Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/12/2014CN103579081A Fan-out type semiconductor device with chip dimension substrate and preparation method
02/12/2014CN103579080A Method and apparatus for preparing polysilazane on a semiconductor wafer
02/12/2014CN103579079A Method for restraining bimodal effect in shallow groove isolation technology
02/12/2014CN103579078A Method for restraining reverse narrow channel effect in shallow trench isolation technology
02/12/2014CN103579077A Semi-conductor structure and forming method thereof
02/12/2014CN103579076A Method for forming shallow channel isolation region
02/12/2014CN103579075A Semiconductor structure for controlling feature sizes with plasma and manufacturing method thereof
02/12/2014CN103579074A Semiconductor structure forming method
02/12/2014CN103579073A 深沟槽填充方法 Deep trench filling method
02/12/2014CN103579072A Buffering device for piece clamping mechanism
02/12/2014CN103579071A Device used for picking and placing IGBT lining plate
02/12/2014CN103579070A Substrate retaining ring gripping mechanism
02/12/2014CN103579069A Crystalline grain picking and placing method, bearing structure for picking and placing of crystalline grains and crystalline grain picking and placing device
02/12/2014CN103579068A Vacuum nozzle connector
02/12/2014CN103579067A Press type vacuum nozzle
02/12/2014CN103579066A Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
02/12/2014CN103579065A Method for improving CIGS mechanical efficiency for scribing in special vacuum adsorbing positioning mode
02/12/2014CN103579064A Method for detecting center of plate-shaped workpiece
02/12/2014CN103579063A Lead bonding wire clamp and device and method of lead bonding wire clamp
02/12/2014CN103579062A 基板输送装置 Substrate transport apparatus
02/12/2014CN103579061A Die pick-up control method, die pick-up device using the same, and die bonder including the same
02/12/2014CN103579060A Silicon wafer feeding method
02/12/2014CN103579059A Substrate slice loading system special for substrate machine table and slice loading method
02/12/2014CN103579058A Method for achieving multi-batch continuous operation
02/12/2014CN103579057A Method for improving graphite boat processing effect
02/12/2014CN103579056A Device for bonding semiconductor chips
02/12/2014CN103579055A Cleaning fluid generating device, cleaning fluid generating method, substrate cleaning device and substrate cleaning method
02/12/2014CN103579054A Substrate processing apparatus and substrate processing method
02/12/2014CN103579053A Cleaning solution producing apparatus and method, and substrate cleaning apparatus and method
02/12/2014CN103579052A Integrated circuit interposer and method of manufacturing the same
02/12/2014CN103579051A Waferstart processes and systems for integrated circuit fabrication
02/12/2014CN103579050A Substrate processing device
02/12/2014CN103579049A Array packaging structure of semiconductor devices and method for forming the same
02/12/2014CN103579048A Sheet attaching device and sheet attaching method
02/12/2014CN103579047A Sheet adhesion apparatus and adhesion method
02/12/2014CN103579046A Kinematic holding system for a placement head of a placement apparatus
02/12/2014CN103579045A Sheet adhering device and method for preventing enlargement of the device
02/12/2014CN103579044A System and method for temperature control of a semiconductor wafer
02/12/2014CN103579043A Graphene device manufacturing apparatus and graphene device manufacturing method using the apparatus
02/12/2014CN103579042A Systems and methods of separating bonded wafers
02/12/2014CN103579041A Vacuumizing device suitable for semiconductor equipment with a plurality of processing cavities
02/12/2014CN103579040A No-damage chip molding and packaging process
02/12/2014CN103579039A Method for controlling electrical property of passive device and integrated component
02/12/2014CN103579038A Detecting anomalous stiff pillar bumps formed above metallization system
02/12/2014CN103579037A Thickness detection apparatus using digital optical technology and method using the same
02/12/2014CN103579036A Quality evaluation method of target assembly used in forming thin film for semiconductor layers of thin film transistor
02/12/2014CN103579035A Defect density calculating method
02/12/2014CN103579034A Method for monitoring electric potential in chip through focused ion beams
02/12/2014CN103579033A Welding pad for wafer acceptability test
