H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/11/2004	US20040224613 Polishing apparatus
11/11/2004	US20040224611 Polishing pad and method of polishing a semiconductor wafer
11/11/2004	US20040224538 [rapid thermal annealing process]
11/11/2004	US20040224537 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
11/11/2004	US20040224536 Ambient gas treatment of porous dielectric
11/11/2004	US20040224535 Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
11/11/2004	US20040224534 Method of fabricating silicon nitride nanodots
11/11/2004	US20040224533 Method for increasing polysilicon granin size
11/11/2004	US20040224532 Method of oxidizing a silicon substrate and method of forming an oxide layer using the same
11/11/2004	US20040224531 Method of forming an oxide layer and method of forming an oxinitride layer
11/11/2004	US20040224530 Process for passivating polysilicon and process for fabricating polysilicon thin film transistor
11/11/2004	US20040224529 Method of manufacturing semiconductor device
11/11/2004	US20040224528 Electronic device manufacture
11/11/2004	US20040224527 Atomic layer deposition methods
11/11/2004	US20040224525 Pattern formation method
11/11/2004	US20040224524 Maintaining the dimensions of features being etched on a lithographic mask
11/11/2004	US20040224523 Method of fabricating anti-stiction micromachined structures
11/11/2004	US20040224521 Method to passivate conductive surfaces during semiconductor processing
11/11/2004	US20040224520 Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition
11/11/2004	US20040224519 Process for manufacturing semiconductor wafer and semiconductor wafer
11/11/2004	US20040224518 Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
11/11/2004	US20040224517 Semiconductor device and method of manufacturing the same
11/11/2004	US20040224516 Semiconductor stress buffer coating edge bead removal compositions and method for their use
11/11/2004	US20040224515 Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circut interconnects
11/11/2004	US20040224514 Manufacturing method of semiconductor device
11/11/2004	US20040224513 Fine contact hole forming method employing thermal flow process
11/11/2004	US20040224512 Method of manufacturing semiconductor device
11/11/2004	US20040224511 Metal polishing
11/11/2004	US20040224510 Ozone post-deposition treatment to remove carbon in a flowable oxide film
11/11/2004	US20040224509 Method to remove copper without pattern density effect
11/11/2004	US20040224508 Apparatus and method for cleaning a substrate using a homogenized and non-polarized radiation beam
11/11/2004	US20040224507 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
11/11/2004	US20040224506 Methods of forming metal layers using metallic precursors
11/11/2004	US20040224504 Apparatus and method for plasma enhanced monolayer processing
11/11/2004	US20040224502 Method for fabricating semiconductor device by using PECYCLE-CVD process
11/11/2004	US20040224501 Manufacturing method for making tungsten-plug in an intergrated circuit device without volcano phenomena
11/11/2004	US20040224500 Method of forming metal line of semiconductor device
11/11/2004	US20040224499 Semiconductor device substrate and manufacturing method thereof and semiconductor package
11/11/2004	US20040224498 Contact structure of semiconductor devices and method of fabricating the same
11/11/2004	US20040224497 Method to form selective cap layers on metal features with narrow spaces
11/11/2004	US20040224496 Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques
11/11/2004	US20040224495 Localized doping and /or alloying of metallization for increased interconnect performance
11/11/2004	US20040224494 Method to generate porous organic dielectric
11/11/2004	US20040224493 Semiconductor device and method for fabricating the same
11/11/2004	US20040224491 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
11/11/2004	US20040224490 Apparatus and manufacturing process of carbon nanotube gate field effect transistor
11/11/2004	US20040224489 Member and member manufacturing method
11/11/2004	US20040224488 Method of forming ultra shallow junctions
11/11/2004	US20040224487 Amorphous silicon crystallization method
11/11/2004	US20040224486 Semiconductor film, semiconductor device, and manufacturing method thereof
11/11/2004	US20040224485 Methods of forming capacitors
11/11/2004	US20040224484 Methods of growing nitride-based film using varying pulses
11/11/2004	US20040224483 Semiconductor wafer dividing method and apparatus
