Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/17/2007EP1744348A2 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor
01/17/2007EP1744327A1 High thermal cycle conductor system
01/17/2007EP1744218A2 Filter, exposure apparatus, and device manufacturing method
01/17/2007EP1744213A1 Positive photosensitive resin composition, method for forming pattern, and electronic component
01/17/2007EP1744206A2 Liquid crystal display device
01/17/2007EP1744193A1 Optical element holding device with drive mechanism allowing movement of the element along three coordinate axes
01/17/2007EP1744167A1 Sheet-like probe, method of producing the probe, and application of the probe
01/17/2007EP1744166A1 Sheet-like probe, method of producing the probe, and application of the probe
01/17/2007EP1743961A1 Compound semiconductor substrate
01/17/2007EP1743953A1 Method for forming copper film
01/17/2007EP1743949A1 Production of high-purity zirconium or hafnium metal and powder for target and film applications
01/17/2007EP1743715A1 An ultrasonic edge washing apparatus
01/17/2007EP1743383A2 Magnetoresistive memory soi cell
01/17/2007EP1743382A1 Co-planar thin film transistor having additional source/drain insulation layer
01/17/2007EP1743380A1 Split-channel antifuse array architecture
01/17/2007EP1743379A2 Hot electron transistor
01/17/2007EP1743378A1 Semiconductor device and method of manufacturing such a device
01/17/2007EP1743375A1 Fabrication of active areas of different natures directly onto an insulator: application to the single or double gate mos transistor
01/17/2007EP1743373A2 Method and device with durable contact on silicon carbide
01/17/2007EP1743371A2 Integrated circuit chip with electrostatic discharge protection device
01/17/2007EP1743368A1 Sawing and handler system for manufacturing semiconductor package
01/17/2007EP1743367A1 Methods of forming electrical connections for semiconductor constructions
01/17/2007EP1743366A2 Wiring structure for integrated circuit with reduced intralevel capacitance
01/17/2007EP1743365A2 Cystotomy catheter capture device and methods of using same
01/17/2007EP1743364A2 Process for metallic contamination reduction in silicon wafers
01/17/2007EP1743363A2 Thermally cured undercoat for lithographic application
01/17/2007EP1743362A1 Loading device for chemical mechanical polisher of semiconductor wafer
01/17/2007EP1743361A1 Plasma source coil and plasma chamber using the same
01/17/2007EP1743360A2 Method for depositing high-quality microcrystalline semiconductor materials
01/17/2007EP1743359A1 Methods for producing ruthenium film and ruthenium oxide film
01/17/2007EP1743358A2 Light emitting diode component
01/17/2007EP1743342A1 An organic electronic circuit with functional interlayer and method for making the same
01/17/2007EP1743339A2 Silicon on insulator read-write non-volatile memory comprising lateral thyristor and trapping layer
01/17/2007EP1743220A2 Device for covering substrates in a rotating manner
01/17/2007EP1743217A2 Method for imprint lithography at constant temperature
01/17/2007EP1742758A1 A method of laser etching a structure by first radiating areas of the structure for altering the crystallinity
01/17/2007EP1644179B1 Mehtod for structuring a substrate surface
01/17/2007EP1451873A4 Wearable biomonitor with flexible thinned integrated circuit
01/17/2007EP1399766B1 Exposure apparatus comprising an optical element made of an isometric crystal
01/17/2007EP1399600B1 Compositions, methods and devices for high temperature lead-free solder
01/17/2007EP1373331A4 Thermally cured underlayer for lithographic application
01/17/2007EP1344258B1 Device for detecting three-dimensional electromagnetic radiation and method for making same
01/17/2007EP1312965B1 Optical element holding device
01/17/2007EP1289728B1 Encapsulation using microcellular foamed materials
01/17/2007EP1252079B1 Wafer transport system
01/17/2007EP1234332B1 Dram cell structure with tunnel barrier
01/17/2007EP1203108B1 Cooled window
01/17/2007EP1196943A4 Process for removing contaminant from a surface and composition useful therefor
01/17/2007EP1142849B1 Silicon nitride composite substrate
01/17/2007EP1138091B1 Conductive structure based on poly-3,4-alkenedioxythiophene (pedot) and polystyrenesulfonic acid (pss)
01/17/2007EP1048076B1 Low trigger and holding voltage scr device for esd protection
