Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2005
03/24/2005US20050064614 Method of processing substrate and chemical used in the same
03/24/2005US20050064612 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
03/24/2005US20050064611 Method of screening semiconductor device
03/24/2005US20050064610 Site-specific methodology for localization and analyzing junction defects in mosfet devices
03/24/2005US20050064609 Semiconductor processing system
03/24/2005US20050064608 Versatile system for controlling semiconductor topography
03/24/2005US20050064607 Magnetically shielded circuit board
03/24/2005US20050064341 Composition containing a photoacid generator monomer, substrate coated with the composition, method for synthesizing a compound on a substrate using the composition, and microarray produced according to the method
03/24/2005US20050064329 Positive resist composition and pattern formation method using the same
03/24/2005US20050064327 Positive resist composition and process for forming pattern using the same
03/24/2005US20050064326 Positive resist composition and pattern-forming method using the same
03/24/2005US20050064321 Positive photoresist composition for liquid crystal device
03/24/2005US20050064304 Phase shifting for changing the phase of transmitted exposure light, having an optical transmissivity different from the mask substrate; etching the substrate to change the phase of the transmitted light; shielding layer is formed of chromium or molybdenum silicon oxynitride; semiconductor
03/24/2005US20050064302 Method and system for forming a mask pattern, method of manufacturing a semiconductor device, system forming a mask pattern on data, cell library and method of forming a photomask
03/24/2005US20050064301 Forming a first fine pattern which has a fine opening, having a size of not more than a wavelength of exposure light; forming a second mask; for use with microprocessing in a short time; microlithography
03/24/2005US20050064300 The light-shielding layer is patterned to form a main pattern and a phantom pattern; eliminate optical proximity effects; substrate with the phantom pattern can be narrower; etched to form trenches in the substrate; photolithographic process to make semiconductor wafer
03/24/2005US20050064248 Cerium oxide containing ceramic components and coatings in semiconductor processing equipment and methods of manufacture thereof
03/24/2005US20050064247 Composite refractory metal carbide coating on a substrate and method for making thereof
03/24/2005US20050064235 Anode, a hole- transporting layer disposed over the anode; a light-emitting layer disposed over the hole-transporting layer for producing blue light in response to hole-electron recombination, wherein at least one dopant material; a
03/24/2005US20050064207 System and method for forming multi-component dielectric films
03/24/2005US20050064206 Gallium-nitride deposition substrate, method of manufacturing gallium-nitride deposition substrate,and method of manufacturing
03/24/2005US20050064204 Improved permittivity, permeability, electroconductivity, thermoconductivity, and nonlinear optic properties; electrical resistance
03/24/2005US20050064201 Resin composition for encapsulating semiconductor device
03/24/2005US20050064199 Silicon oxide-containing layer is formed on surface of polyimide layer
03/24/2005US20050064197 Graded material and method for synthesis thereof and method for processing thereof
03/24/2005US20050064185 Multicolor light-emitting diodes
03/24/2005US20050064157 Magnetic memory and method of operation thereof
03/24/2005US20050064139 Sheet material having metal points and method for the production thereof
03/24/2005US20050064111 Method for forming doping superlattices using standing electromagnetic waves
03/24/2005US20050064109 Method of forming an ultrathin nitride/oxide stack as a gate dielectric
03/24/2005US20050064106 Method for bonding heat sinks to overmold material and resulting structure
03/24/2005US20050064103 Method for forming periodic electronic potential structures in bulk solids using standing electromagnetic waves
03/24/2005US20050064098 thin metal films by atomic layer deposition: tungsten nucleation layer over a silicon wafer; copper film from CuCl and triethylboron; vapor phase pulses in inert gas
03/24/2005US20050064091 Forming wiring and photoresist patterns by ejecting liquid droplets from different heads using piezoelectric elements for example; simplification, less waste than conventional photolithography and spin coating process; liquid crystal displays
03/24/2005US20050064065 Apparatus for molding a semiconductor wafer and process therefor
03/24/2005US20050064054 Pattern forming apparatus
03/24/2005US20050063894 Dispersion management optical lithography crystals for below 160nm optical lithography & method thereof
03/24/2005US20050063800 Substrate support
03/24/2005US20050063799 Reduced footprint tool for automated processing of microelectronic substrates
03/24/2005US20050063797 FOUP door transfer system
03/24/2005US20050063791 Inline transfer system and method
03/24/2005US20050063699 Developing method for semiconductor substrate
