H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/11/2004	US20040224427 [a detection method for metal contamination and micro particles of a fabrication device]
11/11/2004	US20040224426 Method of using an aqueous solution and composition thereof
11/11/2004	US20040224265 irradiating photoresist film with exposing light while supplying, between projection lens and resist film, a circulating solution of water including antifoaming agent (silicone oil), baking, then developing; for production of semiconductors
11/11/2004	US20040224264 hardening by oxidation provides a selectivity of the top image layer to the underlayer may almost double to an etch selectivity of 1:5
11/11/2004	US20040224262 Direct alignment scheme between multiple lithography layers
11/11/2004	US20040224261 Unitary dual damascene process using imprint lithography
11/11/2004	US20040224255 Fluorinated Si-polymers and photoresists comprising same
11/11/2004	US20040224243 comprises silicon substrate with aperture, silicon oxide film formed on surface, single crystal silicon layer with aperture (for passing exposure beam) formed on film, and stress controlling layer for decreasing warping and high positioning precision; photomasks/photoresists
11/11/2004	US20040224242 forming focus monitor marks and exposure monitor marks on semiconductor wafers/liquid crystal displays, to measure effective exposure
11/11/2004	US20040224241 Thin film transistor array panel, manufacturing method thereof, and mask therefor
11/11/2004	US20040224237 photomasks/photoresists; scanning electron microscopy; microelectronics
11/11/2004	US20040224188 capacitor that improves the interface between the ceramic film and the electrode; improved fatigue characteristics; crystallizing a raw material including a complex oxide by heat treatment in pressure and oxygen;
11/11/2004	US20040224180 Method of manufacturing oxide thin film, method of manufacturing ferroelectric thin film, ferroelectric thin film, ferroelectric memory device, and ferroelectric piezoelectric device
11/11/2004	US20040224142 Method of polishing a semiconductor device
11/11/2004	US20040224128 Low contamination plasma chamber components and methods for making the same
11/11/2004	US20040224125 Ceramic members, a method of producing the same and corrosion resistant members
11/11/2004	US20040224110 one or more component formed by molding a thermoplastic resin which is a polymer resin containing alicyclic structure
11/11/2004	US20040224094 Method of forming a silicon oxide layer in a semiconductor manufacturing process
11/11/2004	US20040224091 forming collar which narrows opening and applying heat/pressure, then reflowing sealing layer; chemical/physical vapor deposition; for use in microelectronics, microelectromechanical systems
11/11/2004	US20040223883 System for determining characteristics of substrates employing fluid geometries
11/11/2004	US20040223639 System for creating an inspection recipe, system for reviewing defects, method for creating an inspection recipe and method for reviewing defects
11/11/2004	US20040223579 Antenna structure for inductively coupled plasma generator
11/11/2004	US20040223531 High efficiency collector for laser plasma EUV source
11/11/2004	US20040223401 Semiconductor integrated-circuit device and method to speed-up CMOS circuit
11/11/2004	US20040223392 Semiconductor memory device
11/11/2004	US20040223390 Resistance variable memory element having chalcogenide glass for improved switching characteristics
11/11/2004	US20040223389 Semiconductor device
11/11/2004	US20040223382 Magnetic memory
11/11/2004	US20040223373 Methods and apparatus for attaching MEMS devices to housing
11/11/2004	US20040223372 Electrically programmable and electrically erasable semiconductor memory device
11/11/2004	US20040223368 Semiconductor device
11/11/2004	US20040223365 Semiconductor device and method for inputting/outputting data simultaneously through single pad
11/11/2004	US20040223356 Non-volatile memory device
11/11/2004	US20040223355 Thin film magnetic memory device including memory cells having a magnetic tunnel junction
11/11/2004	US20040223353 Ternary content addressable memory cell
11/11/2004	US20040223288 Non-linear capacitors
11/11/2004	US20040223286 Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage
11/11/2004	US20040223285 Wafer heating apparatus having electrostatic adsorption function
11/11/2004	US20040223284 Electrostatic attracting method, electrostatic attracting apparatus, and bonding apparatus
11/11/2004	US20040223274 Switching circuit device
11/11/2004	US20040223229 Projecting exposure apparatus
11/11/2004	US20040223166 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
11/11/2004	US20040223144 Rotational stage with vertical axis adjustment
11/11/2004	US20040223142 Method of detecting tightly adhering state, tight adhesion control method and method of and apparatus for near field exposure
11/11/2004	US20040223141 Edge bead removal inspection by reflectometry
