H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/18/2004	US20040226655 Substrate processing apparatus
11/18/2004	US20040226654 Substrate processing apparatus and substrate processing method
11/18/2004	US20040226653 Adhesive setting apparatus and method of setting adhesive
11/18/2004	US20040226595 Collapsible play structures
11/18/2004	US20040226588 Cleaning apparatus
11/18/2004	US20040226582 Apparatus and method for substrate processing
11/18/2004	US20040226518 Outer tube made of silicon carbide and thermal treatment system for semiconductors
11/18/2004	US20040226517 [cassette for a load-lock]
11/18/2004	US20040226516 Wafer pedestal cover
11/18/2004	US20040226515 Heat transfer assembly
11/18/2004	US20040226514 Substrate support assembly
11/18/2004	US20040226513 Chamber for uniform heating of large area substrates
11/18/2004	US20040226510 Semiconductor processing apparatus having lift and tilt mechanism
11/18/2004	US20040226509 Film deposition method and film deposition system for depositing a halogen compound film, and magnesium fluroide film
11/18/2004	US20040226506 Coated wafer processing equipment
11/18/2004	US20040226505 Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle
11/18/2004	US20040226390 Sensor signal transmission from processing system
11/18/2004	US20040226186 Apparatus for drying semiconductor substrates using azeotrope effect and drying method using the apparatus
11/18/2004	US20040226185 Method for drying washed objects
11/18/2004	DE202004010376U1 Chip package used e.g. in flip-chip and wafer construction, includes metal plate at rear of chip, made of selected alloy having similar coefficient of thermal expansion to that of board
11/18/2004	DE202004009712U1 Heat sink has a base with a corrugated surface in which grooves are machined perpendicular to the projections from the base and with heat dissipation plates embedded in the grooves and clamped to each other
11/18/2004	DE19638630B4 UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen UV and thermally curable casting resin formulation and their use for Unterfüllprozeß in electrical and electronic components
11/18/2004	DE19608211B4 Verfahren zur Ausbildung von feinen Metallmustern in Halbleitereinrichtungen A method for the formation of fine metal patterns in semiconductor devices
11/18/2004	DE10318847A1 Integrated circuit having two circuit parts on the same wafer made using specific first and second exposure masks from sets of masks specific to that circuit part
11/18/2004	DE10317381A1 Vertical power transistor for minimizing switching loss in double-defused metal oxide semiconductor transistors has a body zone applied on a semiconductor with first/second-mode conductivity doping
11/18/2004	DE10317096A1 Production of a complementary transistor with silicon-germanium base regions comprises forming collector regions next to each other on a wafer, and depositing a silicon layer displaced with germanium in steps via each collector regions
11/18/2004	DE10317018A1 Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten Multi-chip module with a plurality of semiconductor chips and printed circuit board with multiple components
11/18/2004	DE10316530A1 Production of a semiconductor component comprises preparing a semiconductor body with a dopant and with a trench protruding from a first surface into the semiconductor body, and further processing
11/18/2004	DE10313127A1 Process for preventing short circuiting in silicon wafers used in the semiconductor and solar cell industries comprises etching the lower sides of the wafers to remove the layer doped with phosphorus
11/18/2004	DE10297535T5 Verfahren zur Herstellung eines Hochspannungs-MOS-Transistors durch Ionen-Implantation A method for producing a high voltage MOS transistor by ion implantation
11/18/2004	DE102004017836A1 Flip Chip Bonder Flip Chip Bonder
11/18/2004	DE102004017182A1 Verfahren zur Fertigung eines Halbleiterwafers A method for manufacturing a semiconductor wafer
11/18/2004	DE102004016963A1 Adhäsionsschicht für Pt auf SiO2 Adhesion of Pt on SiO2
11/18/2004	DE102004016700A1 Verfahren zur Bildung von Saliziden A method of forming Saliziden
11/18/2004	DE102004014703A1 Wärmeverteilermodul und Verfahren zur Herstellung desselben Heat spreader module and method of manufacturing the same
11/18/2004	DE102004014185A1 Probenstift-Reinigungsvorrichtung Samples pen-cleaning device
11/18/2004	DE102004002707A1 Handler zum Testen von Halbleitervorrichtungen Handler for the testing of semiconductor devices
11/18/2004	DE10144409B4 Vorrichtung mit einem Greifer zur Handhabung von Platten A device with a gripper for handling of plates
11/18/2004	DE10000191B4 Projektbelichtungsanlage der Mikrolithographie Project exposure system for microlithography
11/17/2004	EP1478212A1 Organic electroluminescence display and its manufacturing method
11/17/2004	EP1478029A1 Mos transistor and method of fabricating the same
11/17/2004	EP1478027A1 Magnetic memory device and its production method
11/17/2004	EP1478023A1 Module part
11/17/2004	EP1478021A1 Semiconductor device and manufacturing method thereof
11/17/2004	EP1478016A2 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate
