| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 10/28/2004 | CA2773085A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2773076A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2522913A1 Tray carrier with ultraphobic surfaces |
| 10/28/2004 | CA2521869A1 Ultraphobic surface for high pressure liquids |
| 10/28/2004 | CA2486986A1 Compound semiconductor wafer and manufacturing method thereof |
| 10/28/2004 | CA2426651A1 Method and apparatus for transferring solder bumps |
| 10/27/2004 | EP1471586A1 Process for the production of organic transistor and organic transistor |
| 10/27/2004 | EP1471582A1 Substrate for semiconductor light-emitting element, semiconductor light-emitting element and its fabrication |
| 10/27/2004 | EP1471580A2 Bipolar transistor and method of producing same |
| 10/27/2004 | EP1471578A1 Soi wafer manufacturing method and soi wafer |
| 10/27/2004 | EP1471577A2 Byte-operational nonvolatile semiconductor memory device |
| 10/27/2004 | EP1471576A2 Semiconductor device and method for evaluating characteristics of the same |
| 10/27/2004 | EP1471574A2 Wiring substrate and electronic parts packaging structure |
| 10/27/2004 | EP1471572A1 Embedded copper interconnection structure |
| 10/27/2004 | EP1471571A1 Semiconductor device and manufacturing method thereof |
| 10/27/2004 | EP1471570A1 Method of mounting an electronic part on a mounting board |
| 10/27/2004 | EP1471569A1 Process for cutting electrical connection nodes in IC-frames and fabrication process of an electronic component and of frames therefor |
| 10/27/2004 | EP1471568A1 Precursors for metal containing films |
| 10/27/2004 | EP1471567A1 Organometallic iridium compounds, processes for producing the same, and processes for producing thin films |
| 10/27/2004 | EP1471566A2 Semiconductor device and method for fabricating the same |
| 10/27/2004 | EP1471565A2 Mapping device for semiconductor wafers |
| 10/27/2004 | EP1471561A2 Electron gun |
| 10/27/2004 | EP1471543A2 Magnetoresistive structures and magnetic recording disc drive |
| 10/27/2004 | EP1471536A2 Magnetic random access memory cell comprising an oxidation preventing layer and method of manufacturing the same |
| 10/27/2004 | EP1471448A2 Method and apparatus for capturing and using designs in an integrated circuit fabrication process |
| 10/27/2004 | EP1471389A2 Projection optical system |
| 10/27/2004 | EP1471164A1 Copper alloy sputtering target and method for manufacturing the target |
| 10/27/2004 | EP1471039A1 Method for producing quartz glass jig and quartz glass jig |
| 10/27/2004 | EP1470907A2 Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodots using the nanochannel-array |
| 10/27/2004 | EP1470893A1 Polishing pad and chemical mechanical polishing method |
| 10/27/2004 | EP1470892A1 Polishing pad and method of polishing a semiconductor wafer |
| 10/27/2004 | EP1470747A1 Chip removal device chip, placing system and method for removing chips from a wafer |
| 10/27/2004 | EP1470738A2 Heating in a vacuum atmosphere in the presence of a plasma |
| 10/27/2004 | EP1470599A1 Electronic devices containing organic semiconductor materials |
| 10/27/2004 | EP1470592A2 Boron phosphide-based semiconductor device and production method thereof |
| 10/27/2004 | EP1470591A2 Cluster packaging of light emitting diodes |
| 10/27/2004 | EP1470590A2 Non-volatile memory and method of forming thereof |
| 10/27/2004 | EP1470588A2 Split-gate power module and method for suppressing oscillation therein |
| 10/27/2004 | EP1470584A2 No-flow underfill encapsulant |
| 10/27/2004 | EP1470583A1 Chip and wafer integration process using vertical connections |
| 10/27/2004 | EP1470582A1 Reduction of negative bias temperature instability in narrow width pmos using f2 implantation |
| 10/27/2004 | EP1470581A2 High density area array solder microjoining interconnect structure and fabrication method |
| 10/27/2004 | EP1470580A1 Bilayer hdp cvd / pe cvd cap in advanced beol interconnect structures and method thereof |
| 10/27/2004 | EP1470579A1 Pgo solutions for the preparation of pgo thin films via spin coating |
| 10/27/2004 | EP1470578A1 Semiconductor component with an insulating layer and method for the production of a semiconductor component with an insulating layer |
| 10/27/2004 | EP1470577A1 A chemistry for etching quaternary interface layers on ingaasp mostly formed between gaas and inxga(1-x)p layers |
| 10/27/2004 | EP1470576A1 Electrolytic processing apparatus and substrate processing apparatus and method |
