Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2005
03/29/2005US6872657 Method to form copper seed layer for copper interconnect
03/29/2005US6872656 Semiconductor device and method of fabricating the same
03/29/2005US6872655 Method of forming an integrated circuit thin film resistor
03/29/2005US6872654 Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric
03/29/2005US6872653 Manufacturing method of semiconductor device
03/29/2005US6872652 Method of cleaning an inter-level dielectric interconnect
03/29/2005US6872651 Manufacturing a bump electrode with roughened face
03/29/2005US6872650 Ball electrode forming method
03/29/2005US6872647 Method for forming multiple fins in a semiconductor device
03/29/2005US6872644 Semiconductor device with non-compounded contacts, and method of making
03/29/2005US6872643 Implant damage removal by laser thermal annealing
03/29/2005US6872642 Manufacturing method of semiconductor device
03/29/2005US6872641 Strained silicon on relaxed sige film with uniform misfit dislocation density
03/29/2005US6872640 SOI CMOS device with reduced DIBL
03/29/2005US6872639 Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
03/29/2005US6872638 Method of manufacturing a semiconductor device
03/29/2005US6872637 Opaque low resistivity silicon carbide
03/29/2005US6872635 Device transferring method, and device arraying method and image display unit fabricating method using the same
03/29/2005US6872634 Method of manufacturing micro-semiconductor element
03/29/2005US6872633 Deposition and sputter etch approach to extend the gap fill capability of HDP CVD process to ≦0.10 microns
03/29/2005US6872632 Method of fabricating semiconductor device
03/29/2005US6872631 Method of forming a trench isolation
03/29/2005US6872629 Method of forming a memory cell with a single sided buried strap
03/29/2005US6872628 Method of manufacturing semiconductor device
03/29/2005US6872627 Selective formation of metal gate for dual gate oxide application
03/29/2005US6872626 Method of forming a source/drain and a transistor employing the same
03/29/2005US6872624 Method of fabricating nonvolatile semiconductor memory device
03/29/2005US6872623 Floating gate and fabricating method thereof
03/29/2005US6872622 Method of forming a capacitor top plate structure to increase capacitance and to improve top plate to bit line overlay margin
03/29/2005US6872621 Method for removal of hemispherical grained silicon in a deep trench
03/29/2005US6872620 Trench capacitors with reduced polysilicon stress
03/29/2005US6872619 Semiconductor device having trench top isolation layer and method for forming the same
03/29/2005US6872618 Methods of forming ferroelectric capacitors with metal oxide for inhibiting fatigue
03/29/2005US6872617 Semiconductor device manufacturing method
03/29/2005US6872616 Manufacturing method of polarizing property electrode for electrical double layer capacitor, and manufacturing method of electrode sheet for electrical double layer capacitor
03/29/2005US6872614 Nonvolatile semiconductor memory device and process of production and write method thereof
03/29/2005US6872613 Method for integrating metals having different work functions to form CMOS gates having a high-k gate dielectric and related structure
03/29/2005US6872612 Local interconnect for integrated circuit
03/29/2005US6872611 Method of manufacturing transistor
03/29/2005US6872610 Method for preventing polysilicon mushrooming during selective epitaxial processing
03/29/2005US6872609 Narrow bitline using Safier for mirrorbit
03/29/2005US6872608 Method to selectively form poly SiGe P type electrode and polysilicon N type electrode through planarization
03/29/2005US6872607 Method of manufacturing a semiconductor device
03/29/2005US6872606 Semiconductor device with raised segment
03/29/2005US6872605 Semiconductor device and method of fabricating the same
03/29/2005US6872604 Method of fabricating a light emitting device
03/29/2005US6872603 Method for forming interconnections including multi-layer metal film stack for improving corrosion and heat resistances
03/29/2005US6872602 Carrier coupler for thyristor-based semiconductor device
