Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/06/2014WO2014021220A1 Substrate processing apparatus, method for manufacturing semiconductor device, and recording medium
02/06/2014WO2014021199A1 Silicon-carbide semiconductor device and method for manufacturing same
02/06/2014WO2014021194A1 Guide plate for probe guard and probe guard provided with same
02/06/2014WO2014021176A1 Method for bringing substrate into contact with probe card
02/06/2014WO2014021173A1 SPUTTERING TARGET FOR FORMING Cu ALLOY THIN FILM, AND METHOD FOR MANUFACTURING SAME
02/06/2014WO2014021141A1 Bonding device
02/06/2014WO2014021139A1 Ruthenium sputtering target and ruthenium alloy sputtering target
02/06/2014WO2014021024A1 Device for causing substrate to contact probe card, and substrate inspection apparatus provided with same
02/06/2014WO2014021019A1 Charged particle beam device
02/06/2014WO2014020978A1 Light quantity measuring device and light quantity measuring method
02/06/2014WO2014020962A1 Dicing sheet and method for manufacturing device chip
02/06/2014WO2014020906A1 Method for manufacturing composite substrate and method for manufacturing semiconductor crystal layer formation substrate
02/06/2014WO2014020892A1 Thin film transistor and method for manufacturing same
02/06/2014WO2014020809A1 Nitride semiconductor device and method for manufacturing nitride semiconductor device
02/06/2014WO2014020790A1 Mounting method
02/06/2014WO2014020768A1 Photometric device and photometric method
02/06/2014WO2014020713A1 Light quantity measuring device and light quantity measuring method
02/06/2014WO2014020694A1 Single crystal silicon carbide substrate and method for manufacturing same
02/06/2014WO2014020693A1 Method for producing solar cell
02/06/2014WO2014020687A1 Method for producing solar cell
02/06/2014WO2014020673A1 Method for producing solar cell module and solar cell module
02/06/2014WO2014020642A1 Method for etching semiconductor article
02/06/2014WO2014020576A1 Method for improving quality of spalled material layers
02/06/2014WO2014020479A2 Post-CMOS Processing and 3D Integration Based on Dry-Film Lithography
02/06/2014WO2014020390A1 Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures
02/06/2014WO2014020329A1 Semiconductor device and fabrication method
02/06/2014WO2014019752A1 Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
02/06/2014WO2014019598A1 Substrate assembly, method and apparatus for bonding substrates
02/06/2014WO2014019536A1 Fs type igbt and manufacturing method thereof
02/06/2014WO2014019535A1 Fs-igbt and manufacturing method thereof
02/06/2014WO2014019523A1 One-step forming method of two corrosion depths
02/06/2014WO2014019502A1 All-glass solar cell panel assembly
02/06/2014WO2014019499A1 Method for manufacturing silicon nitride thin film
02/06/2014WO2014019261A1 Semiconductor structure and manufacturing method thereof
02/06/2014WO2014019252A1 Liquid crystal display device, array substrate, and manufacturing method therefor
02/06/2014WO2013162938A9 Esc cooling base for large diameter substrates
02/06/2014US20140038503 Polishing pad and manufacturing method therefor
02/06/2014US20140038501 Transparent window in a polishing pad
02/06/2014US20140038431 Apparatus and methods for microwave processing of semiconductor substrates
02/06/2014US20140038430 Method for processing object
02/06/2014US20140038429 Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatus
02/06/2014US20140038428 Self-Assembled Monolayer for Pattern Formation
02/06/2014US20140038427 Carbosilane Precursors For Low Temperature Film Deposition
02/06/2014US20140038426 Method for manufacturing semiconductor devices
02/06/2014US20140038425 Methods of eliminating pattern collapse on photoresist patterns
02/06/2014US20140038424 Method of manufacturing semiconductor device
02/06/2014US20140038423 Coating treatment method and coating treatment apparatus
02/06/2014US20140038422 Control system for non-contact edge coating apparatus for solar cell substrates
02/06/2014US20140038421 Deposition Chamber and Injector
02/06/2014US20140038420 Composition and process for selectively etching metal nitrides
02/06/2014US20140038419 Method for providing vias