| 10/27/2004 | EP1470575A2 Planar avalanche photodiode |
| 10/27/2004 | EP1470574A2 Enhanced photodetector |
| 10/27/2004 | EP1470573A2 Method for producing a semiconductor element |
| 10/27/2004 | EP1470572A2 Charge controlled avalanche photodiode and method of making the same |
| 10/27/2004 | EP1470571A2 Electroless deposition apparatus and method |
| 10/27/2004 | EP1470570A2 Semiconductor component handling device having an electrostatic dissipating film |
| 10/27/2004 | EP1470447A1 Photolithographic critical dimension control using reticle measurements |
| 10/27/2004 | EP1470432A2 Predictive, adaptive power supply for an integrated circuit under test |
| 10/27/2004 | EP1470431A2 Apparatus and method for dynamic diagnostic testing of integrated circuits |
| 10/27/2004 | EP1470351A1 Gate valve seal assembly |
| 10/27/2004 | EP1470269A1 Electrolytic processing apparatus and method |
| 10/27/2004 | EP1470268A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 10/27/2004 | EP1470264A1 Methods for silicon oxide and oxynitride deposition using single wafer low pressure cvd |
| 10/27/2004 | EP1470207A1 Aqueous stripping and cleaning composition |
| 10/27/2004 | EP1470181A1 Improved interface adhesive |
| 10/27/2004 | EP1470176A1 No flow underfill composition |
| 10/27/2004 | EP1469981A1 Device for cutting a substrate layer, and corresponding method |
| 10/27/2004 | EP1469971A2 Grooved rollers for a linear chemical mechanical planarization system |
| 10/27/2004 | EP1469953A1 Megasonic probe energy director |
| 10/27/2004 | EP1419360A4 Tilted interferometer |
| 10/27/2004 | EP1179287B1 Device and method for thermally treating substrates |
| 10/27/2004 | EP1158257B1 Method for drying substrate |
| 10/27/2004 | EP1125324A4 Radical-assisted sequential cvd |
| 10/27/2004 | EP1110054B1 Methods and apparatus for measuring the thickness of a film, particularly of a photoresist film on a semiconductor substrate |
| 10/27/2004 | EP1088329B1 Method and apparatus for stabilising a plasma |
| 10/27/2004 | EP1053627A4 Bidding for telecommunications traffic over route segments |
| 10/27/2004 | EP0997497B1 Alkoxysilane/organic polymer composition for thin insulating film production and use thereof |
| 10/27/2004 | EP0996970B1 Manufacture of field-effect semiconductor devices |
| 10/27/2004 | EP0870627B1 Semiconductor device |
| 10/27/2004 | EP0845445B1 Photosensitive ceramic green sheet, ceramic package,process for producing the same and its use in preparing a ceramic package with a fired board |
| 10/27/2004 | EP0834188B1 Method and apparatus for controlling a temperature of a wafer |
| 10/27/2004 | EP0786667B1 Method and apparatus for testing integrated circuits |
| 10/27/2004 | CN2651937Y Internal holdering assembly of cleaning container |
| 10/27/2004 | CN2651936Y Integrated circuit pulling device with improved structure |
| 10/27/2004 | CN2650897Y Wafer cleaner |
| 10/27/2004 | CN1541444A Electronic device and method of testing and of mfg. |
| 10/27/2004 | CN1541426A Solution influenced alignment |
| 10/27/2004 | CN1541419A Method to GaAs based lasers and GaAs based laser |
| 10/27/2004 | CN1541417A Trech MIS device with active trench coreners and thick bottom oxide and method of making same |
| 10/27/2004 | CN1541416A 半导体装置 Semiconductor device |
| 10/27/2004 | CN1541415A Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
| 10/27/2004 | CN1541413A Integrated circuit arrangement consisting of flat substrate |
| 10/27/2004 | CN1541411A Self-aligned contacts to gates |
| 10/27/2004 | CN1541410A Bump formation method and bump forming appts appts. to semiconductor wafer |
| 10/27/2004 | CN1541408A Methods for forming ultrashallow junctions with sheet resistance |
| 10/27/2004 | CN1541407A Sheet mfg. device, sheet mfg. method and solar battery |
| 10/27/2004 | CN1541406A Detachable substrate with controlled mechanical hold and method for prodn. thereof |
| 10/27/2004 | CN1541405A Method for making substrate in partucular for optics, electronic or optoelectronics and resulting substrate |
| 10/27/2004 | CN1541404A High voltage, high temp capacitor structures and methods of fabricating same |
| 10/27/2004 | CN1541403A Low-K metal proelectrolyte semiconductor structure |
| 10/27/2004 | CN1541396A Integrated transformer |
| 10/27/2004 | CN1541348A Experiment management system, method and medium |
| 10/27/2004 | CN1541336A Electronic circuit and method for testing |