| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/25/2007 | US20070018284 Gallium nitride semiconductor substrate and process for producing the same |
| 01/25/2007 | US20070018280 Antifuse structure and system for closing thereof |
| 01/25/2007 | US20070018276 Semiconductor device and method of manufacturing the same |
| 01/25/2007 | US20070018275 Semiconductor device with trench structure |
| 01/25/2007 | US20070018268 Monolithically integrated vertical pin photodiode used in bicmos technology |
| 01/25/2007 | US20070018262 Micromachine and production method thereof |
| 01/25/2007 | US20070018260 Devices having vertically-disposed nanofabric articles and methods of making the same |
| 01/25/2007 | US20070018255 Semiconductor device and method for fabricating the same |
| 01/25/2007 | US20070018254 Shared contact structure, semiconductor device and method of fabricating the semiconductor device |
| 01/25/2007 | US20070018248 Power gating schemes in SOI circuits in hybrid SOI-epitaxial CMOS structures |
| 01/25/2007 | US20070018243 Semiconductor element and method of manufacturing the same |
| 01/25/2007 | US20070018235 Nonvolatile semiconductor memory device including improved gate electrode |
| 01/25/2007 | US20070018231 Nonvolatile semiconductor memory device, semiconductor device and manufacturing method of nonvolatile semiconductor memory device |
| 01/25/2007 | US20070018229 Electronic device including discontinuous storage elements and a process for forming the same |
| 01/25/2007 | US20070018225 Integrated Stacked Capacitor and Method of Fabricating Same |
| 01/25/2007 | US20070018224 Devices and methods for preventing capacitor leakage |
| 01/25/2007 | US20070018223 Dram including a vertical surround gate transistor |
| 01/25/2007 | US20070018218 Fin field effect transistor memory cell, fin field effect transistor memory cell arrangement and method for producing the fin field effect transistor memory cell |
| 01/25/2007 | US20070018215 Semiconductor constructions, memory arrays, electronic systems, and methods of forming semiconductor constructions |
| 01/25/2007 | US20070018214 Magnesium titanium oxide films |
| 01/25/2007 | US20070018205 STRUCTURE AND METHOD FOR IMPROVED STRESS AND YIELD IN pFETS WITH EMBEDDED SiGe SOURCE/DRAIN REGIONS |
| 01/25/2007 | US20070018187 Vertical GaN-based LED and method of manfacturing the same |
| 01/25/2007 | US20070018186 Light emitting diode device having advanced light extraction efficiency and preparation method thereof |
| 01/25/2007 | US20070018180 Vertical electrode structure of gallium nitride based light emitting diode |
| 01/25/2007 | US20070018179 Vertical conducting power semiconducting devices made by deep reactive ion etching |
| 01/25/2007 | US20070018167 Semiconductor integrated circuit and method of fabricating same |
| 01/25/2007 | US20070018164 Semiconductor Device and Manufacturing Method Thereof |
| 01/25/2007 | US20070018161 Thin film transistor substrate and method for fabricating the same |
| 01/25/2007 | US20070018152 Organic electroluminescent device, manufacturing method therefor, and electronic devices therewith |
| 01/25/2007 | US20070018151 Short-channel transistors |
| 01/25/2007 | US20070017907 Laser treatment device, laser treatment method, and semiconductor device fabrication method |
| 01/25/2007 | US20070017903 Method for Treating an Etching Solution |
| 01/25/2007 | US20070017902 Method for the chemical treatment of copper surfaces for the removal of carbonaceous residues |
| 01/25/2007 | US20070017901 Method and apparatus for etching disk-like member |
| 01/25/2007 | US20070017900 edge region with no defects larger than or equal to 0.3 .mu.m |
| 01/25/2007 | US20070017899 Method of controlling the critical dimension of structures formed on a substrate |
| 01/25/2007 | US20070017898 Method and apparatus for photomask plasma etching |
| 01/25/2007 | US20070017896 Method for controlling a process for fabricating integrated devices |
| 01/25/2007 | US20070017636 Plasma source and plasma processing apparatus |
