Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/16/2004US6817640 Four-bar linkage wafer clamping mechanism
11/16/2004US6817486 Photoresist supply apparatus capable of controlling flow length of photoresist and method of supplying photoresist using the same
11/16/2004US6817377 Processing apparatus having integrated pumping system
11/16/2004US6817370 Method for processing the surface of a workpiece
11/16/2004US6817369 Semiconductor wafers
11/16/2004US6817368 Substrate processing method and substrate processing apparatus
11/16/2004US6817096 Method of manufacturing a heat pipe construction
11/16/2004US6817071 Method of manufacturing surface acoustic wave device having bump electrodes
11/16/2004US6817057 Spindle chuck cleaner
11/16/2004US6817052 Apparatuses and methods for cleaning test probes
11/16/2004CA2263241C Cerium oxide abrasive and method of abrading substrates
11/11/2004WO2004097951A1 Method for manufacturing three-dimensional electronic device made or anisotropic material to be processed and its manufacturing apparatus
11/11/2004WO2004097945A1 Method for production of a semiconductor device with auto-aligned metallisations
11/11/2004WO2004097944A2 Silicon carbide mosfets with integrated antiparallel junction barrier schottky free wheeling diodes and methods of fabricating same
11/11/2004WO2004097943A1 Semiconductor device and method for manufacturing same
11/11/2004WO2004097942A1 Semiconductor manufacturing method
11/11/2004WO2004097939A1 Ferroelectric memory device
11/11/2004WO2004097933A2 Method and apparatus for optically aligning integrated circuit devices
11/11/2004WO2004097932A2 Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent cmp process
11/11/2004WO2004097931A1 Method for fabricating semiconductor device
11/11/2004WO2004097930A1 Semiconductor device and method for fabricating the same
11/11/2004WO2004097929A2 Method and apparatus for reduction of defects in wet processed layers
11/11/2004WO2004097928A1 Support holder of the substrate and device for centering or feeding using the same
11/11/2004WO2004097927A1 Purging apparatus and purging method
11/11/2004WO2004097926A1 Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same
11/11/2004WO2004097925A1 Method for manufacturing semiconductor device
11/11/2004WO2004097924A1 Compound semiconductor epitaxial substrate
11/11/2004WO2004097923A1 Method for fabricating semiconductor device
11/11/2004WO2004097922A1 Production method for semiconductor device
11/11/2004WO2004097921A1 Method and apparatus for processing organosiloxane film
11/11/2004WO2004097920A1 Method and apparatus for treating organosiloxane coating film
11/11/2004WO2004097919A1 Process gas introducng mechanism and plasma processing device
11/11/2004WO2004097918A1 Etching liquid, remover liquid and etching method
11/11/2004WO2004097917A1 Method for fabricating semiconductor device, semiconductor wafer and semiconductor device
11/11/2004WO2004097916A1 Method for fabricating semiconductor device, semiconductor wafer and semiconductor device
11/11/2004WO2004097915A1 Droplet discharging device, method for forming pattern and method for manufacturing semiconductor device
11/11/2004WO2004097914A1 Method for manufacturing semiconductor device
11/11/2004WO2004097912A1 Substrate transfer device of thin-film forming apparatus
11/11/2004WO2004097909A2 Method and apparatus for deep trench silicon etch
11/11/2004WO2004097908A1 Method and device for processing discoid substrates
11/11/2004WO2004097907A2 Method for the production of permeable membranes from semiconductor materials using macro- and micro-pore etching
11/11/2004WO2004097904A2 System and method of reducing die attach stress and strain
11/11/2004WO2004097894A2 Self-organized nanopore arrays with controlled symmetry and order
11/11/2004WO2004097881A2 Beam uniformity and angular distribution measurement system
11/11/2004WO2004097859A2 Bidirectional thermal trimming of electrical resistance
11/11/2004WO2004097854A1 Liquid composition for forming ferroelectric thin film and method for forming ferroelectric thin film
11/11/2004WO2004097849A1 Electrode material and semiconductor device
11/11/2004WO2004097836A2 Mirror image memory cell transistor pairs featuring poly floating spacers
11/11/2004WO2004097526A1 Positive photoresist composition and method for forming resist pattern
11/11/2004WO2004097525A1 Photoresist composition and, used in the photoresist composition, low-molecular compound and high-molecular compound
11/11/2004WO2004097524A1 Positive resist composition and method of formation of resist patterns
11/11/2004WO2004097518A2 A method of forming stepped structures employing imprint lithography
11/11/2004WO2004097078A1 Electrolytic processing apparatus and method
