Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/26/2004US6808958 Methods of bonding microelectronic elements
10/26/2004US6808957 Method for improving a high-speed edge-coupled photodetector
10/26/2004US6808952 Process for fabricating a microelectromechanical structure
10/26/2004US6808951 Semiconductor integrated circuit device and manufacturing method thereof
10/26/2004US6808945 Method and system for testing tunnel oxide on a memory-related structure
10/26/2004US6808942 Method for controlling a critical dimension (CD) in an etch process
10/26/2004US6808862 Including a compound (especially a sulfonium salt) that generates an alpha-fluoroalkanesulfonic acid upon irradiation; a (non-fluoro alkanesulfonic acid onium salt; and a monocyclic or polycyclic alicyclic hydrocarbon resin
10/26/2004US6808861 Suitable for direct plate making by means of a semiconductor laser or a yag laser
10/26/2004US6808781 Silicon wafers with stabilized oxygen precipitate nucleation centers and process for making the same
10/26/2004US6808748 Depositing portion of silica glass film over substrate and in trench using high density plasma with simultaneous deposition and sputtering from gas including sources of silicon and oxygen and helium, second portion also including hydrogen
10/26/2004US6808747 Anodizing surface of aluminum-based substrate to form anodization layer, removing from first portion of substrate, depositing boron carbide layer on anodization layer, extending over first portion of substrate across edge to second portion
10/26/2004US6808668 Process for fabricating composite substrate carrier
10/26/2004US6808647 Methodologies to reduce process sensitivity to the chamber condition
10/26/2004US6808646 Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
10/26/2004US6808645 Susceptor and surface processing method
10/26/2004US6808643 Hybrid interconnect substrate and method of manufacture thereof
10/26/2004US6808641 Method of wiring formation and method for manufacturing electronic components
10/26/2004US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing
10/26/2004US6808612 Positioning electroconductive substrate in a chamber containing electrochemical bath, applying a plating bias to the substrate while immersing into bath, and depositing third conductive material in situ to fill; pulsation
10/26/2004US6808605 Forming a layer of autocatalytic metal on the surface of a substrate; forming nanowires on front surface of layer of autocatalytic metal, wherein the substrate is put into an evaporator and the layer of autocatalytic metal is grown
10/26/2004US6808592 High throughput plasma treatment system
10/26/2004US6808591 Model based metal overetch control
10/26/2004US6808590 Method and apparatus of arrayed sensors for metrological control
10/26/2004US6808589 Wafer transfer robot having wafer blades equipped with sensors
10/26/2004US6808578 Method for producing ceramic substrate
10/26/2004US6808567 Gas treatment apparatus
10/26/2004US6808566 Reduced-pressure drying unit and coating film forming method
10/26/2004US6808564 In-situ post epitaxial treatment process
10/26/2004US6808443 Projected gimbal point drive
10/26/2004US6808391 Baking apparatus for manufacturing a semiconductor device
10/26/2004US6808379 Cleaner for molding apparatus of semiconductor chip packages
10/26/2004US6808352 Method for transporting boards, load port apparatus, and board transport system
10/26/2004US6808322 Devices and method of mounting
10/26/2004US6808216 Methods and apparatus for handling workpieces
10/26/2004US6808169 Non-volatile memory with crown electrode to increase capacitance between control gate and floating gate
10/26/2004US6808117 Method and apparatus for calibrating marking position in chip scale marker
10/26/2004US6807974 Single wafer type substrate cleaning method and apparatus
10/26/2004US6807972 Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber
10/26/2004US6807971 Top end of the exhaust pipe is split into two vents, one of which is used for discharging exhaust gas for forming silicon dioxide and silicon nitride films and other, which is used to discharge hydrogen fluoride for pipe cleaning
10/26/2004CA2364448C Electronic tag assembly and method therefor
10/26/2004CA2356229C A method for fabricating a sic film and a method for fabricating a sic multi-layered film structure
10/26/2004CA2274717C Semiconductor having large volume fraction of intermediate range order material
10/21/2004WO2004091269A2 Method for production of (opto)electronic housings with a ceramic base for thermal regulation and dissipation by means of a thermoelectric (peltier) effect
10/21/2004WO2004091266A1 Circuit board and process for producing the same
