Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/12/2014CN103579232A Plane gate type MOS tube and manufacturing method thereof
02/12/2014CN103579229A MOSFET integrating over-current protection and manufacturing method
02/12/2014CN103579227A Thin film transistor substrate and method of manufacturing the same
02/12/2014CN103579223A Semiconductor device including a diode and method of manufacturing a semiconductor device
02/12/2014CN103579220A Array substrate for display device and method of fabricating the same
02/12/2014CN103579219A Planar array substrate, sensor and manufacturing method of planar array substrate
02/12/2014CN103579217A Power module packaged in ultra-small mode and packaging method thereof
02/12/2014CN103579208A Three-dimensional integrated circuits and fabrication thereof
02/12/2014CN103579207A Stacked packaging device and manufacturing method thereof
02/12/2014CN103579206A Stacked packaging device and manufacturing method thereof
02/12/2014CN103579205A Integrated system and method of making the integrated system
02/12/2014CN103579202A Semiconductor device electromagnetic shielding structure comprising organic substrate and production method
02/12/2014CN103579193A Electricity leakage test structure and test method of semiconductor element
02/12/2014CN103579190A Chip package and method for manufacturing same
02/12/2014CN103579189A Chip package and a method for manufacturing a chip package
02/12/2014CN103579188A Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
02/12/2014CN103579187A Method of reducing contact resistance of a metal
02/12/2014CN103579186A Connecting through vias to devices
02/12/2014CN103579185A Metal wiring of semiconductor device and method for manufacturing thereof
02/12/2014CN103579184A Ternary tungsten boride nitride films and methods for forming same
02/12/2014CN103579183A Interposer system and method
02/12/2014CN103579181A Hybrid interconnect scheme and methods for forming the same
02/12/2014CN103579180A 半导体结构及其形成方法 And a method for forming a semiconductor structure
02/12/2014CN103579179A Capacitor arrangements and method for manufacturing a capacitor arrangement
02/12/2014CN103579178A Capacitors positioned at the device level in an integrated circuit product and methods of making such capacitors
02/12/2014CN103579177A Semiconductor device and method of manufacturing the same
02/12/2014CN103579176A Contact structure of semiconductor device
02/12/2014CN103579174A Process-compatible decoupling capacitor and method for making the same
02/12/2014CN103579173A Semiconductor packaging member and production method thereof
02/12/2014CN103579171A Semiconductor packaging piece and manufacturing method thereof
02/12/2014CN103579170A Production of adhesion structures in dielectric layers using photoprocess technology and devices incorporating adhesion structures
02/12/2014CN103579167A Semiconductor wrapper and manufacturing method thereof
02/12/2014CN103579163A System and method for mechanical and electrical package substrate issue mitigation
02/12/2014CN103579162A Lead frame assembly, lead frame, and cutting method
02/12/2014CN103579160A Semiconductor substrate and method of fabricating the same
02/12/2014CN103579159A Package assembly and methods for forming the same
02/12/2014CN103579158A Eutectic bonding silicon metalized metal piece and metallization process thereof
02/12/2014CN103579156A Bonding pad for thermocompression bonding, process for producing a bonding pad and component
02/12/2014CN103579155A Method for producing a bonding pad for thermocompression bonding, and bonding pad
02/12/2014CN103579154A Electric device package comprising a laminate and method of making an electric device package comprising a laminate
02/12/2014CN103579153A Chip card module
02/12/2014CN103579150A Solder bump for ball grid array
02/12/2014CN103579149A Semiconductor structure and manufacturing process thereof
02/12/2014CN103579148A Light-emitting diode structure and method for manufacturing the same
02/12/2014CN103579145A Through-silicon via interposer, method for manufacturing through-silicon via interposer, packaging substrate and method for manufacturing packaging substrate
02/12/2014CN103579142A Semiconductor module arrangement and method for producing and operating semiconductor module arrangement
02/12/2014CN103579141A Composite heat dissipation structure and application thereof
02/12/2014CN103579137A Reliable surface mount integrated power module
02/12/2014CN103579136A Diffusion barrier for surface-mount modules
02/12/2014CN103579135A Semiconductor package, manufacturing method thereof, and semiconductor package manufacturing mold
02/12/2014CN103579134A Semiconductor package and method of fabricating the same