11/17/2004	EP1478015A2 Discrete semiconductor device with flip-chip arrangement
11/17/2004	EP1478014A1 Improved production method for QFN leadframes
11/17/2004	EP1478013A2 Split-gate metal-oxide-semiconductor device
11/17/2004	EP1478012A1 Polishing method and polishing fluid
11/17/2004	EP1478011A1 Method and device for polishing
11/17/2004	EP1478009A1 Semiconductor wafer manufacturing method, semiconductor wafer manufacturing order acceptance method, and semiconductor wafer manufacturing order acceptance system
11/17/2004	EP1478008A1 Automation system for semiconductor manufacturing
11/17/2004	EP1477861A1 A method of calibrating a lithographic apparatus, an alignment method, a computer program, a lithographic apparatus and a device manufacturing method
11/17/2004	EP1477859A1 Composition for removal of sidewall polymer and etchant residues without a separate solvent rinse step
11/17/2004	EP1477858A2 Lithographic apparatus, device manufacturing method, and device manufactured thereby
11/17/2004	EP1477856A1 Lithographic apparatus and device manufacturing method
11/17/2004	EP1477855A1 Lithographic apparatus and device manufacturing method
11/17/2004	EP1477854A2 Projection optical system
11/17/2004	EP1477853A2 Optical element holder, exposure apparatus, and device fabricating method
11/17/2004	EP1477852A1 Lithographic apparatus, device manufacturing method, and device manufactured thereby
11/17/2004	EP1477851A1 Device manufacturing method and lithographic apparatus
11/17/2004	EP1477850A1 Lithographic apparatus and device manufacturing method
11/17/2004	EP1477849A2 Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size
11/17/2004	EP1477848A1 Radiation-sensitive resin composition
11/17/2004	EP1477847A1 Resist material and microfabrication method
11/17/2004	EP1477841A1 Liquid crystal display device and manufacturing method thereof
11/17/2004	EP1477717A1 Tube device, and piping system including the tube device
11/17/2004	EP1477588A1 Copper Electroplating composition for wafers
11/17/2004	EP1477580A2 Deposition method using multiple deposition chambers
11/17/2004	EP1477538A1 Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
11/17/2004	EP1477467A1 Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate
11/17/2004	EP1477438A2 Conveyor belt cleaner scraper blade with sensor and control system therefor
11/17/2004	EP1477048A1 Method for embedding a component in a base
11/17/2004	EP1476909A2 Silver-selenide/chalcogenide glass stack for resistance variable memory
11/17/2004	EP1476905A1 Integrated read-only memory, method for operating said read-only memory and corresponding production method
11/17/2004	EP1476903A2 A method of calibrating and using a semiconductor processing system
11/17/2004	EP1476902A2 Electronic component with an adhesive layer and method for the production thereof
11/17/2004	EP1476901A1 Method of forming a vertical double gate semiconductor device and structure thereof
11/17/2004	EP1476900A2 Oxide layer on a gaas-based semiconductor structure and method of forming the same
11/17/2004	EP1476899A1 Method of forming layers of oxide of different thicknesses on a surface of a substrate
11/17/2004	EP1476898A1 Method for production of a layer of silicon carbide or a nitride of a group iii element on a suitable substrate
11/17/2004	EP1476897A1 Irreversible reduction of the value of a polycrystalline silicon resistor
11/17/2004	EP1476896A1 Heated substrate support
11/17/2004	EP1476895A2 High voltage power mosfet having low on-resistance
11/17/2004	EP1476894A2 High voltage power mosfet having a voltage sustaining region that includes doped columns formed by trench etching and diffusion from regions of oppositely doped polysilicon
11/17/2004	EP1476891A1 Sputtering cathode and device and method for coating a substrate with several layers
11/17/2004	EP1476875A1 Mram without isolation devices
11/17/2004	EP1476872A1 Extraction of a binary code from physical parameters of an integrated circuit
11/17/2004	EP1476788A2 Fluorinated molecules and methods of making and using same
11/17/2004	EP1476519A1 Process for chemical-mechanical polishing of metal substrates
11/17/2004	EP1476500A1 Method of making a nanoporous film
11/17/2004	EP1476380A2 Local store for a wafer processing station
11/17/2004	EP1451890A4 Switch circuit and method of switching radio frequency signals
11/17/2004	EP1382010B1 Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
11/17/2004	EP1358670A4 Process and apparatus for removing residues from the microstructure of an object
11/17/2004	EP1313540A4 Fluid media particle isolating system
11/17/2004	EP1299210A4 Polishing pad grooving method and apparatus
11/17/2004	EP1185841B1 Measuring positions or coplanarity of contact elements of an electronic component with a flat illumination and two cameras
11/17/2004	EP1116274B1 Electronic switching device with at least two semiconductor components
11/17/2004	EP1036085A4 Self-addressable self-assembling microelectronic integrated systems, component devices, mechanisms, methods, and procedures for molecular biological analysis and diagnostics

1 ... 4085 4086 4087 4088 4089 4090 4091 4092 4093 4094 4095 4096 4097 4098 4099 4100 4101 4102 4103 4104 4105 ... 6590