11/11/2004	US20040224482 Method for transferring thin film layer material to a flexible substrate using a hydrogen ion splitting technique
11/11/2004	US20040224481 Semiconductor devices, manufacturing methods therefor, circuit substrates and electronic devices
11/11/2004	US20040224480 Micromechanical strained semiconductor by wafer bonding
11/11/2004	US20040224479 Multistep cure technique for spin-on-glass films
11/11/2004	US20040224478 Sacrificial collar method for improved deep trench processing
11/11/2004	US20040224477 Method of producing a high resistivity simox silicon substrate
11/11/2004	US20040224476 Semiconductor integrated circuit device
11/11/2004	US20040224475 Methods of manufacturing semiconductor devices having a ruthenium layer via atomic layer deposition and associated apparatus and devices
11/11/2004	US20040224474 Single mask MIM capacitor top plate
11/11/2004	US20040224473 Using metal peatures to align etches of compound semiconductors
11/11/2004	US20040224472 High voltage MOS transistor with up-retro well
11/11/2004	US20040224471 Integration system via metal oxide conversion
11/11/2004	US20040224470 Method for fabricating a p-type shallow junction using diatomic arsenic
11/11/2004	US20040224469 Method for forming a strained semiconductor substrate
11/11/2004	US20040224468 Method for manufacturing a floating gate of a dual gate of semiconductor device
11/11/2004	US20040224467 Capacitor constructions
11/11/2004	US20040224466 Methods of forming capacitor constructions, and methods of forming constructions comprising dielectric materials
11/11/2004	US20040224465 Random access memory
11/11/2004	US20040224464 Method of making vertical diode structures
11/11/2004	US20040224463 Self-aligned process using indium gallium arsenide etching to form reentry feature in heterojunction bipolar transistors
11/11/2004	US20040224462 Method for forming a dielectric layer and related devices
11/11/2004	US20040224461 Method to fabricate high-performance NPN transistors in a BiCMOS process
11/11/2004	US20040224460 Self-aligned process using indium gallium arsenide etching to form reentry feature in heterojunction bipolar transistors
11/11/2004	US20040224459 Layered structure, method for manufacturing the same, and semiconductor element
11/11/2004	US20040224458 Method and apparatus for manufacturing semiconductor device
11/11/2004	US20040224457 Dual-counterdoped channel field effect transistor and method
11/11/2004	US20040224456 Electro-optic device, method to manufacture the same and electronic apparatus
11/11/2004	US20040224455 Superjunction device and method of manufacture therefore
11/11/2004	US20040224454 Methods of manufacturing integrated circuit devices having contact holes using multiple insulating layers
11/11/2004	US20040224453 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
11/11/2004	US20040224452 Method for fabricating an integrated circuit with a transistor electrode
11/11/2004	US20040224451 Dual gate material process for cmos technologies
11/11/2004	US20040224450 Method of forming insulating film and method of fabricating semiconductor device
11/11/2004	US20040224449 Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device
11/11/2004	US20040224448 Semiconductor thin film, thin film transistor, method for manufacturing same, and manufacturing equipment of semiconductor thin film
11/11/2004	US20040224447 Multi-pattern shadow mask laser annealing system
11/11/2004	US20040224446 [structure of thin-film transistor and method and equipment for fabricating the structure]
11/11/2004	US20040224445 On chip capacitor
11/11/2004	US20040224444 Fuse layout and method of trimming
11/11/2004	US20040224443 Metal programmable integrated circuit capable of utilizing a plurality of clock sources and capable of eliminating clock skew
11/11/2004	US20040224441 Method of manufacturing electronic part, electronic part, method of mounting electronic part, and electronic apparatus
11/11/2004	US20040224440 Method for manufacturing semiconductor laser apparatus
11/11/2004	US20040224439 Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package
11/11/2004	US20040224438 Chip scale surface mounted device and process of manufacture
11/11/2004	US20040224437 Microelectronic devices including underfill apertures
11/11/2004	US20040224436 Method of producing tab tape carrier
11/11/2004	US20040224428 Method of measuring and controlling concentration of dopants of a thin film

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