Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2005
03/29/2005CA2429887C A ferroelectric memory circuit and method for its fabrication
03/29/2005CA2340108C Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package
03/29/2005CA2113019C Integrated partial sawing process
03/24/2005WO2005027604A1 Method for mounting electronic component
03/24/2005WO2005027603A1 Electronic component mounting module
03/24/2005WO2005027602A1 Method for manufacturing an electronic module
03/24/2005WO2005027600A1 Substrate and method for manufacturing same
03/24/2005WO2005027224A1 Bipolar/thin film soi cmos structure and method of making same
03/24/2005WO2005027223A1 Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
03/24/2005WO2005027222A2 Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
03/24/2005WO2005027221A1 Chip on flex tape with dimension retention pattern
03/24/2005WO2005027220A2 Manufacture of a non-volatile memory device with a single access gate and differently doped source and drain
03/24/2005WO2005027219A1 Clamping of semiconductor wafers to an electrostatic chuck
03/24/2005WO2005027218A1 Object-to-be-treated carrying system and object-to-be-treated carrying method
03/24/2005WO2005027217A1 Soi wafer and its manufacturing method
03/24/2005WO2005027216A2 Electronic devices
03/24/2005WO2005027215A2 A process for the production of a nitrogenous layer on a semiconductor or metal surface
03/24/2005WO2005027214A1 Multilayer substrate cleaning method, substrate bonding method, and bonded wafer manufacturing method
03/24/2005WO2005027213A1 Semiconductor chip manufacturing method, semiconductor chip, semiconductor thin-film chip, electron tube, and optical sensor
03/24/2005WO2005027212A1 Semiconductor substrate cutting method
03/24/2005WO2005027211A1 Method for reducing tungsten film roughness and improving step coverage
03/24/2005WO2005027210A1 Memory cell structure having nitride layer with reduced charge loss and method for fabricating same
03/24/2005WO2005027209A2 Multiple zone structure capable of light radiation annealing and method using said structure
03/24/2005WO2005027208A1 Method of controlling impurity doping and impurity doping apparatus
03/24/2005WO2005027207A1 Illumination optical system and exposure apparatus using the same
03/24/2005WO2005027205A1 Capacitor constructions, rugged silicon-containing surfaces, and methods of forming rugged silicon-containing surfaces
03/24/2005WO2005027204A1 Bonded wafer and its manufacturing method
03/24/2005WO2005027203A2 Clamping and de-clamping semiconductor wafers on a j-r electrostatic chuck
03/24/2005WO2005027202A1 Semiconductor wafer immersion systems and treatments using modulated acoustic energy
03/24/2005WO2005027200A2 Method and device for contacting vo semiconductor chips on a metallic substrate
03/24/2005WO2005027198A2 Doped alloys for electrical interconnects, methods of production and uses thereof
03/24/2005WO2005027195A2 Apparatus for carrying reticles and method of using the same to process reticles
03/24/2005WO2005027194A2 Method of making nonvolatile transistor pairs with shared control gate
03/24/2005WO2005027192A2 Structure and method of making strained channel cmos transistors having lattice-mismatched epitaxial extension and source and drain regions
03/24/2005WO2005026997A1 Automated layout transformation system and method
03/24/2005WO2005026842A1 Positive photoresist composition and method of forming resist pattern
03/24/2005WO2005026841A1 Photosensitive insulating resin composition and cured product thereof
03/24/2005WO2005026747A2 Electric ultimate defects analyzer detecting all defects in pcb/mcm
03/24/2005WO2005026671A2 Focal plane arrays in type-ii superlattices
03/24/2005WO2005026277A1 Chemical-mechanical polishing composition and method for using the same
03/24/2005WO2005026051A1 Cerium salt, process for producing the same, cerium oxide, and cerium-based abrasive material
03/24/2005WO2005026042A1 Fibrillar microstructure and process for the production thereof
03/24/2005WO2005026041A1 Method for the production of etched holes and/or etched trenches, and membrane sensor unit
03/24/2005WO2005025940A1 Control unit and method for producing the same
03/24/2005WO2005025804A1 Polished state monitoring apparatus and polishing apparatus using the same
03/24/2005WO2005025767A1 Acoustic diffusers for acoustic field uniformity
03/24/2005WO2005025688A1 Exercise machine
03/24/2005WO2005025375A2 Wrist assembly for robotic arm
03/24/2005WO2005013372A3 Spin injection devices
03/24/2005WO2005013318A3 Method for obtaining a thin high-quality layer by co-implantation and thermal annealing