01/17/2007EP1023771B1 Electrical impedance matching system and method
01/17/2007CN2858207Y Broken-proof and overturned manipulator for on-line test of monomer solar battery
01/17/2007CN1899004A Wiring formation method, wiring formation equipment, and wiring board
01/17/2007CN1899003A Etching solution, method of etching and printed wiring board
01/17/2007CN1898993A Electroluminescent devices and methods of making electroluminescent devices including a color conversion element
01/17/2007CN1898817A Method for manufacturing organic thin film transistor, and organic thin film transistor and sheet thereof manufactured by such method
01/17/2007CN1898803A Semiconductor device comprising a heterojunction
01/17/2007CN1898802A Image display screen and method for controlling said screen
01/17/2007CN1898801A Vertical gate semiconductor device and process for fabricating the same
01/17/2007CN1898799A Manufacture of semiconductor device
01/17/2007CN1898797A Wafer with optical control modules in ic fields
01/17/2007CN1898796A Wafer with optical control modules in dicing paths
01/17/2007CN1898794A Electronic packaging materials for use with low-k dielectric-containing semiconductor devices
01/17/2007CN1898792A Contactless flash memory array
01/17/2007CN1898791A Support system for semiconductor wafers and methods thereof
01/17/2007CN1898790A Dicing/die bonding film and method of manufacturing the same
01/17/2007CN1898789A Transfer mechanism and transfer method of semiconductor package
01/17/2007CN1898788A Process controls for improved wafer uniformity using integrated or standalone metrology
01/17/2007CN1898787A Ic chip mounting body manufacturing method and manufacturing device
01/17/2007CN1898786A Semiconductor device and method of manufacturing thereof
01/17/2007CN1898785A Epitaxially deposited source/drain
01/17/2007CN1898784A Semiconductor device comprising a heterojunction
01/17/2007CN1898783A Plasma processing apparatus
01/17/2007CN1898782A Electrostatic chuck and chuck base having cooling path for cooling wafer
01/17/2007CN1898781A Method and apparatus for seasoning semiconductor apparatus of sensing plasma equipment
01/17/2007CN1898780A Method for setting plasma chamber having an adaptive plasma source, plasma etching method using the same and manufacturing method for adaptive plasma source
01/17/2007CN1898779A A semiconductor substrate with solid phase epitaxial regrowth with reduced depth of doping profile and method of producing same
01/17/2007CN1898778A Method for producing group iii nitride crystal, group iii nitride crystal obtained by such method, and group iii nitride substrate using same
01/17/2007CN1898777A Method for patterning a ferroelectric polymer layer
01/17/2007CN1898776A Apparatuses and methods for cleaning a substrate
01/17/2007CN1898775A Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foam, bubbles, and/or liquids
01/17/2007CN1898774A Small volume process chamber with hot inner surfaces
01/17/2007CN1898773A Edge wheel dry manifold
01/17/2007CN1898772A A chemical oxide removal(cor) processing system and method
01/17/2007CN1898771A Wafer handler method and system
01/17/2007CN1898770A Method of producing an element comprising an electrical conductor encircled by magnetic material
01/17/2007CN1898713A Display, and method for fabricating same
01/17/2007CN1898712A Method of manufacturing display device
01/17/2007CN1898611A Chuck system, lithographic apparatus using the same and device manufacturing method
01/17/2007CN1898572A Conductive contact holder, conductive contact unit and process for producing conductive contact holder
01/17/2007CN1898411A Exhaust conditioning system for semiconductor reactor
01/17/2007CN1898410A Deposition of titanium nitride film
01/17/2007CN1898409A Method and apparatus for forming a high quality low temperature silicon nitride layer
01/17/2007CN1898281A Hyperbranched polymer, process for producing the same and resist composition containing the hyperbranched polymer
01/17/2007CN1898183A Aluminum nitride bonded material and method of manufacturing the same
01/17/2007CN1898056A Laser processing protection sheet and production method for laser processed article
01/17/2007CN1897784A Reducing electrostatic charge by roughening the susceptor
01/17/2007CN1897320A Novel phase change memory and its forming method
01/17/2007CN1897317A Gallium nitride-based iii-v group compound semiconductor device