| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/18/2007 | US20070015372 Etching solution, method of forming a pattern using the same, method of manufacturing a multiple gate oxide layer using the same and method of manufacturing a flash memory device using the same |
| 01/18/2007 | US20070015371 Etching radical controlled gas chopped deep reactive ion etching |
| 01/18/2007 | US20070015370 Manufacturing method for semiconductor device |
| 01/18/2007 | US20070015369 Method of manufacturing a semiconductor device |
| 01/18/2007 | US20070015368 Method of reducing silicon damage around laser marking region of wafers in sti cmp process |
| 01/18/2007 | US20070015367 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures |
| 01/18/2007 | US20070015366 Semiconductor device and programming method |
| 01/18/2007 | US20070015365 Method and apparatus for enhanced CMP planarization using surrounded dummy design |
| 01/18/2007 | US20070015364 Method for avoiding exposure of void caused by dielectric gap-filling, and fabricating process and structure of dielectric film |
| 01/18/2007 | US20070015363 Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus |
| 01/18/2007 | US20070015362 Semiconductor device having storage nodes and its method of fabrication |
| 01/18/2007 | US20070015361 Manufacturing method of micro-electro-mechanical device |
| 01/18/2007 | US20070015360 Contact clean by remote plasma and repair of silicide surface |
| 01/18/2007 | US20070015359 Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects |
| 01/18/2007 | US20070015358 Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects |
| 01/18/2007 | US20070015357 Process of adhesive bonding with patternable polymers for producing microstructure devices on a wafer assembly |
| 01/18/2007 | US20070015356 Method for forming contact hole in semiconductor device |
| 01/18/2007 | US20070015355 Methods for forming interconnect structures |
| 01/18/2007 | US20070015354 Method for manufacturing electronic device and electronic device |
| 01/18/2007 | US20070015353 Electrically connecting substrate with electrical device |
| 01/18/2007 | US20070015352 Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads |
| 01/18/2007 | US20070015351 Process or making a semiconductor device having a roughened surface |
| 01/18/2007 | US20070015350 Methods of manufacturing carbon nanotubes |
| 01/18/2007 | US20070015349 Method of producing a composite multilayer |
| 01/18/2007 | US20070015348 Crosspoint resistor memory device with back-to-back Schottky diodes |
| 01/18/2007 | US20070015346 Mixed orientation and mixed material semiconductor-on-insulator wafer |
| 01/18/2007 | US20070015345 Lateral growth method for defect reduction of semipolar nitride films |
| 01/18/2007 | US20070015344 Method for Making a Semiconductor Device Including a Strained Superlattice Between at Least One Pair of Spaced Apart Stress Regions |
| 01/18/2007 | US20070015343 Method for dicing a semiconductor wafer |
| 01/18/2007 | US20070015342 Fabrication method of semiconductor circuit device |
| 01/18/2007 | US20070015341 Method of making mems wafers |
| 01/18/2007 | US20070015340 Method and structure for interfacing electronic devices |
| 01/18/2007 | US20070015339 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry |
| 01/18/2007 | US20070015338 Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same |
| 01/18/2007 | US20070015337 Semiconductor device and method for fabricating the same |
| 01/18/2007 | US20070015336 Method of making a multi-electrode double layer capacitor having hermetic electrolyte seal |
| 01/18/2007 | US20070015335 Production method for antenna and production device for antenna |
| 01/18/2007 | US20070015334 Method for forming a fully silicided gate and devices obtained thereof |
| 01/18/2007 | US20070015333 Method for manufacturing silicon carbide semiconductor devices |
| 01/18/2007 | US20070015332 Non-volatile memory with asymmetrical doping profile |
| 01/18/2007 | US20070015331 Nor flash memory cell with high storage density |
| 01/18/2007 | US20070015330 Metal/semiconductor/metal (MSM) back-to-back Schottky diode |
| 01/18/2007 | US20070015329 Metal/ZnOx/metal current limiter |
| 01/18/2007 | US20070015328 MSM binary switch memory device |
| 01/18/2007 | US20070015327 Method of fabricating a trench capacitor dram device |
| 01/18/2007 | US20070015326 Integrated circuit and fabrication process |
