H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/23/2004	US6821711 Manufacturing method of a phase-shift mask, method of forming a resist pattern and manufacturing method of a semiconductor device
11/23/2004	US6821710 It is preferable to use tungsten, chromium, molybdenum, or titanium, which is superior in absorption of near infrared rays
11/23/2004	US6821705 Radiation-sensitive resin composition
11/23/2004	US6821692 Kind of thin films for microsystem technology and microstructuring and their use
11/23/2004	US6821690 Photomask and method for forming micro patterns of semiconductor device using the same
11/23/2004	US6821689 Using second exposure to assist a PSM exposure in printing a tight space adjacent to large feature
11/23/2004	US6821688 Focus ion beams; accuracy detection, repair defects
11/23/2004	US6821687 Photo mask for fabricating semiconductor device having dual damascene structure
11/23/2004	US6821685 Block mask making method, block mask and exposure apparatus
11/23/2004	US6821684 Method for fabricating mask ROM with self-aligned coding
11/23/2004	US6821683 Miniaturization, high density semiconductor patterns
11/23/2004	US6821682 Repairing defects in a multilayer coating that is deposited onto a reticle blank used in an extreme ultraviolet lithography
11/23/2004	US6821657 Preheating a mixture of an epoxy resin, and organosilicon compound and water prior to adding a curing agent is effective to obtain a thermosetting resin composition which has a low viscosity at a room temperature
11/23/2004	US6821617 Wafer and production thereof
11/23/2004	US6821577 Staggered in-situ deposition and etching of a dielectric layer for HDP CVD
11/23/2004	US6821572 Nitriding with plasma gas hydrogen and nitrogen, removing nitrides film residues with chlorine gas in situ
11/23/2004	US6821571 Post-deposition treating a carbon-containing layer on a substrate, comprising exposing the carbon-containing layer to a treatment plasma
11/23/2004	US6821566 Silicon oxide film is formed on surface of silicon wafer by oxidation, then annealing and nitriding; semiconductors
11/23/2004	US6821563 Gas distribution system for cyclical layer deposition
11/23/2004	US6821554 Polyol-based method for forming thin film aerogels on semiconductor substrates
11/23/2004	US6821550 Apparatus and method for applying process solution
11/23/2004	US6821452 Etchant
11/23/2004	US6821451 Dry etching method, microfabrication process and dry etching mask
11/23/2004	US6821409 Electroetching methods and systems using chemical and mechanical influence
11/23/2004	US6821380 Temperature adjustment apparatus
11/23/2004	US6821377 Plasma processing apparatus
11/23/2004	US6821376 Method for separating two elements and a device therefor
11/23/2004	US6821375 Method and apparatus for mounting semiconductor chips onto a flexible substrate
11/23/2004	US6821352 Compositions for removing etching residue and use thereof
11/23/2004	US6821349 Wet etching, cleaning, rinsing integrated circuits or liquid crystal displays
11/23/2004	US6821348 Aperture mask patterns; elongated web of flexible film; integrated circuits
11/23/2004	US6821344 Czochralski pullers including heat shield housings having sloping top and bottom
11/23/2004	US6821343 Semiconductor device, manufacturing method therefor, and semiconductor manufacturing apparatus
11/23/2004	US6821341 Precursor for use in preparing layers on substrates
11/23/2004	US6821340 Method of manufacturing silicon carbide, silicon carbide, composite material, and semiconductor element
11/23/2004	US6821309 Applying slurry to soft surface layer
11/23/2004	US6821187 Method for chemical-mechanical polishing of a layer which is a substrate and is a metal selected from a platinum group
11/23/2004	US6821176 Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method
11/23/2004	US6821109 Resin material supply apparatus and method
11/23/2004	US6821082 Wafer management system and methods for managing wafers
11/23/2004	US6821073 Container handling system for substrate processing apparatus and method of handling containers
11/23/2004	US6820797 System and method for seal formation
11/23/2004	US6820795 Joined article of a supporting member for a semiconductor wafer and a method of producing the same
11/23/2004	US6820793 Apparatus for the transport and equipping of substrates with semiconductor chips
11/23/2004	US6820792 Die bonding equipment
11/23/2004	US6820508 Apparatus for rotating a sample
11/23/2004	US6820349 End effector alignment tool for substrate handling system
11/23/2004	US6820329 Method of manufacturing multi-chip stacking package
11/23/2004	US6820325 Integrated air flow control for a pick and place spindle assembly