02/06/2014US20140038418 Bevel etcher with vacuum chuck
02/06/2014US20140038417 Semiconductor structure and process thereof
02/06/2014US20140038416 Single spacer process for multiplying pitch by a factor greater than two and related intermediate ic structures
02/06/2014US20140038415 Polymer-containing developer
02/06/2014US20140038414 Process of planarizing a wafer with a large step height and/or surface area features
02/06/2014US20140038413 Method of Manufacturing a Semiconductor Device including a Dielectric Structure
02/06/2014US20140038412 Interconnect formation using a sidewall mask layer
02/06/2014US20140038411 Manufacturing method of device
02/06/2014US20140038410 Method of producing a semiconductor device having an interconnect through the substrate
02/06/2014US20140038409 Semiconductor device and a method of manufacturing the same
02/06/2014US20140038408 Fluorine depleted adhesion layer for metal interconnect structure
02/06/2014US20140038407 Fluorine depleted adhesion layer for metal interconnect structure
02/06/2014US20140038406 Method for fabricating a through wire interconnect (twi) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer
02/06/2014US20140038404 Flash Memory Utilizing a High-K Metal Gate
02/06/2014US20140038403 High-k transistors with low threshold voltage
02/06/2014US20140038402 Dual work function finfet structures and methods for fabricating the same
02/06/2014US20140038401 Ruthenium for a dielectric containing a lanthanide
02/06/2014US20140038400 3d semiconductor devices and methods of fabricating same
02/06/2014US20140038399 Method for fabricating an aperture
02/06/2014US20140038398 Substrate treating methods and apparatuses employing the same
02/06/2014US20140038396 Semiconductor device and method for manufacturing same
02/06/2014US20140038395 Vapor deposition device and vapor deposition method
02/06/2014US20140038394 Method and apparatus of forming compound semiconductor film
02/06/2014US20140038393 Method and system for ion-assisted processing
02/06/2014US20140038392 Systems and methods for laser splitting and device layer transfer
02/06/2014US20140038391 III-Nitride Wafer Fabrication
02/06/2014US20140038389 Processing method of semiconductor substrate and processed semiconductor substrate product
02/06/2014US20140038388 Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure
02/06/2014US20140038387 Method for manufacturing a semiconductor device
02/06/2014US20140038386 Reducing or eliminating pre-amorphization in transistor manufacture
02/06/2014US20140038385 Nonvolatile memory devices and methods of fabricating the same
02/06/2014US20140038384 Forming Metal-Insulator-Metal Capacitors Over a Top Metal Layer
02/06/2014US20140038383 Method of fabricating semiconductor device using photo key
02/06/2014US20140038382 Structure And Method To Realize Conformal Doping In Deep Trench Applications
02/06/2014US20140038374 Method for manufacturing cmos transistor
02/06/2014US20140038373 Semiconductor device and manufacturing method thereof
02/06/2014US20140038370 Thin film transistor substrate and method for manufacturing the same
02/06/2014US20140038369 METHOD OF FORMING FIN-FIELD EFFECT TRANSISTOR (finFET) STRUCTURE
02/06/2014US20140038368 Embedded silicon germanium n-type filed effect transistor for reduced floating body effect
02/06/2014US20140038365 Graphene-based efuse device
02/06/2014US20140038364 Method of encapsulating a microelectronic device
02/06/2014US20140038361 Semiconductor device and method of manufacturing the same
02/06/2014US20140038360 Apparatus and Methods for Molding Die on Wafer Interposers
02/06/2014US20140038359 Laser-Assisted Cleaving of a Reconstituted Wafer for Stacked Die Assemblies
02/06/2014US20140038358 Method for contacting agglomerate terminals of semiconductor packages
02/06/2014US20140038357 Singulated ic stiffener and de-bond process
02/06/2014US20140038356 Method for plating a semiconductor package lead
02/06/2014US20140038354 Semiconductor package and method of fabricating the same
02/06/2014US20140038353 Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
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