| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/02/2014 | US20140001638 Semiconductor Devices and Methods of Manufacture Thereof |
| 01/02/2014 | US20140001635 Package with Passive Devices and Method of Forming the Same |
| 01/02/2014 | US20140001634 Chip package and methods for manufacturing a chip package |
| 01/02/2014 | US20140001633 Copper interconnect structure and method for fabricating thereof |
| 01/02/2014 | US20140001632 Semiconductor package structure having an air gap and method for forming |
| 01/02/2014 | US20140001629 Packaged semiconductor die and cte-engineering die pair |
| 01/02/2014 | US20140001627 Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation |
| 01/02/2014 | US20140001626 Semiconductor apparatus and fabrication method of the same |
| 01/02/2014 | US20140001623 Microelectronic structure having a microelectronic device disposed between an interposer and a substrate |
| 01/02/2014 | US20140001622 Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages |
| 01/02/2014 | US20140001620 Method for manufacturing semiconductor device, and semiconductor device |
| 01/02/2014 | US20140001619 Power module package and method for manufacturing the same |
| 01/02/2014 | US20140001618 Solder flow impeding feature on a lead frame |
| 01/02/2014 | US20140001617 Method of using bonding ball array as height keeper and paste holder in semiconductor device package |
| 01/02/2014 | US20140001616 Semiconductor device package and method of manufacture |
| 01/02/2014 | US20140001615 Package-In-Packages and Methods of Formation Thereof |
| 01/02/2014 | US20140001612 Multiple Die Packaging Interposer Structure and Method |
| 01/02/2014 | US20140001608 Semiconductor substrate having high and low-resistivity portions |
| 01/02/2014 | US20140001607 Passivation scheme |
| 01/02/2014 | US20140001605 Manufacturing method of epitaxial silicon wafer, and epitaxial silicon wafer |
| 01/02/2014 | US20140001604 Semiconductor structures including fluidic microchannels for cooling and related methods |
| 01/02/2014 | US20140001601 Method of reducing current leakage in a device and a device thereby formed |
| 01/02/2014 | US20140001597 Voids in Interconnect Structures and Methods for Forming the Same |
| 01/02/2014 | US20140001596 Sinker with a Reduced Width |
| 01/02/2014 | US20140001595 Layout Architecture for Performance Improvement |
| 01/02/2014 | US20140001594 Schottky diode with leakage current control structures |
| 01/02/2014 | US20140001583 Method to inhibit metal-to-metal stiction issues in mems fabrication |
| 01/02/2014 | US20140001582 Film-assist molded gel-fill cavity package with overflow reservoir |
| 01/02/2014 | US20140001577 MEMS Device with Improved Charge Elimination and Methods of Producing Same |
| 01/02/2014 | US20140001576 Lowering tungsten resistivity by replacing titanium nitride with titanium silicon nitride |
| 01/02/2014 | US20140001575 Semiconductor devices having different gate oxide thicknesses |
| 01/02/2014 | US20140001572 Through gate fin isolation |
| 01/02/2014 | US20140001570 Composite high-k gate dielectric stack for reducing gate leakage |
| 01/02/2014 | US20140001569 High voltage three-dimensional devices having dielectric liners |
| 01/02/2014 | US20140001568 Integrated circuit device featuring an antifuse and method of making same |
| 01/02/2014 | US20140001567 Fet transistor on high-resistivity substrate |
| 01/02/2014 | US20140001565 Semiconductor device and method of manufacturing the same |
| 01/02/2014 | US20140001562 Integrated Circuit Having FinFETS with Different Fin Profiles |
| 01/02/2014 | US20140001561 Cmos devices having strain source/drain regions and low contact resistance |
| 01/02/2014 | US20140001560 Isolated and bulk semiconductor devices formed on a same bulk substrate |
| 01/02/2014 | US20140001559 Dummy Gate Electrode of Semiconductor Device |
| 01/02/2014 | US20140001557 Semiconductor devices with integrated hole collectors |
| 01/02/2014 | US20140001555 Undercut insulating regions for silicon-on-insulator device |
| 01/02/2014 | US20140001554 Semiconductor device with epitaxial source/drain facetting provided at the gate edge |
| 01/02/2014 | US20140001553 Method and system for improved analog performance in sub-100 nanometer cmos transistors |
| 01/02/2014 | US20140001552 Super Junction Semiconductor Device Comprising a Cell Area and an Edge Area |
| 01/02/2014 | US20140001551 Lateral Double Diffused Metal Oxide Semiconductor Device and Manufacturing Method Thereof |
| 01/02/2014 | US20140001549 Semiconductor device and driver circuit with an active device and isolation structure interconnected through a resistor circuit, and method of manufacture thereof |
| 01/02/2014 | US20140001548 Semiconductor device and driver circuit with an active device and isolation structure interconnected through a diode circuit, and method of manufacture thereof |
| 01/02/2014 | US20140001547 Semiconductor Device Including an Edge Area and Method of Manufacturing a Semiconductor Device |
| 01/02/2014 | US20140001546 Semiconductor device and driver circuit with a current carrying region and isolation structure interconnected through a resistor circuit, and method of manufacture thereof |
| 01/02/2014 | US20140001545 High breakdown voltage ldmos device |