10/21/2004WO2004091251A1 Electronic apparatus and audio signal outputting method of electronic apparatus
10/21/2004WO2004091001A1 Organic semiconductor device
10/21/2004WO2004090992A1 Vertical misfet semiconductor device having high mobility silicon channel
10/21/2004WO2004090991A1 Semiconductor device and process for fabricating the same
10/21/2004WO2004090989A1 Bipolar transistor
10/21/2004WO2004090988A1 Method for the production of a bipolar semiconductor element, especially a bipolar transistor, and corresponding bipolar semiconductor component
10/21/2004WO2004090986A1 Laminated semiconductor substrate and process for producing the same
10/21/2004WO2004090985A1 Process for producing semiconductor device
10/21/2004WO2004090983A1 Semiconductor device and production method therefor
10/21/2004WO2004090975A1 Method of manufacturing semiconductor devices
10/21/2004WO2004090974A1 Electronic device and its manufacturing method
10/21/2004WO2004090973A1 Power integrated circuits
10/21/2004WO2004090972A1 Substrate processing system, and method of control therefor, control program, and storage medium
10/21/2004WO2004090971A1 Method of fabricating semiconductor probe with resistive tip
10/21/2004WO2004090970A1 Wiring board and process for producing the same
10/21/2004WO2004090969A1 Silicon carbide semiconductor device and method for manufacturing same
10/21/2004WO2004090968A1 Method for the production of a bipolar transistor
10/21/2004WO2004090967A1 Semiconductor wafer heat treating jig
10/21/2004WO2004090966A1 Method of forming film and film forming apparatus
10/21/2004WO2004090965A2 Organosilicate resin formulation for use in microelectronic devices
10/21/2004WO2004090964A1 A rotary union
10/21/2004WO2004090962A1 Base film for semiconductor wafer processing
10/21/2004WO2004090961A1 Shower head structure and treating device
10/21/2004WO2004090960A1 Loading table and heat treating apparatus having the loading table
10/21/2004WO2004090959A1 Method of heat treatment and heat treatment apparatus
10/21/2004WO2004090958A1 Method of producing a hybrid device and hybrid device
10/21/2004WO2004090957A1 Light source unit, illumination optical system, exposure apparatus and exposure method
10/21/2004WO2004090953A1 Stage device, exposure deice, and method of producing device
10/21/2004WO2004090951A1 Heat treating apparatus and heat treating method
10/21/2004WO2004090950A2 Creation of a permanent structure with high three-dimensional resolution
10/21/2004WO2004090949A1 Suppression of electrode re-crystallisation in a ferrocapacitor
10/21/2004WO2004090948A1 Methods and apparatus for vertical transfer of semiconductor substrates between cleaning modules
10/21/2004WO2004090947A2 Ion beam incident angle detector for ion implant systems
10/21/2004WO2004090946A1 Wafer having alternating design structure and method for manufacturing semiconductor package using the same
10/21/2004WO2004090941A2 Integrated circuit die having a copper contact and method therefor
10/21/2004WO2004090940A2 Esd protection device and method making the same
10/21/2004WO2004090938A2 Thermal interconnect and interface systems, methods of production and uses thereof
10/21/2004WO2004090937A2 Copper cmp slurry composition
10/21/2004WO2004090928A1 Method for manufacturing plasma display panel
10/21/2004WO2004090927A1 Method for manufacturing plasma display panel
10/21/2004WO2004090635A1 Method of producing photomask and photomask blank
10/21/2004WO2004090623A1 Method for fabrcating a thin film transistor liquid crystal display
10/21/2004WO2004090339A2 Method and apparatus for rotation of a workpiece in supercritical fluid solutions for removing photo resist, residues and particles therefrom
10/21/2004WO2004090332A1 Dry vacuum pump and method of starting same
10/21/2004WO2004090331A1 Liquid jetting device
10/21/2004WO2004090201A2 Method for the production of monocrystalline crystals
10/21/2004WO2004090195A1 Crystalline-si-layer-bearing substrate and its production method, and crystalline si device
10/21/2004WO2004090058A1 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same
10/21/2004WO2004090033A1 Epoxy resin molding material for sealing use and semiconductor device
10/21/2004WO2004089839A1 Silica glass containing tio2 and process for its production
10/21/2004WO2004089836A1 Silica glass containing tio2 and process for its production
10/21/2004WO2004089817A1 Potassium hydrogen peroxymonosulfate solutions
10/21/2004WO2004089797A1 Method and device for sticking tape
10/21/2004WO2004089792A1 Conveyor for plate-shaped members
10/21/2004WO2004089784A1 Wafer protective sheet
10/21/2004WO2004079835B1 Nanoscale control of the spatial distribution, shape and size of thin films of conjugated organic molecules through the production of silicon oxide nanostructures