H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/04/2004	US20040217431 Semiconductor device and method for manufacturing the same
11/04/2004	US20040217430 High performance FET devices and methods therefor
11/04/2004	US20040217429 Dual metal gate process: metals and their silicides
11/04/2004	US20040217428 Semiconductor device having silicide layers and method of fabricating the same
11/04/2004	US20040217427 Semiconductor device capable of preventing current flow caused by latch-up and method of forming the same
11/04/2004	US20040217425 Efficient protection structure for reverse pin-to-pin electrostatic discharge
11/04/2004	US20040217424 Semiconductor device structure facilitating electrostatic discharge protection and manufacturing method thereof
11/04/2004	US20040217423 Flexible single-crystal film and method of manufacturing the same
11/04/2004	US20040217421 SOI field effect transistor element having an ohmic substrate contact
11/04/2004	US20040217420 Semiconductor-on-insulator chip incorporating strained-channel partially-depleted, fully-depleted, and multiple-gate transistors
11/04/2004	US20040217419 High-voltage transistor with multi-layer conduction region
11/04/2004	US20040217417 High voltage device and method for fabricating the same
11/04/2004	US20040217416 DMOS device having a trenched bus structure
11/04/2004	US20040217415 Single poly EEPROM with improved coupling ratio
11/04/2004	US20040217414 Nonvolatile memory device having STI structure and method of fabricating the same
11/04/2004	US20040217413 Semiconductor memory device having a memory region and a peripheral region, and a manufacturing method thereof
11/04/2004	US20040217412 [flash memory structure and operating method thereof]
11/04/2004	US20040217411 Non-volatile semiconductor memory device and manufacturing method therefor
11/04/2004	US20040217410 Enhanced atomic layer deposition
11/04/2004	US20040217409 Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers
11/04/2004	US20040217408 Fin field-effect transistor and method for producing a fin field effect-transistor
11/04/2004	US20040217407 Semiconductor device including storage node and method of manufacturing the same
11/04/2004	US20040217406 Semiconductor device having a capacitor and method of fabricating same
11/04/2004	US20040217404 Semiconductor device
11/04/2004	US20040217402 Ferroelectric memory device with a conductive polymer layer and a method of formation
11/04/2004	US20040217401 Semiconductor nonvolatile storage element and method of fabricating the same
11/04/2004	US20040217400 Magnetic random access memory
11/04/2004	US20040217397 CMOS image sensor having test pattern therein and method for manufacturing the same
11/04/2004	US20040217395 Solid-state imaging device
11/04/2004	US20040217394 CMOS image sensor having double gate insulator therein and method for manufacturing the same
11/04/2004	US20040217393 Semiconductor device and method of manufacturing the same
11/04/2004	US20040217392 Semiconductor fabrication process with asymmetrical conductive spacers
11/04/2004	US20040217391 Localized strained semiconductor on insulator
11/04/2004	US20040217390 Solid-state imaging device and method for manufacturing the same
11/04/2004	US20040217389 Apparatus and method for molding a semiconductor die package with enhanced thermal conductivity
11/04/2004	US20040217387 Methods for manufacturing semiconductor devices
11/04/2004	US20040217380 Semiconductor device, electronic device, electronic apparatus, method for manufacturing a semiconductor device, and method for manufacturing an electronic device
11/04/2004	US20040217379 Compact mask programmable rom
11/04/2004	US20040217372 Individually adjustable back-bias technique
11/04/2004	US20040217365 Optoelectronic device and method of manufacture thereof
11/04/2004	US20040217363 Integrated circuit device packaging structure and packaging method
11/04/2004	US20040217358 Silicon carbide semiconductor device
11/04/2004	US20040217357 Active matrix display device and method of manufacturing the same
11/04/2004	US20040217355 Electroluminescent display device
11/04/2004	US20040217354 Display device and manufacturing method thereof
11/04/2004	US20040217353 Flat panel display with thin film transistor
11/04/2004	US20040217352 Strained semiconductor by wafer bonding with misorientation
11/04/2004	US20040217350 Probe unit and its manufacturing method
11/04/2004	US20040217348 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
11/04/2004	US20040217346 Method of deposting a dielectric film
11/04/2004	US20040217342 Anisotropically conductive connector, production process thereof and application product thereof
11/04/2004	US20040217305 Method of repairing an integrated electronic circuit, comprising the formation of an electrical isolation
11/04/2004	US20040217304 Method of exposing a target to a charged particle beam