| 01/02/2014 | US20140001534 Apparatus and method for rounded ono formation in a flash memory device |
| 01/02/2014 | US20140001531 Damascene non-volatile memory cells and methods for forming the same |
| 01/02/2014 | US20140001529 Silicide Process Using OD Spacers |
| 01/02/2014 | US20140001527 Semiconductor device having buried bit lines and method for fabricating the same |
| 01/02/2014 | US20140001526 Analog Floating-Gate Capacitor with Improved Data Retention in a Silicided Integrated Circuit |
| 01/02/2014 | US20140001520 Contact resistance reduced p-mos transistors employing ge-rich contact layer |
| 01/02/2014 | US20140001519 Preventing isolation leakage in iii-v devices |
| 01/02/2014 | US20140001518 Integrated Circuit Devices with Well Regions and Methods for Forming the Same |
| 01/02/2014 | US20140001516 Reducing the inversion oxide thickness of a high-k stack fabricated on high mobility semiconductor material |
| 01/02/2014 | US20140001514 Semiconductor Device and Method for Producing a Doped Semiconductor Layer |
| 01/02/2014 | US20140001490 Schottky-barrier device with locally planarized surface and related semiconductor product |
| 01/02/2014 | US20140001488 Electronic Device Including Silicon Carbide Diode Dies |
| 01/02/2014 | US20140001486 Composite semidconductor substrate, semiconductor device, and manufacturing method |
| 01/02/2014 | US20140001484 Method Of Manufacturing Gallium Nitride Substrate And Gallium Nitride Substrate Manufactured By The Same |
| 01/02/2014 | US20140001480 Lead Frame Packages and Methods of Formation Thereof |
| 01/02/2014 | US20140001479 Switching device with charge distribution structure |
| 01/02/2014 | US20140001478 Group iii-nitride transistor using a regrown structure |
| 01/02/2014 | US20140001477 Semiconductor device and driver circuit with drain and isolation structure interconnected through a diode circuit, and method of manufacture thereof |
| 01/02/2014 | US20140001476 Semiconductor device and manufacturing method thereof |
| 01/02/2014 | US20140001475 Manufacturing method of array substrate, array substrate and lcd device |
| 01/02/2014 | US20140001474 Cmos device and fabrication method |
| 01/02/2014 | US20140001473 Semiconductor device and driver circuit with source and isolation structure interconnected through a diode circuit, and method of manufacture thereof |
| 01/02/2014 | US20140001472 Silicon carbide semiconductor device and method of fabricating same |
| 01/02/2014 | US20140001462 High mobility stabile metal oxide tft |
| 01/02/2014 | US20140001441 Integration methods to fabricate internal spacers for nanowire devices |
| 01/02/2014 | US20140001440 Dielectric for carbon-based nano-devices |
| 01/02/2014 | US20140001439 Graded Aluminum-Gallium-Nitride and Superlattice Buffer Layer for III-V Nitride Layer on Silicon Substrate |
| 01/02/2014 | US20140001438 Semiconductor devices and methods of manufacturing the same |
| 01/02/2014 | US20140001436 Nanocrystals with high extinction coefficients and methods of making and using such nanocrystals |
| 01/02/2014 | US20140001432 Applications for nanopillar structures |
| 01/02/2014 | US20140001164 Systems and methods for processing thin films |
| 01/02/2014 | US20140001154 Plasma processing apparatus and plasma processing method |
| 01/02/2014 | US20140001030 Method of manufacturing semiconductor device |
| 01/02/2014 | US20140000843 Susceptor heater and method of heating a substrate |
| 01/02/2014 | US20140000810 Plasma Activation System |
| 01/02/2014 | US20140000808 Cmp tool implementing cyclic self-limiting cm process |
| 01/02/2014 | US20140000661 Single type apparatus for drying a substrate and single type system for cleaning a substrate including the same |
| 01/02/2014 | US20140000659 Method and apparatus for processing substrate |
| 01/02/2014 | US20140000655 Semiconductor Equipment |
| 01/02/2014 | US20140000649 Photovoltaic substrate cleaning system and method |
| 01/02/2014 | US20140000481 Aluminium oxide pastes and process for the use thereof |
| 01/02/2014 | DE112012001312T5 Verfahren zur Wiederaufnahme des Betriebs einer Drahtsäge und Drahtsäge Process for the resumption of the operation of a wire saw and wire saw |
| 01/02/2014 | DE112012001262T5 Oxidsubstrat und Verfahren zu dessen Herstellung Oxide substrate and process for its preparation |
| 01/02/2014 | DE112011105130T5 Verfahren zum Herstellen von elektronischen Nitrid-Bauelementen A method of manufacturing of electronic components nitride |
| 01/02/2014 | DE112011105102T5 Verfahren und Vorrichtung zum selektiven Abscheiden von epitaxialen Germanium-Spannungsbeaufschlagungslegierungen Method and apparatus for selective deposition of epitaxial germanium Spannungsbeaufschlagungslegierungen |
| 01/02/2014 | DE102013212787A1 Halbleiterbauelement und verfahren zum herstellen einer dotierten halbleiterschicht A semiconductor device and method of manufacturing a doped semiconductor layer |
| 01/02/2014 | DE102013212561A1 Halbleitervorrichtung und Leistungsumsetzungsvorrichtung, die sie verwendet Semiconductor device and power conversion device that uses them |
| 01/02/2014 | DE102013212440A1 Harzversiegelungsverfahren für Halbleiterchips Resin sealing method for semiconductor chips |