11/11/2004	US20040223137 Determination of center of focus by cross-section analysis
11/11/2004	US20040223133 Stage apparatus, exposure system using the same, and device manufacturing method
11/11/2004	US20040223129 Projecting exposure apparatus
11/11/2004	US20040223128 Apparatus for forming pattern
11/11/2004	US20040223127 Lithographic apparatus and method to detect correct clamping of an object
11/11/2004	US20040223090 Liquid crystal display device, manufacturing method thereof, and fabrication apparatus therefor
11/11/2004	US20040222962 Active matrix type display device
11/11/2004	US20040222915 Semiconductor integrated circuit device and audio appliance employing it
11/11/2004	US20040222862 Voltage-controlled oscillator
11/11/2004	US20040222854 High-frequency power amplifier
11/11/2004	US20040222837 Semiconductor integrated circuit and a burn-in method thereof
11/11/2004	US20040222809 System for probing, testing, burn-in, repairing and programming of integrated circuits
11/11/2004	US20040222806 Semiconductor device test method and semiconductor device tester
11/11/2004	US20040222773 Fully integrated DC-to-DC regulator utilizing on-chip inductors with high frequency magnetic materials
11/11/2004	US20040222567 Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same
11/11/2004	US20040222558 Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer
11/11/2004	US20040222534 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222533 Semiconductor device and method of manufacturing the same
11/11/2004	US20040222531 Cu or a Cu alloy wiring; designed with dummy pattern rule; number of contacts determined by width; via hole etching process through wiring layer averts contact defect and degraded reliabilty; circuits
11/11/2004	US20040222530 Semiconductor device having low-k dielectric film in pad region and method for manufacturing thereof
11/11/2004	US20040222529 Dual damascene pattern liner
11/11/2004	US20040222528 Semiconductor device
11/11/2004	US20040222527 Dual damascene pattern liner
11/11/2004	US20040222526 Semiconductor device and manufacturing method thereof
11/11/2004	US20040222525 Advanced VLSI metallization
11/11/2004	US20040222524 Thin film electrode for forming ohmic contact in light emitting diodes and laser diodes using nickel-based solid solution for manufacturing high performance gallium nitride-based optical devices, and method for fabricating the same
11/11/2004	US20040222522 Semiconductor device and manufacturing method of the same
11/11/2004	US20040222521 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
11/11/2004	US20040222520 Integrated circuit package with flat metal bump and manufacturing method therefor
11/11/2004	US20040222513 Semiconductor device and method for manufacturing the same
11/11/2004	US20040222512 Method and system to manufacture stacked chip devices
11/11/2004	US20040222510 Semiconductor device, semiconductor pack age, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device
11/11/2004	US20040222509 Semiconductor device, electronic device, electronic equipment and manufacturing method thereof
11/11/2004	US20040222508 Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222503 Multi-chip package with electrical interconnection
11/11/2004	US20040222501 Chemical vapor deposition epitaxial growth
11/11/2004	US20040222500 Detachable substrate with controlled mechanical hold and method for production thereof
11/11/2004	US20040222499 Group lll nitride compound semiconductor device and method for forming an electrode
11/11/2004	US20040222498 Structure and method of forming a notched gate field effect transistor
11/11/2004	US20040222497 Method to fabricate high-performance npn transistors in a bicmos process
11/11/2004	US20040222496 Method for creation of a very narrow emitter feature and structure provided thereby
11/11/2004	US20040222495 Diffused extrinsic base and method for fabrication
11/11/2004	US20040222493 Capacitor Element and its Manufacturing Method
11/11/2004	US20040222491 Integrated fuse with regions of different doping within the fuse neck
11/11/2004	US20040222490 Trench isolation structures for integrated circuits
11/11/2004	US20040222489 Method for preventing sneakage in shallow trench isolation and STI structure thereof
11/11/2004	US20040222488 High voltage n-ldmos transistors having shallow trench isolation region
11/11/2004	US20040222487 Semiconductor device having a shielding layer
11/11/2004	US20040222486 BiCMOS TECHNOLOGY ON SOI SUBSTRATES
11/11/2004	US20040222485 Bladed silicon-on-insulator semiconductor devices and method of making
11/11/2004	US20040222483 MOS power device with high integration density and manufacturing process thereof
11/11/2004	US20040222477 Multi-height finfets
11/11/2004	US20040222476 Highly reliable amorphous high-k gate dielectric ZrOxNy
11/11/2004	US20040222475 JFET structure for integrated circuit and fabrication method
11/11/2004	US20040222474 Method for making a semiconductor device having a metal gate electrode

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