03/29/2005US6872600 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
03/29/2005US6872598 Method of making a thin semiconductor chip
03/29/2005US6872597 Method of manufacturing a semiconductor device and a semiconductor device
03/29/2005US6872596 Method of transferring semiconductor chips
03/29/2005US6872594 Method of fabricating an electronic component
03/29/2005US6872593 Vertical mold die press machine
03/29/2005US6872592 Methods for providing an integrated circuit package with an alignment mechanism
03/29/2005US6872591 Method of making a semiconductor chip assembly with a conductive trace and a substrate
03/29/2005US6872590 Package substrate for electrolytic leadless plating and manufacturing method thereof
03/29/2005US6872588 Method of fabrication of electronic devices using microfluidic channels
03/29/2005US6872582 Selective trim and wafer testing of integrated circuits
03/29/2005US6872581 Measuring back-side voltage of an integrated circuit
03/29/2005US6872580 Method for patching up thin-film transistor circuits on a display panel by local thin-film deposition
03/29/2005US6872579 Thin-film coil and method of forming same
03/29/2005US6872512 Method of forming resist pattern
03/29/2005US6872510 Photomask having small pitch images of openings for fabricating openings in a semiconductor memory device and a photolithographic method for fabricating the same
03/29/2005US6872508 Exposure method and method of manufacturing semiconductor device
03/29/2005US6872498 Concentric tracks; overcoating substrate with pattern; positive, negative pixels; modulation beam scanning
03/29/2005US6872494 Photomask for efficiently performing simulation and forming suitable resist patterns
03/29/2005US6872465 Solder
03/29/2005US6872456 Dielectric coating for electronic substrate
03/29/2005US6872429 Deposition of tungsten nitride using plasma pretreatment in a chemical vapor deposition chamber
03/29/2005US6872421 Atomic layer deposition method
03/29/2005US6872419 Method or process for producing PZT films at low substrate temperatures by chemical vapor deposition
03/29/2005US6872418 Uniformity multilayer film; rotating interior, exterior cup
03/29/2005US6872329 Chemical mechanical polishing composition and process
03/29/2005US6872328 Method of polishing or planarizing a substrate
03/29/2005US6872322 Multiple stage process for cleaning process chambers
03/29/2005US6872289 Forming plasma in space facing substrate surface; imposing pulse voltage of lower frequency than the oscillation frequency of plasma ions on substrate causing thin film to be produced on substrate
03/29/2005US6872281 Chamber configuration for confining a plasma
03/29/2005US6872280 Slurry collection device and method
03/29/2005US6872262 State of the art constant flow device
03/29/2005US6872259 Method of and apparatus for tunable gas injection in a plasma processing system
03/29/2005US6872258 Shower head of a wafer treatment apparatus having a gap controller
03/29/2005US6872256 Film forming unit
03/29/2005US6872254 Method and apparatus for controlling air over a spinning microelectronic substrate
03/29/2005US6872253 Method of forming a semiconductor component
03/29/2005US6872252 Lead-based perovskite buffer for forming indium phosphide on silicon
03/29/2005US6872248 Liquid-phase growth process and liquid-phase growth apparatus
03/29/2005US6872229 Apparatus for peeling protective sheet
03/29/2005US6872129 Edge contact loadcup
03/29/2005US6872081 Electronic device, method of manufacturing the same and method of designing the same, and circuit board and electronic instrument
03/29/2005US6871777 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas
03/29/2005US6871773 Improved dispersion stability; chemisorption
03/29/2005US6871772 Wire bonding apparatus
03/29/2005US6871741 Composite substrate carrier
03/29/2005US6871657 Low profile wafer carrier
03/29/2005US6871656 Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
03/29/2005US6871655 Automated semiconductor processing systems
03/29/2005US6871558 Method for determining characteristics of substrate employing fluid geometries
03/29/2005US6871544 Sensor design and process
03/29/2005US6871394 Method for aligning substrates in a tray