11/04/2004	US20040217302 Electron beam lithography system
11/04/2004	US20040217288 Microstructured pattern inspection method
11/04/2004	US20040217217 Gas supplying apparatus
11/04/2004	US20040217153 Method of integrated circuit assembly
11/04/2004	US20040217150 Method for ablating points of contact (debumping)
11/04/2004	US20040217105 Semiconductor production device ceramic plate
11/04/2004	US20040217104 Low residual-stress brazed terminal for heater
11/04/2004	US20040217100 Electronic part compression bonding apparatus and method
11/04/2004	US20040217088 Selective removal of dielectric materials and plating process using same
11/04/2004	US20040217087 Boron trichloride-based plasma etch
11/04/2004	US20040217086 Pattern formation method
11/04/2004	US20040217085 Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
11/04/2004	US20040217013 Apparatus and method for electropolishing a metal wiring layer on a semiconductor device
11/04/2004	US20040217009 Copper filled submicron apertures free of pits and voids; ion source, electrolyte and polyalkylene oxide random copolymers; printed wiring boards, integrated circuits
11/04/2004	US20040217008 Method for electrolytic copper plating
11/04/2004	US20040217006 Residue removers for electrohydrodynamic cleaning of semiconductors
11/04/2004	US20040217005 Method for electroplating bath chemistry control
11/04/2004	US20040216864 CTE matched application specific heat sink assembly
11/04/2004	US20040216843 Plasm etching device
11/04/2004	US20040216842 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
11/04/2004	US20040216841 Substrate processing apparatus
11/04/2004	US20040216839 degassing and semi-hardening adhesive capable of hardening by heating, discharging desired amount of semi-hardened adhesive on substrate, mounting semiconductor chip to be affixed to substrate; bubble-free
11/04/2004	US20040216772 Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products
11/04/2004	US20040216770 Process for rinsing and drying substrates
11/04/2004	US20040216769 Method of cleaning a plasma processing apparatus
11/04/2004	US20040216766 placing a tool chamber in a clean room, fixing the semiconductor wafer carrier with its opening facing downward in the chamber; nozzle spraying extraction fluid uniformly; collecting said fluid
11/04/2004	US20040216764 Method and system for cleaning a semiconductor wafer
11/04/2004	US20040216763 Process and apparatus for treating a workpiece using ozone
11/04/2004	US20040216762 cork or the said cork-based material is put into contact with a dense fluid under pressure at a temperature of from 10 to 120 degrees C. and at a pressure of from 10 to 600 bars; to remove organic compounds having an undesirable taste, an undesirable smell, or both an undesirable taste and smell
11/04/2004	US20040216692 Automated foot bath apparatus and method
11/04/2004	US20040216678 Wafer Holder for Semiconductor Manufacturing Equipment and Semiconductor Manufacturing Equipment in Which It Is Installed
11/04/2004	US20040216674 Wafer jar loader method, system and apparatus
11/04/2004	US20040216672 Processing apparatus and processing method
11/04/2004	US20040216669 Vaporizer
11/04/2004	US20040216667 Internal member of a plasma processing vessel
11/04/2004	US20040216664 Liquid coating device with barometric pressure compensation
11/04/2004	US20040216641 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
11/04/2004	US20040216536 Handler for testing semiconductor device
11/04/2004	US20040216475 Method and system for controlling chiller and semiconductor processing system
11/04/2004	US20040216389 Chemical mechanical polishing slurry
11/04/2004	US20040216388 Containing nonspherical morphology primary abrasive particles; high throughput manufacturing of high speed integrated circuits having submicron design features and high conductivity interconnect structures; computers, electronics
11/04/2004	US20040216325 Low-pressure dryer and low-pressure drying method
11/04/2004	DE4415567B4 Verfahren zur Erzeugung einer SOI-Struktur mit einer Isolationsschicht auf einem Siliziumwafer und einer darauf epitaktisch aufgebrachten Siliziumschicht A method for producing an SOI structure with an insulating layer on a silicon wafer and a subsequent epitaxially deposited silicon layer
11/04/2004	DE4302396B4 Verfahren zur Herstellung von Dünnschicht-Solarzellen A process for the production of thin film solar cells
11/04/2004	DE19925653B4 System zum Steuern der Ausrichtung eines Substrats System for controlling the alignment of a substrate
11/04/2004	DE19922557B4 Verfahren zum Abscheiden einer TaN/Ta-Zweischicht-Diffusionsbarriere A process for depositing a TaN / Ta two-layer diffusion barrier
11/04/2004	DE19907062B4 Verfahren zur Herstellung eines DRAM-Zellenkondensators A process for preparing a DRAM cell capacitor

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