous nitrogen concentration in a nitrided silicon oxide layer |
| 11/04/2004 | WO2004095560A1 Semiconductor producing device and semiconductor producing method |
| 11/04/2004 | WO2004095559A1 Method for removing silicon oxide film and processing apparatus |
| 11/04/2004 | WO2004095558A1 Cmp polishing method and method for manufacturing semiconductor device |
| 11/04/2004 | WO2004095557A1 Semiconductor device |
| 11/04/2004 | WO2004095556A1 A method of forming a metal gate structure with tuning of work function by silicon incorporation |
| 11/04/2004 | WO2004095555A1 Method for cleaning heat treatment apparatus |
| 11/04/2004 | WO2004095554A2 Method for preparing a device structure having a wafer structure deposited on a composite substrate having a matched coefficient of thermal expansion |
| 11/04/2004 | WO2004095553A2 Method for producing a strained layer on a substrate and corresponding layer structure |
| 11/04/2004 | WO2004095552A2 Method for producing a tensioned layer on a substrate, and a layer structure |
| 11/04/2004 | WO2004095551A1 Method and apparatus for multilayer photoresist dry development |
| 11/04/2004 | WO2004095550A1 Organic matter removing apparatus, organic matter removing method, ozone water jet nozzle, and organic matter removing apparatus for mask substrate |
| 11/04/2004 | WO2004095548A1 Stage device and exposure device |
| 11/04/2004 | WO2004095547A1 Semiconductor device manufacturing method and semiconductor device manufacturing system |
| 11/04/2004 | WO2004095546A1 Method of adjusting the absorptivity of integrated circuits prior to rapid thermal processing |
| 11/04/2004 | WO2004095545A2 Wafer carrier having improved processing characteristics |
| 11/04/2004 | WO2004095543A2 Laser trimming with phase shifters |
| 11/04/2004 | WO2004095542A2 Apparatus and method for picking up semiconductor chip |
| 11/04/2004 | WO2004095540A2 Method of making a nanogap for variable capacitive elements and device having a nanogap |
| 11/04/2004 | WO2004095534A2 Gaas substrate with sb buffering for high in devices |
| 11/04/2004 | WO2004095531A2 Method and system for temperature control of a substrate |
| 11/04/2004 | WO2004095530A2 Adjoining adjacent coatings on an element |
| 11/04/2004 | WO2004095527A2 Method for fabricating dual-metal gate device |
| 11/04/2004 | WO2004095526A2 Multi-bit non-volatile memory device and method therefor |
| 11/04/2004 | WO2004095525A2 Gate electrode for mos transistors |
| 11/04/2004 | WO2004095524A2 Semiconductor alignment aid |
| 11/04/2004 | WO2004095522A2 Deep n wells in triple well structures and method for fabricating same |
| 11/04/2004 | WO2004095517A2 Passivation layer for group iii-v semiconductor devices |
| 11/04/2004 | WO2004095515A2 Methods for contracting conducting layers overlying magnetoelectronic elements of mram devices |
| 11/04/2004 | WO2004095514A2 Circuit device with at least partial packaging and method for forming |
| 11/04/2004 | WO2004095513A2 A method for plasma deposition of a substrate barrier layer |
| 11/04/2004 | WO2004095510A2 Multilayered cap barrier in microelectronic, interconnect structures |
| 11/04/2004 | WO2004095477A2 High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer |
| 11/04/2004 | WO2004095459A2 Magnetoresistive ram device and methods for fabricating |
| 11/04/2004 | WO2004095112A2 Cmos-compatible integration of silicon-based optical devices with electronic devices |
| 11/04/2004 | WO2004094995A2 Hierarchical evaluation of cells |
| 11/04/2004 | WO2004094884A1 Slit valve method and apparatus |
| 11/04/2004 | WO2004094764A2 Low cost capacitors manufactured from conductive loaded resin-based materials |
| 11/04/2004 | WO2004094702A2 Multi-chemistry plating system |
| 11/04/2004 | WO2004094701A2 Method and apparatus for monitoring, dosing, and distribution of chemical compositions |
| 11/04/2004 | WO2004094696A1 Microelectronic device manufacturing in coordinated carbon dioxide processing chambers |
| 11/04/2004 | WO2004094691A1 Method for hafnium nitride deposition |
| 11/04/2004 | WO2004094690A1 Carbon nanotube growth method |
| 11/04/2004 | WO2004094581A1 Aqueous fluoride compositions for cleaning semiconductor devices |
