Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2005
03/22/2005US6869846 Forming electronic structures having dual dielectric thicknesses and the structure so formed
03/22/2005US6869845 Semiconductor memory device having a memory region and a peripheral region, and a manufacturing method thereof
03/22/2005US6869844 Method and structure for protecting NROM devices from induced charge damage during device fabrication
03/22/2005US6869843 Non-volatile memory cell with dielectric spacers along sidewalls of a component stack, and method for forming same
03/22/2005US6869842 Method for manufacturing non-volatile memory cell
03/22/2005US6869840 Compensated-well electrostatic discharge protection devices
03/22/2005US6869839 Method of fabricating a semiconductor device having an L-shaped spacer
03/22/2005US6869838 Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
03/22/2005US6869837 Methods of fabricating a word-line spacer for wide over-etching window on outside diameter (OD) and strong fence
03/22/2005US6869836 ILD stack with improved CMP results
03/22/2005US6869835 Method of forming MOS transistor
03/22/2005US6869834 Method of forming a low temperature polysilicon thin film transistor
03/22/2005US6869833 Method of manufacturing a thin film transistor of a liquid crystal display
03/22/2005US6869832 Method for planarizing bumped die
03/22/2005US6869831 Adhesion by plasma conditioning of semiconductor chip surfaces
03/22/2005US6869830 Method of processing a semiconductor wafer
03/22/2005US6869828 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
03/22/2005US6869827 Semiconductor/printed circuit board assembly, and computer system
03/22/2005US6869826 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2005US6869824 Fabrication method of window-type ball grid array semiconductor package
03/22/2005US6869823 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device
03/22/2005US6869822 Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening
03/22/2005US6869821 Method for producing organic electronic devices on deposited dielectric materials
03/22/2005US6869819 Recognition method of a mark provided on a semiconductor device
03/22/2005US6869818 Method for producing and testing a corrosion-resistant channel in a silicon device
03/22/2005US6869814 Silicon-based ultra-violet LED
03/22/2005US6869813 Chip-type LED and process of manufacturing the same
03/22/2005US6869811 Methods for transfer molding encapsulation of a semiconductor die with attached heat sink
03/22/2005US6869810 Manufacturing method of semiconductor device
03/22/2005US6869809 Wafer level testing and bumping process
03/22/2005US6869808 Method for evaluating property of integrated circuitry
03/22/2005US6869807 Method and its apparatus for manufacturing semiconductor device
03/22/2005US6869806 Method and apparatus for the production of a semiconductor compatible ferromagnetic film
03/22/2005US6869752 Forming a high melting-point metal on an SOI (Silicon-on-Insulator) layer; transforming a layer of the high melting-point metal into a metal silicide layer by heat treatment; forming an interlayer insulating film; dry etching
03/22/2005US6869750 Structure and method for forming a multilayered structure
03/22/2005US6869748 Resist composition and patterning process
03/22/2005US6869747 Organic polymeric antireflective coatings deposited by chemical vapor deposition
03/22/2005US6869745 Acid generating agent which is an onium salt with a fluoroalkyl sulfonate ion; interpolymer of vinylphenol, styrene and an alkyl (meth)acrylate; solubility-reducing group capable of being eliminated by acid
03/22/2005US6869742 Alkali-soluble novolak resin containing 1,2-naphthoquinonediazidosulfonyl groups
03/22/2005US6869738 The serifs or pattern combine to produce an optical proximity correction that reduces corner rounding and increases edge straightness in the resist pattern
03/22/2005US6869737 Method for exposing a photosensitive resist layer with near-field light
03/22/2005US6869736 Halftone phase shift photomask and blank for halftone phase shift photomask
03/22/2005US6869735 Method of pattern layout of a photomask for pattern transfer
03/22/2005US6869732 Glass substrate for photomasks and preparation method
03/22/2005US6869702 Substrate for epitaxial growth
03/22/2005US6869689 Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials
03/22/2005US6869640 Coating film forming method and coating film forming apparatus
03/22/2005US6869638 Source reagent compositions for CVD formation of gate dielectric thin films using amide precursors and method of using same