| 01/25/2007 | US20070017630 Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods |
| 01/25/2007 | US20070017446 Apparatus to treat a substrate |
| 01/25/2007 | US20070017289 Three-dimensional acceleration sensor and method for fabricating the same |
| 01/25/2007 | US20070017093 Method of making an interposer with contact structures |
| 01/25/2007 | DE4329260B4 Verfahren zur Herstellung einer Verdrahtung in einem Halbleiterbauelement A process for producing a wiring in a semiconductor device |
| 01/25/2007 | DE19927046B4 Keramik-Metall-Substrat als Mehrfachsubstrat Ceramic-metal substrate as a multiple substrate |
| 01/25/2007 | DE19756179B4 Für einen Halbleiterchip-Baustein bestimmter Leiterrahmen mit einem vorgeformten Montageplatz aus einer Epoxid-Giessverbindung For a semiconductor chip package of certain ladder frame with a preformed assembly site of an epoxy molding compound |
| 01/25/2007 | DE19752176B4 Herstellungssystem für bestückte Leiterplatten und zugehöriges Verfahren Production system for printed circuit board assemblies and associated method |
| 01/25/2007 | DE19638433B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device |
| 01/25/2007 | DE112004002804T5 Züchtungsverfahren für eine Nitridhalbleiterschicht sowie Lichtemissionsbauteil unter Verwendung dieses Züchtungsverfahrens The growth method of a nitride semiconductor light emitting device and using this growing method |
| 01/25/2007 | DE112004002678T5 2-Transistoren-Schmelzsicherungselement mit einzelner Polysiliziumschicht 2 transistors fuse element with single polysilicon layer |
| 01/25/2007 | DE112004000766T5 Chipschneidvorrichtung Chip cutter |
| 01/25/2007 | DE10333777B4 Herstellungsverfahren für einen Grabenkondensator mit einem Isolationskragen, der über einen vergrabenen Kontakt einseitig mit einem Substrat elektrisch verbunden ist, insbesondere für eine Halbleiterspeicherzelle Manufacturing method for a grave capacitor with an insulation collar, which is electrically connected through a buried contact on one side with a substrate, in particular for a semiconductor memory cell |
| 01/25/2007 | DE10321466B4 Trench-Speicherkondensator und Verfahren zu dessen Herstellung Trench storage capacitor and process for its preparation |
| 01/25/2007 | DE10259221B4 Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben The same electronic component having a stack of semiconductor chips and processes for making |
| 01/25/2007 | DE10224167B4 Verfahren zur Herstellung einer Kupferleitung mit erhöhter Widerstandsfähigkeit gegen Elektromigration in einem Halbleiterelement A process for producing a copper wire with increased resistance to electromigration in a semiconductor element |
| 01/25/2007 | DE102006032458A1 Wafer treatment method fixes wafer with specified sections onto clamping table of polishing machine, with wafer upside down, for section of wafer rear side polishing |
| 01/25/2007 | DE102006030632A1 Transfer-ESC for moving ultra-thin chips during manufacture has a base material wafer with a multiplicity of grouped electrode cells each with an electrode tip, insulator, outer electrode cover and dielectric cover |
| 01/25/2007 | DE102006028137A1 Verfahren zur Herstellung einer Nitrid-basierten Verbindungsschicht, eines GaN-Substrats und einer Nitrid-basierten Halbleiter-Leuchtvorrichtung mit vertikaler Struktur A method of manufacturing a nitride-based compound layer, a GaN substrate and a nitride-based semiconductor light-emitting device having a vertical structure |
| 01/25/2007 | DE102006024185A1 Verfahren zum Herstellen einer Siliziumkarbidhalbleitervorrichtung A method of manufacturing a silicon carbide semiconductor device |
| 01/25/2007 | DE102006015448A1 Wiring structure of semiconductor component has conductive tracks between chip contact spots and surface mounted outer contact spots with solder balls |
| 01/25/2007 | DE102006008332A1 Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit A process for preparing a functional unit and functional unit |
| 01/25/2007 | DE102005041354B3 Method of mounting components provided with gold stud bumps onto a circuit board using isostatic force |
