Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/16/2007US7164180 Magnetoresistive random-access memory device
01/16/2007US7164178 Semiconductor device and method for manufacturing the same
01/16/2007US7164177 Multi-level memory cell
01/16/2007US7164176 Efficient transistor structure
01/16/2007US7164175 Semiconductor device with silicon-film fins and method of manufacturing the same
01/16/2007US7164174 Single poly-emitter PNP using dwell diffusion in a BiCMOS technology
01/16/2007US7164173 Method for manufacturing MOS transistor and semiconductor device employing MOS transistor made using the same
01/16/2007US7164172 Semiconductor device and method of manufacturing same
01/16/2007US7164171 Semiconductor device and fabrication method thereof
01/16/2007US7164170 Recess gate transistor structure for use in semiconductor device and method thereof
01/16/2007US7164169 Semiconductor device having high-permittivity insulation film and production method therefor
01/16/2007US7164167 Semiconductor storage device, its manufacturing method and operating method, and portable electronic apparatus
01/16/2007US7164166 Memory circuit with spacers between ferroelectric layer and electrodes
01/16/2007US7164165 MIS capacitor
01/16/2007US7164164 Display device and photoelectric conversion device
01/16/2007US7164162 Method for forming potassium/sodium ion sensing device applying extended-gate field effect transistor
01/16/2007US7164161 Method of formation of dual gate structure for imagers
01/16/2007US7164160 Integrated circuit device with a vertical JFET
01/16/2007US7164154 Gate wiring layout for silicon-carbide-based junction field effect transistor
01/16/2007US7164153 Thin film transistor array panel
01/16/2007US7164152 Laser-irradiated thin films having variable thickness
01/16/2007US7164151 Semiconductor device with pixel portion and driving circuit, and electronic device
01/16/2007US7164150 Photovoltaic device and manufacturing method thereof
01/16/2007US7164149 Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method
01/16/2007US7164141 Charged particle beam photolithography machine, standard substrate for correcting misalignment factor of charged particle beam photolithography machine, correcting method for charged particle beam photolithography machine, and method of manufacturing electronic device
01/16/2007US7164104 In-line heater for use in semiconductor wet chemical processing and method of manufacturing the same
01/16/2007US7164097 Solder ball bonding method and bonding device
01/16/2007US7163903 Method for making a semiconductor structure using silicon germanium
01/16/2007US7163902 Infra-red light-emitting device and method for preparing the same
01/16/2007US7163901 Methods for forming thin film layers by simultaneous doping and sintering
01/16/2007US7163900 Using polydentate ligands for sealing pores in low-k dielectrics
01/16/2007US7163899 Localized energy pulse rapid thermal anneal dielectric film densification method
01/16/2007US7163898 Method for manufacturing semiconductor integrated circuit structures
01/16/2007US7163897 Method for assaying elements in a substrate for optics, electronics, or optoelectronics
01/16/2007US7163896 Biased H2 etch process in deposition-etch-deposition gap fill
01/16/2007US7163895 Polishing method
01/16/2007US7163894 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same
01/16/2007US7163893 Advanced barrier liner formation for vias
01/16/2007US7163892 Process for producing integrated circuit, and substrate with integrated circuit
01/16/2007US7163891 High density DRAM with reduced peripheral device area and method of manufacture
01/16/2007US7163890 Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer
01/16/2007US7163889 Film for copper diffusion barrier
01/16/2007US7163888 Direct imprinting of etch barriers using step and flash imprint lithography
01/16/2007US7163887 Method for fabricating a semiconductor device
01/16/2007US7163886 Semiconductor integrated circuit device and process for manufacturing the same
01/16/2007US7163885 Method of migrating and fixing particles in a solution to bumps on a chip
01/16/2007US7163884 Semiconductor device and fabrication method thereof
01/16/2007US7163883 Edge seal for a semiconductor device
01/16/2007US7163882 Formulation and fabrication of an improved Ni based composite Ohmic contact to n-SiC for high temperature and high power device applications
