Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/23/2007US7165506 Method and device for plasma-treating the surface of substrates by ion bombardment
01/23/2007US7165443 Vacuum leakage detecting device for use in semiconductor manufacturing system
01/23/2007US7165440 Frequency characteristics measuring method and device for acceleration sensor
01/23/2007US7165322 Process of forming socket contacts
01/23/2007US7165316 Methods for manufacturing resistors using a sacrificial layer
01/23/2007CA2466153C Integrated transistor/memory structures and a matrix-addressable array thereof
01/23/2007CA2331893C Fabrication of gallium nitride semiconductor layers by lateral growth from trench sidewalls
01/18/2007WO2007009037A1 Structures formed in diamond
01/18/2007WO2007009035A2 Lateral growth method for defect reduction of semipolar nitride films
01/18/2007WO2007009024A2 Folded frame carrier for mosfet bga
01/18/2007WO2007009011A2 Light emitting diode comprising semiconductor nanocrystal complexes
01/18/2007WO2007008944A1 Belt conveyor for use with semiconductor containers
01/18/2007WO2007008939A2 Apparatus with on-the-fly workpiece centering
01/18/2007WO2007008921A2 Method and apparatus for forming multi-dimensional colloidal structures using holographic optical tweezers
01/18/2007WO2007008903A2 Memory cell comprising a thin film three-terminal switching device having a metal source and/or drain region
01/18/2007WO2007008901A2 Method of plasma etching transition metals and their compounds
01/18/2007WO2007008897A1 Microwave-induced ion cleaving and patternless transfer of semiconductor films
01/18/2007WO2007008811A2 High speed substrate aligner apparatus
01/18/2007WO2007008767A2 Chemical mixing apparatus, system and method
01/18/2007WO2007008736A1 Stocker
01/18/2007WO2007008717A1 Surface mountable light emitting diode assemblies packaged for high temperature operation
01/18/2007WO2007008705A2 Uniform batch film deposition process and films so produced
01/18/2007WO2007008677A2 Load port module
01/18/2007WO2007008515A2 Seal arrangement with corrosion barrier and method
01/18/2007WO2007008344A1 Integrated circuit embodying a non-volatile memory cell
01/18/2007WO2007008302A1 Nitric oxide reoxidation for improved gate leakage reduction of sion gate dielectrics
01/18/2007WO2007008251A2 Hard mask structure for patterning of materials
01/18/2007WO2007008173A1 Semiconductor structure for transistors with enhanced subthreshold swing and methods of manufacture thereof
01/18/2007WO2007008171A2 Integrated circuit device and method of manufacturing thereof
01/18/2007WO2007008019A1 Vacuum gate valve having anti-suck back function
01/18/2007WO2007007959A1 Mold for forming a molding member and method of fabricating a molding member using the same
01/18/2007WO2007007883A1 Manufacturing method of semiconductor devices
01/18/2007WO2007007818A1 Method for manufacturing internal cell structure, internal cell structure, and display device
01/18/2007WO2007007782A1 Multilayer structure and method for cleaning same
01/18/2007WO2007007780A1 Material for forming protective film and method of forming photoresist pattern with the same
01/18/2007WO2007007774A1 Substrate and semiconductor light emitting element
01/18/2007WO2007007746A1 Exposure apparatus and method for manufacturing device
01/18/2007WO2007007744A1 Substrate stage mechanism and substrate processing apparatus
01/18/2007WO2007007736A1 Probe card
01/18/2007WO2007007731A1 Apparatus for removing foreign material from substrate and method for removing foreign material from substrate
01/18/2007WO2007007730A1 Positive photosensitive resin composition and process for pattern formation
01/18/2007WO2007007723A1 Substrate for immersion exposure, exposure method and method for manufacturing device
01/18/2007WO2007007683A1 Substrate, and method and device for polishing same
01/18/2007WO2007007680A1 Method of forming film and apparatus for film formation
01/18/2007WO2007007674A1 Electrostatic chuck and electrode sheet for electrostatic chuck
01/18/2007WO2007007670A1 Semiconductor device and electric device
01/18/2007WO2007007642A1 Apparatus and method for transferring substrate
01/18/2007WO2007007634A1 Electrode structure, semiconductor device and methods for manufacturing those
01/18/2007WO2007007626A1 Exposure method, exposure apparatus and device manufacturing method
01/18/2007WO2007007608A1 Semiconductor memory device and its fabrication method
01/18/2007WO2007007595A1 Semiconductor device