11/11/2004WO2004097077A2 Method for the etching of permeable membranes made from semiconductor materials using macro- and meso-pore etching
11/11/2004WO2004096934A1 Coating composition, porous siliceous film, method for preparing porous siliceous film, and semiconductor device
11/11/2004WO2004096679A1 Substrate-levitating device
11/11/2004WO2004096513A2 Metal-plastic composite component and methods for the production thereof
11/11/2004WO2004096492A1 Polishing apparatus
11/11/2004WO2004096491A2 Apparatus and method of securing a workpiece during high-pressure processing
11/11/2004WO2004096483A1 Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
11/11/2004WO2004096451A1 Method for forming pattern and droplet discharging device
11/11/2004WO2004096449A1 Liquid droplet jet device using charged particle beam and method for forming pattern using the device
11/11/2004WO2004084312A3 Semiconductor device with isolation layer
11/11/2004WO2004084264A3 DUAL STRAIN-STATE SiGe LAYERS FOR MICROELECTRONICS
11/11/2004WO2004083328A3 Slurry compositions for use in a chemical-mechanical planarization process having non-spherical abrasive particles
11/11/2004WO2004082018A3 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
11/11/2004WO2004077502A3 Ecr-plasma source and methods for treatment of semiconductor structures
11/11/2004WO2004077501A3 Field-effect transistor and method for manufacturing field-effect transistor
11/11/2004WO2004075266A3 Method for immersing a substrate
11/11/2004WO2004073118A9 Perimeter sealed high density multi-pin connector
11/11/2004WO2004072941A3 Display device with electrostatic discharge protection circuitry
11/11/2004WO2004070071A3 Method of coating microelectronic substrates
11/11/2004WO2004066358A3 Binary half tone photomasks and microscopic three-dimensional devices and method of fabricating the same
11/11/2004WO2004066350A3 Embedded capacitor associated with a sram cell
11/11/2004WO2004061962A3 Multi-layer integrated semiconductor structure
11/11/2004WO2004053937A3 Scalable nano-transistor and memory using back-side trapping
11/11/2004WO2004051701A3 A method for attaching chips to a transponder
11/11/2004WO2004044917A3 A combination nonvolatile memory using unified technology with byte, page and block write and simultaneous read and write operations
11/11/2004WO2004044596A3 Defect analyzer
11/11/2004WO2004037877A9 Organosiloxanes
11/11/2004WO2004027840A3 Process for etching silicon wafers
11/11/2004WO2004025705A3 Organic photosensitive optoelectronic device
11/11/2004WO2004023350A3 Method for checking an integrated circuit for electrostatic discharge robustness
11/11/2004WO2004021420A3 Fabrication method for a monocrystalline semiconductor layer on a substrate
11/11/2004WO2004008499A8 Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
11/11/2004WO2003100833A3 Method of forming quantum dots for extended wavelength operation
11/11/2004US20040225993 Apparatus for evaluating lithography process margin simulating layout pattern of semiconductor device
11/11/2004US20040225985 Method for designing semiconductor circuit device, semiconductor circuit device, design system, and storage medium
11/11/2004US20040225462 Integrated process condition sensing wafer and data analysis system
11/11/2004US20040225453 Optimization method of deposition time and an optimization system of deposition time
11/11/2004US20040225408 Substrate end effector
11/11/2004US20040225399 Wafer assessment apparatus for a single wafer machine and method thereof
11/11/2004US20040225396 Method, device, computer-readable memory and computer program element for the computer-aided monitoring and controlling of a manufacturing process
11/11/2004US20040225393 Vacuum process apparatus and method of operating the same
11/11/2004US20040225385 Method for manufacturing multi-kind and small quantity semiconductor products in a mass- production line and system thereof
11/11/2004US20040225056 Dispersions of organic semiconductors in a solvent mixture of at least two different organic solvents, characterized in that each of the solvents on its own has a boiling point of below 200 degrees C. and a melting point of 15 degrees C. or less
11/11/2004US20040224866 can remove substances strongly attached to the surface of semiconductor substrates without damaging metal wiring and interlayer insulation films; comprises an oxidizing agent, an acid and a fluorine compound, has a pH adjusted in a range of 3 to 10
11/11/2004US20040224623 Polishing pad for cmp, method for polishing substrate using it and method for producing polishing pad for cmp
11/11/2004US20040224616 Polishing pad and chemical mechanical polishing method
11/11/2004US20040224614 Methods of treating surfaces of substrates