| 11/04/2004 | WO2004094548A2 Adhesive of a silicon and silica composite particularly useful for joining silicon parts |
| 11/04/2004 | WO2004094547A2 Coated metal oxide particles for cmp |
| 11/04/2004 | WO2004094311A1 Coating liquid for forming porous silica |
| 11/04/2004 | WO2004094105A1 Vacuum suction holding apparatus and method, grinding apparatus using the holding apparatus, and device producing method using the grinding apparatus |
| 11/04/2004 | WO2004094101A1 Growth model automated material handling system |
| 11/04/2004 | WO2004094095A1 Bonding device and bonding tool |
| 11/04/2004 | WO2004094040A1 Chemical filter |
| 11/04/2004 | WO2004086490B1 Surgical holder for a blood vessel |
| 11/04/2004 | WO2004085491A3 Removal of cmp and post-cmp residue from semiconductors using supercritical carbon dioxide process |
| 11/04/2004 | WO2004084299A3 Shallow trench isolation in processes with strained silicon |
| 11/04/2004 | WO2004084271A3 Method and apparatus for thermally insulating adjacent temperature controlled processing chambers |
| 11/04/2004 | WO2004082821A3 Processing system and method for thermally treating a substrate |
| 11/04/2004 | WO2004082820A3 Processing system and method for chemically treating a substrate |
| 11/04/2004 | WO2004082005B1 Semiconductor mos, cmos devices and capacitors and method of manufacturing the same |
| 11/04/2004 | WO2004081986A3 Method to planarize and reduce defect density of silicon germanium |
| 11/04/2004 | WO2004079786A3 Apparatus and method for reducing impurities in a semiconductor material |
| 11/04/2004 | WO2004078410A3 Agent for increasing selection ratio of polishing rates |
| 11/04/2004 | WO2004077498A3 Method of manufacturing a non-volatile memory cell with a lateral select gate |
| 11/04/2004 | WO2004077438A3 Process of forming a ferroelectric memory integrated circuit |
| 11/04/2004 | WO2004075265A3 Methods for selectively bumping integrated circuit substrates and related structures |
| 11/04/2004 | WO2004075255A3 End point detection in time division multiplexed etch processes |
| 11/04/2004 | WO2004073049A3 Methods and apparatus for processing semiconductor wafers with plasma processing chambers in a wafer track environment |
| 11/04/2004 | WO2004072978A3 High density and high programming efficiency mram design |
| 11/04/2004 | WO2004070841A3 Storage cell and method for the production thereof |
| 11/04/2004 | WO2004070796A9 Tailoring nitrogen profile in silicon oxynitride using rapid thermal annealing with ammonia under ultra-low pressure |
| 11/04/2004 | WO2004064125A8 Gas feed line structure |
| 11/04/2004 | WO2004059700A3 Photoresist removal |
| 11/04/2004 | WO2004057662A3 Electronic device and method of manufacturing same |
| 11/04/2004 | WO2004053944A3 Fast localization of electrical failures on an integrated circuit system and method |
| 11/04/2004 | WO2004049412A3 Producing method for crystalline thin film |
| 11/04/2004 | WO2004040619A3 Semiconductor device with tensile strain silicon introduced by compressive material in a buried oxide layer |
| 11/04/2004 | WO2004040034A3 Method of preparing a solution and application of this solution to prepare functional oxide layers |
| 11/04/2004 | WO2004027684A3 Photolithography mask repair |
| 11/04/2004 | WO2004015764A3 Vertical system integration |
| 11/04/2004 | WO2004011695A3 Sublimation system employing carrier gas |
| 11/04/2004 | WO2004004085A3 Nitride semiconductor laser device and a method for improving its performance |
| 11/04/2004 | WO2003098350A3 Method for the targeted deformation of an optical element |
| 11/04/2004 | WO2003096121A3 Photolithography mask comprising absorber/phase-shifter elements |
| 11/04/2004 | WO2003085724A8 Tri-layer masking architecture for patterning dual damascene interconnects |
| 11/04/2004 | WO2003019626A9 Method of forming a pattern on a semiconductor wafer using an attenuated phase shifting reflective mask |
| 11/04/2004 | US20040221211 Individually adjustable back-bias technique |
| 11/04/2004 | US20040220968 Method of providing context specific recipes in a semiconductor facility by defining product categories |