01/18/2007WO2007007589A1 Field effect transistor and method for manufacturing same
01/18/2007WO2007007580A1 Vibration isolation device and vibration isolation method
01/18/2007WO2007007561A1 Composition for formation of paraelectric thin-film, paraelectric thin-film and dielectric memory
01/18/2007WO2007007549A1 Surface position detection apparatus, exposure apparatus, and exposure method
01/18/2007WO2007007548A1 Transistor and method for operating same
01/18/2007WO2007007544A1 Probe card
01/18/2007WO2007007537A1 Bond wafer regenerating method, bond wafer, and ssoi wafer manufacturing method
01/18/2007WO2007007534A1 Sheet peeling apparatus and sheet peeling method
01/18/2007WO2007007533A1 Table for adhering sheet
01/18/2007WO2007007532A1 Sheet adhering apparatus
01/18/2007WO2007007531A1 Sheet adhering apparatus and sheet adhering method
01/18/2007WO2007007486A1 Field effect transistor
01/18/2007WO2007007447A1 Multilayer wiring structure and method for forming same
01/18/2007WO2007007445A1 Semiconductor device and method for manufacturing same
01/18/2007WO2007007402A1 Method for simulating ion implantation and method for fabricating semiconductor device
01/18/2007WO2007007386A1 Process for producing simox substrate, and simox substrate produced by said process
01/18/2007WO2007007375A1 Semiconductor device and fabrication method thereof
01/18/2007WO2007007372A1 Semiconductor measuring apparatus, semiconductor measuring method and semiconductor device manufacturing method
01/18/2007WO2007006914A1 Method for assembling substrates by depositing an oxide or nitride thin bonding layer
01/18/2007WO2007006803A1 Method for reducing roughness of a thick insulating layer
01/18/2007WO2007006764A2 Method of manufacturing a semiconductor power device
01/18/2007WO2007006508A1 Method for realising an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components
01/18/2007WO2007006507A1 Power field effect transistor and manufacturing method thereof
01/18/2007WO2007006506A1 Power field effect transistor and manufacturing method thereof
01/18/2007WO2007006505A1 Semiconductor power device with multiple drain structure and corresponding manufacturing process
01/18/2007WO2007006504A2 Power field effect transistor and manufacturing method thereof
01/18/2007WO2007006503A1 Semiconductor power device with multiple drain and corresponding manufacturing process
01/18/2007WO2007006337A1 A temperature sensing device
01/18/2007WO2006130375A3 Technique for reducing silicide non-uniformities by adapting avertical dopant profile
01/18/2007WO2006125069A3 A high resistivity silicon structure and a process for the preparation thereof
01/18/2007WO2006094280A3 Metal-insulator-metal capacitor manufactured using etchback
01/18/2007WO2006093643A3 Horizontal emitting, vertical emitting, beam shaped, distributed feedback (dfb) lasers by growth over a patterned substrate
01/18/2007WO2006092754A3 A method of manufacturing a semiconductor packages and packages made
01/18/2007WO2006088881A3 Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
01/18/2007WO2006087686A3 Method and arrangement for contact-connecting semiconductor chips on a metallic substrate
01/18/2007WO2006079577A3 Wafer table for preparing electrical components and device for equipping substrates with the components
01/18/2007WO2006076036A3 Nanostructure assemblies, methods and devices thereof
01/18/2007WO2006062576A3 Method and apparatus for improved baffle plate
01/18/2007WO2005122250A3 High power mcm package with improved planarity and heat dissipation
01/18/2007WO2005109522A3 Magnetoresistive memory soi cell
01/18/2007WO2005074531A3 Methods of synthesis of isotopically enriched borohydride and methods of synthesis of isotopically enriched boranes
01/18/2007WO2005060723A3 Wafer bonded epitaxial templates for silicon heterostructures
01/18/2007WO2005010566A3 A micromirror having reduced space between hinge and mirror plate of the micromirror
01/18/2007WO2004051704A3 System and method for expanding a pulse width
01/18/2007US20070016764 Starting Point Configuration Determination for Complex Configurable Systems
01/18/2007US20070016320 Substrate processing apparatus and substrate processing method
01/18/2007US20070015892 Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film
01/18/2007US20070015374 Apparatus and method for atomic layer deposition on substrates
01/18/2007US20070015373 Semiconductor device and method of processing a semiconductor substrate