03/22/2005US6869542 Hard mask integrated etch process for patterning of silicon oxide and other dielectric materials
03/22/2005US6869516 Spraying a vapor mixture of isopropyl alcohol and nitrogen to effectively remove electrolyte residue from the contact ring
03/22/2005US6869515 Providing substrate with electroconductive surface; providing electrochemical deposition cell; immersing substrate in electrolyte; providing uniform powerful turbulent agitation; providing electroplating current for filling openings
03/22/2005US6869510 Methods and apparatus for processing the surface of a microelectronic workpiece
03/22/2005US6869500 Method for processing a wafer and apparatus for performing the same
03/22/2005US6869499 Substrate processing method and substrate processing apparatus
03/22/2005US6869498 Chemical mechanical polishing with shear force measurement
03/22/2005US6869491 Bonding method
03/22/2005US6869487 Process and apparatus for treating a workpiece such as a semiconductor wafer
03/22/2005US6869486 Such as copper contamination, removal agent is preferably a chelating agent
03/22/2005US6869485 Compact process chamber for improved process uniformity
03/22/2005US6869482 Apparatus for manufacturing a dry sheet from a slurry
03/22/2005US6869481 Method and device for regulating the differential pressure in epitaxy reactors
03/22/2005US6869478 Method for producing silicon single crystal having no flaw
03/22/2005US6869457 Clean room for semiconductor device
03/22/2005US6869339 Polishing pad and method of manufacture
03/22/2005US6869337 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
03/22/2005US6869336 Planarization composition causes the ruthenium to be removed from the work piece as a ruthenium oxide
03/22/2005US6869332 Chemical mechanical polishing of a metal layer with polishing rate monitoring
03/22/2005US6869289 Multicontact electric connector
03/22/2005US6869266 Apparatus and methods for manipulating semiconductor wafers
03/22/2005US6869264 Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
03/22/2005US6869263 Substrate loading and unloading station with buffer
03/22/2005US6869262 Vacuum apparatus and transfer apparatus
03/22/2005US6869215 Method and apparatus for detecting contaminants in ion-implanted wafer
03/22/2005US6869008 Method of forming bumps
03/22/2005US6868970 Stackable tray for integrated circuits with corner support elements and lateral support elements forming matrix tray capture system
03/22/2005US6868888 Thin film forming apparatus, film supplier, film cassette, transport mechanism and transport method
03/22/2005US6868869 Sub-atmospheric pressure delivery of liquids, solids and low vapor pressure gases
03/22/2005US6868867 Fluid control apparatus
03/22/2005US6868733 Sensor having membrane and method for manufacturing the same
03/19/2005CA2482058A1 Method of fabricating semiconductor components through implantation and diffusion in a semiconductor substrate
03/19/2005CA2481834A1 Dmos-transistor with lateral dopant gradient in drift region and method of producing the same
03/17/2005WO2005025276A1 Highly efficient organic light emitting device using substrate having nanosized hemispherical recesses and method for preparing the same
03/17/2005WO2005025019A1 InGaAs/GaAs LASERS ON SILICON PRODUCED BY LEPECVD AND MOCVD
03/17/2005WO2005024972A2 Method for producing electronic components
03/17/2005WO2005024959A1 Adjustment of masks by re-flow
03/17/2005WO2005024957A1 Semiconductor device and method for manufacturing same
03/17/2005WO2005024956A1 Electrode substrate, thin-film transistor, display, and its production method
03/17/2005WO2005024954A1 Semiconductor component and method of manufacturing same
03/17/2005WO2005024953A1 An enhanced gate structure
03/17/2005WO2005024950A1 Semiconductor device and method for manufacturing same
03/17/2005WO2005024947A1 Circuit device and method for manufacturing same
03/17/2005WO2005024945A1 Integrated circuit component and mounting method
03/17/2005WO2005024944A1 Lead frame and method of manufacturing the lead frame
03/17/2005WO2005024939A1 SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS
03/17/2005WO2005024938A1 Solvent-modified resin compositions and methods of use thereof
03/17/2005WO2005024936A2 Support for vertically-oriented capacitors during the formation of a semiconductor device
03/17/2005WO2005024935A1 Semiconductor device
03/17/2005WO2005024934A1 Multi-purpose metallic sealing
03/17/2005WO2005024933A1 Semiconductor device manufacturing method
03/17/2005WO2005024932A2 Apparatus and method for removing semiconductor chip
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