| 01/25/2007 | DE102005034475A1 Vorrichtung Device |
| 01/25/2007 | DE102005033254A1 Chip-Trägersubstrat aus Silizium mit durchgehenden Kontakten und Herstellungsverfahren dafür Chip carrier substrate of silicon with through contacts, and processes for its preparation |
| 01/25/2007 | DE102005033036A1 Vorrichtung zur Inspektion eines Wafers Apparatus for inspecting a wafer |
| 01/25/2007 | DE102005032454A1 Detaching transfer film from semiconductor substrate and for its transfer by dry chemical etching, preferably by gas phase etching using specified doping |
| 01/25/2007 | DE102005010821B4 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device |
| 01/25/2007 | DE10150822B4 Verfahren zum Entfernen oxidierter Bereiche auf einer Grenzfläche einer Metalloberfläche A method for removing oxidized areas on a interface of a metal surface |
| 01/25/2007 | DE10149916B4 Verfahren zum Planarisieren von Prozessflächen in Halbleitereinrichtungen Method for planarizing process areas in semiconductor devices |
| 01/25/2007 | DE10082909B4 Nichtflüchtige ferroelektrische Speicherzelle, nichtflüchtiger ferroelektrischer Speicher und Verfahren zu seiner Herstellung A non-volatile ferroelectric memory cell, non-volatile ferroelectric memory and method for its preparation |
| 01/25/2007 | CA2612127A1 Semiconductor device including a strained superlattice between at least one pair of spaced apart stress regions and associated methods |
| 01/25/2007 | CA2612123A1 Semiconductor device including a strained superlattice and overlying stress layer and related methods |
| 01/25/2007 | CA2612118A1 Semiconductor device including a strained superlattice layer above a stress layer and associated methods |
| 01/25/2007 | CA2525364A1 Nanoimprint lithograph for fabricating nanoadhesive |
| 01/24/2007 | EP1746866A1 Packaging chip having inductor therein |
| 01/24/2007 | EP1746659A2 Transistor and semiconductor device |
| 01/24/2007 | EP1746652A1 Circuit substrate and method of manufacturing the same |
| 01/24/2007 | EP1746651A2 IC chip mounting method |
| 01/24/2007 | EP1746646A1 Pressure contact type rectifier |
| 01/24/2007 | EP1746645A2 Memory array with sub-minimum feature size word line spacing and method of fabrication |
| 01/24/2007 | EP1746644A2 Methods of forming local interconnects and conductive lines, and resulting structure |
| 01/24/2007 | EP1746643A1 Process of making a MOS transistor and corresponding integrated circuit |
| 01/24/2007 | EP1746642A2 Process for exposing solder bumps on an underfill coated semiconductor |
| 01/24/2007 | EP1746641A1 Group iii nitride semiconductor device and epitaxial substrate |
| 01/24/2007 | EP1746640A1 Process to control the pressure of a process chamber |
| 01/24/2007 | EP1746639A1 Wet etching method of single wafer |
| 01/24/2007 | EP1746638A2 Semiconductor devices with reduced active region defectcs and unique contacting schemes |
| 01/24/2007 | EP1746637A1 Drive method for mobile body, stage device, and exposure device |
| 01/24/2007 | EP1746636A1 IC chip mounting method |
| 01/24/2007 | EP1746622A1 Method for forming carbonaceous material protrusion and carbonaceous material protrusion |
| 01/24/2007 | EP1746461A1 Negative radiation-sensitive resin composition |
| 01/24/2007 | EP1746386A2 Method of measuring three-dimensional surface roughness of a structure |
| 01/24/2007 | EP1746369A2 Water removal apparatus and inspection apparatus including same |
| 01/24/2007 | EP1746183A1 Process for obtaining thin films of zirconium nitride |
| 01/24/2007 | EP1746182A2 Hybrid pvd-cvd system |
| 01/24/2007 | EP1746139A1 Composition for forming insulating film, method for producing same, silica insulating film and method for forming same |
| 01/24/2007 | EP1746123A1 Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation |
| 01/24/2007 | EP1746122A1 Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation |
| 01/24/2007 | EP1745864A2 Method of removing residues formed during the manufacture of MEMS systems |
| 01/24/2007 | EP1745515A1 Tuneable semiconductor device |