01/16/2007US7163881 Method for forming CMOS structure with void-free dielectric film
01/16/2007US7163880 Gate stack and gate stack etch sequence for metal gate integration
01/16/2007US7163879 Hard mask etch for gate polyetch
01/16/2007US7163878 Ultra-shallow arsenic junction formation in silicon germanium
01/16/2007US7163877 Method and system for modifying a gate dielectric stack containing a high-k layer using plasma processing
01/16/2007US7163876 Method for manufacturing group-III nitride compound semiconductor, and group-III nitride compound semiconductor device
01/16/2007US7163875 Method of cutting an object and of further processing the cut material, and carrier for holding the object and the cut material
01/16/2007US7163874 Ferroelectric thin film manufacturing method, ferroelectric element manufacturing method, surface acoustic wave element, frequency filter, oscillator, electronic circuit, and electronic apparatus
01/16/2007US7163873 Substrate for stressed systems and method of making same
01/16/2007US7163872 Tunable-wavelength optical filter and method of manufacturing the same
01/16/2007US7163871 Manufacturing method of semiconductor device and oxidization method of semiconductor substrate
01/16/2007US7163870 Semiconductor integrated circuit device
01/16/2007US7163869 Shallow trench isolation structure with converted liner layer
01/16/2007US7163868 Method for forming a lightly doped drain in a thin film transistor
01/16/2007US7163867 Method for slowing down dopant-enhanced diffusion in substrates and devices fabricated therefrom
01/16/2007US7163866 SOI MOSFETS exhibiting reduced floating-body effects
01/16/2007US7163865 Method of forming transistor having recess channel in semiconductor memory, and structure thereof
01/16/2007US7163864 Method of fabricating semiconductor side wall fin
01/16/2007US7163863 Vertical memory cell and manufacturing method thereof
01/16/2007US7163862 Semiconductor memory devices and methods for fabricating the same
01/16/2007US7163861 Semiconductor devices, methods of manufacturing semiconductor devices, circuit substrates and electronic devices
01/16/2007US7163860 Method of formation of gate stack spacer and charge storage materials having reduced hydrogen content in charge trapping dielectric flash memory device
01/16/2007US7163859 Method of manufacturing capacitors for semiconductor devices
01/16/2007US7163858 Method of fabricating deep trench capacitor
01/16/2007US7163857 Buried strap contact for a storage capacitor and method for fabricating it
01/16/2007US7163856 Method of fabricating a lateral double-diffused mosfet (LDMOS) transistor and a conventional CMOS transistor
01/16/2007US7163855 Method for manufacturing semiconductor devices
01/16/2007US7163854 Fabrication method of a semiconductor device
01/16/2007US7163853 Method of manufacturing a capacitor and a metal gate on a semiconductor device
01/16/2007US7163852 Manufacturing method for semiconductor device
01/16/2007US7163851 Concurrent Fin-FET and thick-body device fabrication
01/16/2007US7163850 Bottom gate-type thin-film transistor and method for manufacturing the same
01/16/2007US7163849 Fabrication method of semiconductor integrated circuit device
01/16/2007US7163848 Semiconductor device and manufacturing method thereof
01/16/2007US7163847 Method of making circuitized substrate
01/16/2007US7163846 Method for manufacturing circuit devices
01/16/2007US7163845 Internal package heat dissipator
01/16/2007US7163844 Monolithic common carrier
01/16/2007US7163843 Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same
01/16/2007US7163842 Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)
01/16/2007US7163841 Method of manufacturing circuit device
01/16/2007US7163840 Flip chip package and manufacturing method thereof
01/16/2007US7163839 Multi-chip module and method of manufacture
01/16/2007US7163838 Method and apparatus for forming a DMD window frame with molded glass
01/16/2007US7163837 Method of forming a resistance variable memory element
01/16/2007US7163836 Method of manufacturing light emitting device
01/16/2007US7163835 Method for producing thin semiconductor films by deposition from solution
01/16/2007US7163834 CMOS image sensor and method of fabricating the same
01/16/2007US7163833 Display panel and manufacturing method of display panel
01/16/2007US7163832 Method for manufacturing CMOS image sensor
01/16/2007US7163831 Light-emitting element, production method thereof, and light-emitting apparatus