03/24/2005US20050063580 Method and system for positioning articles with respect to a processing tool
03/24/2005US20050063453 Temperature measurement and heat-treating metods and system
03/24/2005US20050063451 Temperature measuring system, heating device using it and production method for semiconductor wafer, heat ray insulating translucent member, visible light reflection membner, exposure system-use reflection mirror and exposure system, and semiconductor device produced by using them and vetical heat treating device
03/24/2005US20050063448 Apparatus and method for thermal processing of substrate
03/24/2005US20050063437 Vertical-cavity surface emitting laser diode and method for producing the same
03/24/2005US20050063244 Field effect devices having a gate controlled via a nanotube switching element
03/24/2005US20050063238 Semiconductor memory device
03/24/2005US20050063237 Memory cell unit, nonvolatile semiconductor storage device including memory cell unit, and memory cell array driving method
03/24/2005US20050063235 PFET nonvolatile memory
03/24/2005US20050063233 Memory cell and method for forming the same
03/24/2005US20050063223 Thermal-assisted switching array configuration for mram
03/24/2005US20050063221 Magnetic storage device, writing method for magnetic storage device and manufacturing method for magnetic storage device
03/24/2005US20050063215 Nonvolatile semiconductor memory device having double floating gate structure and method of manufacturing the same
03/24/2005US20050063210 Hybrid circuit having nanotube electromechanical memory
03/24/2005US20050063209 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield
03/24/2005US20050063208 Methods of fabricating flash memory cell having split-gate structure using spacer oxidation process
03/24/2005US20050063164 Integrated circuit die/package interconnect
03/24/2005US20050063141 Analog capacitor having at least three high-k dielectric layers, and method of fabricating the same
03/24/2005US20050063140 MIM multilayer capacitor
03/24/2005US20050063139 Dual mask capacitor for integrated circuits
03/24/2005US20050063138 Dual mask capacitor for integrated circuits
03/24/2005US20050063136 Decoupling capacitor and method
03/24/2005US20050063134 On-chip bypass capacitor and method of manufacturing the same
03/24/2005US20050063129 Static electricity protective circuit and high-frequency circuit apparatus incorporating the same
03/24/2005US20050063112 Semiconductor device and system
03/24/2005US20050063033 Microelectronic devices and methods for packaging microelectronic devices
03/24/2005US20050063030 Method of hologram exposure, mask for hologram exposure, semiconductor device, and electronic equipment
03/24/2005US20050062980 Reticle focus measurement system using multiple interferometric beams
03/24/2005US20050062965 Method and apparatus for measurements of patterned structures
03/24/2005US20050062963 Method and its apparatus for inspecting a pattern
03/24/2005US20050062961 Apparatus and method for inspecting pattern
03/24/2005US20050062952 Apparatus for processing substrate and method of doing the same
03/24/2005US20050062951 Edge exposing apparatus
03/24/2005US20050062948 Imaging apparatus
03/24/2005US20050062947 Near-field exposure apparatus
03/24/2005US20050062922 Liquid crystal display and method of manufacturing the same
03/24/2005US20050062898 Liquid crystal display device with a substrate having an opening on an organic film thereof to accommodate sealing material therethrough
03/24/2005US20050062586 High performance voltage control diffusion resistor
03/24/2005US20050062575 Integrated transformer
03/24/2005US20050062553 Radio frequency voltage controlled oscillator
03/24/2005US20050062502 Logic circuit whose power switch is quickly turned on and off
03/24/2005US20050062491 Process monitor for monitoring and compensating circuit performance
03/24/2005US20050062489 Probe station having multiple enclosures
03/24/2005US20050062465 Method and system for loading substrate supports into a substrate holder
03/24/2005US20050062431 Plasma etcher
03/24/2005US20050062409 Display device and manufacturing method of display device
03/24/2005US20050062406 Organic electroluminescent device and manufacturing method thereof
03/24/2005US20050062388 Heat-treating methods and systems
03/24/2005US20050062302 Low maintenance vacuum generation
03/24/2005US20050062301 Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
03/24/2005US20050062199 Method and device for encapsulating electronic components while exerting fluid pressure
03/24/2005US20050062175 Method of increasing a free carrier concentration in a semiconductor substrate
03/24/2005US20050062173 Microelectronic substrates with integrated devices
03/24/2005US20050062172 Semiconductor package
03/24/2005US20050062171 Bridge connection type of chip package and fabricating method thereof
03/24/2005US20050062170 Method of forming a bond pad on an I/C chip and resulting structure
03/24/2005US20050062169 Designs and methods for conductive bumps
03/24/2005US20050062168 Bonded structure using conductive adhesives, and a manufacturing method thereof