11/23/2004	US6820298 Wafer scrubbing device having brush assembly and mounting assembly forming spherical joint
11/23/2004	CA2277346C Aluminum nitride sintered body and method of preparing the same
11/23/2004	CA2171307C Scan test circuit using fast transmission gate switch
11/18/2004	WO2004100628A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof
11/18/2004	WO2004100625A1 Rf module and production method thereof
11/18/2004	WO2004100623A2 Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method
11/18/2004	WO2004100621A1 Laser plasma producing method and device
11/18/2004	WO2004100290A2 Multi-height finfets
11/18/2004	WO2004100273A1 Solar cell and process for producing the same
11/18/2004	WO2004100269A1 Thin film type image sensor of high aperture ratio and a method for manufacturing thereof
11/18/2004	WO2004100268A1 Substrate, manufacturing method therefor, and semiconductor device
11/18/2004	WO2004100267A1 Cubic memory array
11/18/2004	WO2004100261A2 Semiconductor wafer, panel and electronic component comprising stacked semiconductor chips, and method for the production thereof
11/18/2004	WO2004100259A2 Semi-conductor component and method for the production of a semi-conductor component
11/18/2004	WO2004100258A2 Ribbon bonding
11/18/2004	WO2004100257A1 Method to form selective cap layers on metal features with narrow spaces
11/18/2004	WO2004100256A1 Device comprising a semiconductor circuit
11/18/2004	WO2004100255A1 Method of making a low profile packaged semiconductor device
11/18/2004	WO2004100254A1 Substrate suction device
11/18/2004	WO2004100253A2 Electronic component as well as system support and panel for the production thereof
11/18/2004	WO2004100252A1 Separating and assembling semiconductor strips
11/18/2004	WO2004100251A1 Method and apparatus for the multiplexed acquisition of a bare die from a wafer
11/18/2004	WO2004100250A1 A thin-film solar cell
11/18/2004	WO2004100249A1 Vaporizer and semiconductor processing apparatus
11/18/2004	WO2004100248A1 Substrate processing apparatus
11/18/2004	WO2004100247A1 Plasma etching chamber and plasma etching system using same
11/18/2004	WO2004100246A1 Method for cleaning semiconductor processing apparatus
11/18/2004	WO2004100245A1 Removal of post-etch residues in semiconductor processing
11/18/2004	WO2004100244A1 Method for texturing surfaces of silicon wafers
11/18/2004	WO2004100243A1 Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using same
11/18/2004	WO2004100242A1 Polishing liquid for cmp process and polishing method
11/18/2004	WO2004100241A1 Washing apparatus, washing system, and washing method
11/18/2004	WO2004100240A1 Method and device for dividing plate-like member
11/18/2004	WO2004100239A1 Structure and method of forming a notched gate field effect transistor
11/18/2004	WO2004100238A1 Monocrystalline diamond layer and method for the production thereof
11/18/2004	WO2004100235A1 Method of processing resist, semiconductor device, and method of producing the device
11/18/2004	WO2004100234A1 Processing schedule making method, coating/developing apparatus, pattern forming device, and processing system
11/18/2004	WO2004100233A1 Semiconductor substrate and manufacturing method therefor
11/18/2004	WO2004100232A1 Method for forming the top plate of a mim capacitor with a single mask in a copper dual damascene integration scheme
11/18/2004	WO2004100231A2 Oblique ion milling of via metallization
11/18/2004	WO2004100230A2 Method for reducing short channel effects in memory cells and related structure
11/18/2004	WO2004100223A2 Semiconductor fabrication process with asymmetrical conductive spacers
11/18/2004	WO2004100206A1 Electron beam device, electron beam inspection method, electron beam inspection device, pattern inspection method and exposure condition determination method
11/18/2004	WO2004100169A2 Mram architecture with a bit line located underneath the magnetic tunneling junction device
11/18/2004	WO2004100110A1 Active matrix panel inspection device, inspection method, and active matrix oled panel manufacturing method
11/18/2004	WO2004099960A1 Fully integrated dc-dc converter utilizing on-chip high frequency inductors
11/18/2004	WO2004099879A2 Method of detecting relative position of exposure mask and object to be exposed, alignment method, and exposure method using the same
11/18/2004	WO2004099792A2 Planarizing and testing of bga packages
11/18/2004	WO2004099473A1 Semiconductor substrate, semiconductor device, light emitting diode and producing method therefor
11/18/2004	WO2004099472A1 Iii-v compound semiconductor crystal and method for production thereof
11/18/2004	WO2004099471A2 Method of forming a layer of silicon carbide on a silicon wafer

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