02/12/2014CN103579032A Method and system for testing power semiconductor module packaging technology
02/12/2014CN103579031A Multi-welding-arm device for die bonder
02/12/2014CN103579030A Novel chip encapsulation method and chip encapsulation structure
02/12/2014CN103579029A Package structure and the method of making same
02/12/2014CN103579028A Hot bar soldering of power contact
02/12/2014CN103579027A Repairing anomalous stiff pillar bumps
02/12/2014CN103579026A Field emission devices and method of making same
02/12/2014CN103579025A Making method of ubtegrated circuit flip chip assembly and the assembly prepared by the method
02/12/2014CN103579024A Warpage control in the packaging of integrated circuit
02/12/2014CN103579023A Welding method of welding type power semiconductor module
02/12/2014CN103579022A Structure and method of fabricating a semiconductor package
02/12/2014CN103579021A Electronic product production method in pouring sealant link and product used for method
02/12/2014CN103579020A Packaging method for wafer-level chip
02/12/2014CN103579019A Equipment packaging chip with adhesives
02/12/2014CN103579018A Novel optical mouse control chip packaging method
02/12/2014CN103579017A Automatic column mounting and welding device for ceramic column grid array packaging
02/12/2014CN103579016A Large current silicone carbide SBD / JBS power chip structure and manufacturing method thereof
02/12/2014CN103579015A Semiconductor package and method for forming the same
02/12/2014CN103579014A Method of manufacturing electronic device, electronic device, electronic apparatus, and mobile object
02/12/2014CN103579013A Method and device for biface chip tin soldering glue preparation
02/12/2014CN103579012A Method for producing AAQFN packaging piece provided with solder ball face
02/12/2014CN103579011A Package carrier and manufacturing method thereof
02/12/2014CN103579010A Method for manufacturing packaging product with metalized side wall
02/12/2014CN103579009A Package substrate, manufacturing method of the package substrate, chip packaging structure and manufacturing method of the chip packaging body
02/12/2014CN103579008A Pad structure and preparation method thereof
02/12/2014CN103579007A Post-gate isolation area formation for fin field effect transistor device
02/12/2014CN103579006A Semiconductor device having vertical gates and fabrication thereof
02/12/2014CN103579005A Power transistor with high voltage counter implant
02/12/2014CN103579004A FinFET及其制造方法 And a method of manufacturing FinFET
02/12/2014CN103579003A Method for manufacturing super joint MOSFET
02/12/2014CN103579002A Fin type field effect transistor and forming method thereof
02/12/2014CN103579001A Fin type field effect transistor and forming method thereof
02/12/2014CN103579000A Manufacturing method of semiconductor element
02/12/2014CN103578999A Manufacturing method of super joint
02/12/2014CN103578998A Method for preventing grid electrode polycrystalline silicon from being exhausted in PMOS device process
02/12/2014CN103578997A Manufacturing method of LDMOS grid electrode and product
02/12/2014CN103578996A Method for manufacturing transistor
02/12/2014CN103578995A Method for forming FinFET
02/12/2014CN103578994A Method for manufacturing semiconductor device
02/12/2014CN103578993A Forming method of semi-conductor device
02/12/2014CN103578992A Integrated VDMOS chip and manufacturing method thereof
02/12/2014CN103578991A Semiconductor device manufacturing method
02/12/2014CN103578990A TFT manufacturing method, displaying component manufacturing method, displaying component and displaying device
02/12/2014CN103578989A MOS device, manufacturing method of MOS device and manufacturing method of CMOS devices
02/12/2014CN103578988A Fin part and finned-type field-effect transistor and forming method thereof
02/12/2014CN103578987A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/12/2014CN103578986A Method for manufacturing high-resistance GaN thin film
02/12/2014CN103578985A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
02/12/2014CN103578984A Semiconductor element and manufacturing method thereof
02/12/2014CN103578983A Field stop type insulated gate bipolar transistor and manufacturing method thereof
02/12/2014CN103578982A Field stop type insulated gate bipolar transistor and manufacturing method thereof
1 ... 342 343 344 345 346 347 348 349 350 351 352 353 354 355 356 357 358 359 360 361 362 ... 6590