03/24/2005WO2005010997A3 Nonplanar device with stress incorporation layer and method of fabrication
03/24/2005WO2005010984A3 Pecvd silicon-rich oxide layer for reduced uv charging in an eeprom
03/24/2005WO2005010983A3 Memory cell and method for producing a memory
03/24/2005WO2005010930A9 Method for forming high resolution electronic circuits
03/24/2005WO2005006433A3 Mold compound cap in a flip chip multi-matrix array package and process of making same
03/24/2005WO2005004196A3 Article comprising gated field emission structures with centralized nanowires and method for making the same
03/24/2005WO2005001890A3 Wafer box with radially pivoting latch elements
03/24/2005WO2004114336A3 Method for forming a high-voltage / high-power die package
03/24/2005WO2004112091A3 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
03/24/2005WO2004109771A3 Stackable semiconductor device and method of manufacturing the same
03/24/2005WO2004107378A3 Tuned bandwidth photocathode for transmission electron affinity devices
03/24/2005WO2004095662A3 Bandgap engineering
03/24/2005WO2004095459A3 Magnetoresistive ram device and methods for fabricating
03/24/2005WO2004094995A3 Hierarchical evaluation of cells
03/24/2005WO2004093190A3 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components
03/24/2005WO2004093152B1 Carrier with ultraphobic surfaces
03/24/2005WO2004090947A3 Ion beam incident angle detector for ion implant systems
03/24/2005WO2004084280A3 Processing system and method for treating a substrate
03/24/2005WO2004084269A3 Low dielectric materials and methods of producing same
03/24/2005WO2004077504B1 Gallium arsenide hbt having increased performance and method for its fabrication
03/24/2005WO2004070793A3 Method to plasma deposit onto an organic polymer dielectric film
03/24/2005WO2004069698A3 Transport system having shared load-lock front-end assembly
03/24/2005WO2004068617B1 Trench mosfet technology for dc-dc converter applications
03/24/2005WO2004064097A3 Charged particle beam device for inspecting or structuring a specimen
03/24/2005WO2004055919A3 Electronic devices
03/24/2005WO2004043850A3 An integrated structure and method for fabricating the same
03/24/2005WO2004009878A3 Electrochemical processing cell
03/24/2005WO2003088326A3 Method of loading a wafer onto a wafer holder to reduce thermal shock
03/24/2005US20050066300 Method for interlayer and yield based optical proximity correction
03/24/2005US20050066299 Method for arranging circuit elements in semiconductor components
03/24/2005US20050065765 System and method for statistical timing analysis of digital circuits
03/24/2005US20050065762 ESD protection device modeling method and ESD simulation method
03/24/2005US20050065739 Method of qualifying a process tool with wafer defect maps
03/24/2005US20050065634 Substrate processing unit, method for detecting the position of a substrate and substrate processing apparatus
03/24/2005US20050065630 Method and apparatus for simplified system configuration
03/24/2005US20050065620 Optimization apparatus,mounting apparatus and electronic part mounting system
03/24/2005US20050065358 Hafnium-containing material for film formation, method for producing the same, and method for producing hafnium-containing thin film using the same
03/24/2005US20050065312 Negative-working photoresist composition
03/24/2005US20050065296 Adhesive composition and adhesive film
03/24/2005US20050065050 Selective silicon etch chemistries, methods of production and uses thereof
03/24/2005US20050064798 Methods and compositions for chemical mechanical planarization of ruthenium
03/24/2005US20050064796 Slurry for CMP, polishing method and method of manufacturing semiconductor device
03/24/2005US20050064729 Methods of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition
03/24/2005US20050064728 Methods for forming a photoresist pattern using an anti-optical proximity effect
03/24/2005US20050064727 Method for fabricating semiconductor device with improved tolerance to wet cleaning process
03/24/2005US20050064726 Method of forming low-k dielectrics
03/24/2005US20050064725 Atomic layer deposition methods, and methods of forming materials over semiconductor substrates
03/24/2005US20050064724 Method and apparatus for forming low permittivity film and electronic device using the film
03/24/2005US20050064723 Method To Reduce Stacking Fault Nucleation Sites And Reduce Forward Voltage Drift In Bipolar Devices
03/24/2005US20050064722 Novel method to control spacer width
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