02/12/2014CN103579133A Resin sheet for sealing electronic component, resin-sealed type semiconductor device and method for producing resin-sealed type semiconductor device
02/12/2014CN103579132A Semiconductor device and manufacturing method of same
02/12/2014CN103579130A Semiconductor device and method for manufacturing semiconductor device
02/12/2014CN103579128A Chip packaging substrate, chip packaging structure and manufacturing method of chip packaging structure
02/12/2014CN103579126A Semi-floating gate component of U-shaped structure and manufacturing method thereof
02/12/2014CN103579125A Nonvolatile memory device and method for fabricating the same
02/12/2014CN103579124A Method of manufacturing patterns in a semiconductor device
02/12/2014CN103579123A Method for forming embedded memory device
02/12/2014CN103579122A Flash memory element manufacturing method
02/12/2014CN103579121A Method of forming semiconductor structure
02/12/2014CN103579120A Method for using polycrystalline silicon source electrode contact window in flash memory chip manufacturing process
02/12/2014CN103579119A Manufacturing method of EEPROM memory cell
02/12/2014CN103579118A Method for improving writing-in redundancy rate of static random access memory
02/12/2014CN103579117A Method for fabricating semiconductor device including silicon-containing layer and metal-containing layer, and conductive structure of the same
02/12/2014CN103579116A Method for manufacturing multiple grooves in substrate
02/12/2014CN103579115A Complementary type thin film transistor, manufacturing method of complementary type thin film transistor, array substrate and display device
02/12/2014CN103579114A Integrated semiconductor device and wafer level method of fabricating the same
02/12/2014CN103579113A Complementary field effect transistor with double-work function metal gates and manufacturing method thereof
02/12/2014CN103579112A CMOS and formation method thereof
02/12/2014CN103579111A Method for manufacturing metal gate semiconductor device
02/12/2014CN103579110A Method for manufacturing semiconductor device
02/12/2014CN103579109A Manufacturing method for photoelectric integrated circuit
02/12/2014CN103579108A Methods for fabricating high carrier mobility finfet structures
02/12/2014CN103579107A Membrane circuit dicing method based on mask electroplating
02/12/2014CN103579106A Dicing method applicable to small-dimension workpieces
02/12/2014CN103579105A Package substrate processing method
02/12/2014CN103579104A Array substrate, preparation method thereof and display device
02/12/2014CN103579103A Three-dimensional lamination packing method and production method of image sensor
02/12/2014CN103579102A Method for preparing low dielectric constant film with excellent mechanical property
02/12/2014CN103579101A Method using pulse electrocoppering mode to achieve copper interconnection
02/12/2014CN103579100A Method for preparing ultra-thin copper seed crystal layer on diffusion barrier layer and application thereof
02/12/2014CN103579099A Semiconductor device having multi-bump electrical interconnections and method for fabricating the same
02/12/2014CN103579098A Method for reducing wettability of interconnect material at corner interface and device incorporating same
02/12/2014CN103579097A Method for forming interconnect structure and interconnect structure
02/12/2014CN103579096A Semiconductor devices and methods of manufacture thereof
02/12/2014CN103579095A Method for producing contact opening and method for producing self-aligned contact structure
02/12/2014CN103579094A Processes for forming integrated circuits with post-patterning treament
02/12/2014CN103579093A Method for forming interlayer connectors in a three-dimensional stacked ic device
02/12/2014CN103579092A Semiconductor device and method for fabricating the same
02/12/2014CN103579091A Cross-coupling based design using diffusion contact structures
02/12/2014CN103579090A Schottky through hole manufacturing technological method
02/12/2014CN103579089A 半导体结构及其形成方法 And a method for forming a semiconductor structure
02/12/2014CN103579088A Method for forming through silicon vias of semiconductor device
02/12/2014CN103579087A Manufacturing method of three-dimensional integrated circuit structure and three-dimensional integrated circuit structure
02/12/2014CN103579086A Semiconductor device and semiconductor structure forming method
02/12/2014CN103579085A Method for forming contact holes
02/12/2014CN103579084A Method for forming parallel metal interconnection structures
02/12/2014CN103579083A Opening forming method
02/12/2014CN103579082A Formation method of semiconductor device
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