| 01/18/2007 | US20070015325 Manufacturing method for an integrated semiconductor structure and corresponding integrated semiconductor structure |
| 01/18/2007 | US20070015324 Fabrication method for single and dual gate spacers on a semiconductor device |
| 01/18/2007 | US20070015323 Semiconductor device and method of manufacturing the same |
| 01/18/2007 | US20070015322 Method of forming doped regions in the bulk substrate of an soi substrate to control the operational characteristics of transistors formed thereabove, and an integrated circuit device comprising same |
| 01/18/2007 | US20070015321 Manufacturing method for semiconductor device |
| 01/18/2007 | US20070015320 Method of making a polycrystalline thin film, a mask pattern used in the same and a method of making a flat panel display device using the same |
| 01/18/2007 | US20070015319 Method for forming contact hole and method for fabricating thin film transistor plate using the same |
| 01/18/2007 | US20070015318 Method of manufacturing a thin film transistor |
| 01/18/2007 | US20070015317 Method of forming metal line and contact plug of flash memory device |
| 01/18/2007 | US20070015316 Folded frame carrier for MOSFET BGA |
| 01/18/2007 | US20070015315 Semiconductor device and manufacturing method thereof |
| 01/18/2007 | US20070015314 Adhesive/Spacer Island Structure for Multiple Die Package |
| 01/18/2007 | US20070015313 Submount of semiconductor laser diode, method of manufacturing the same, and semiconductor laser diode assembly using the submount |
| 01/18/2007 | US20070015312 Method for forming bump protective collars on a bumped wafer |
| 01/18/2007 | US20070015311 Structure of mounting electronic component and method of mounting the same |
| 01/18/2007 | US20070015310 Polyceramic-coated tool for applying a flowable composition |
| 01/18/2007 | US20070015309 Electronic part manufacturing method |
| 01/18/2007 | US20070015308 Schottky diode structure to reduce capacitance and switching losses and method of making same |
| 01/18/2007 | US20070015307 Method for manufacturing semiconductor device |
| 01/18/2007 | US20070015306 Manufacturing method of P type group III nitride semiconductor layer and light emitting device |
| 01/18/2007 | US20070015305 Semiconductor device with micro-lens and method of making the same |
| 01/18/2007 | US20070015304 Low compressive TiNx, materials and methods of making the same |
| 01/18/2007 | US20070015303 Nanotube device structure and methods of fabrication |
| 01/18/2007 | US20070015302 Semiconductor device and method of manufacturing thereof |
| 01/18/2007 | US20070015301 Multi spectral sensor |
| 01/18/2007 | US20070015300 Method for fabricating a light-emitting device |
| 01/18/2007 | US20070015299 Co-doping for fermi level control in semi-insulating group III nitrides |
| 01/18/2007 | US20070015298 Optical element, optical module and method for manufacturing the same |
| 01/18/2007 | US20070015297 Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing |
| 01/18/2007 | US20070015296 Methods and systems for characterizing semiconductor materials |
| 01/18/2007 | US20070015295 Methods and systems for characterizing semiconductor materials |
| 01/18/2007 | US20070015294 Novel structure/method to fabricate a high-performance magnetic tunneling junction MRAM |
| 01/18/2007 | US20070015293 TMR device with surfactant layer on top of CoFexBy/CoFez inner pinned layer |
| 01/18/2007 | US20070015153 Surface treatment |
| 01/18/2007 | US20070015069 mask includes multiple transmissive areas having a plurality of first slits for adjusting energy of the laser illumination passing through the mask; and an opaque area; for laser illumination to convert amorphous silicon into polysilicon |
| 01/18/2007 | US20070015067 Filter exposure apparatus, and device manufacturing method |
| 01/18/2007 | US20070015065 Euv exposure mask blanks and their fabrication process, and euv exposure mask |
| 01/18/2007 | US20070014923 Method of Electroless Deposition of Thin Metal and Dielectric Films with Temperature Controlled Stages of Film Growth |
| 01/18/2007 | US20070014915 Method of Surface Treating Substrates and Method of Manufacturing III-V Compound Semiconductors |
| 01/18/2007 | US20070014172 Memory device capable of performing high speed reading while realizing redundancy replacement |
| 01/18/2007 | US20070014169 Semiconductor memory device and semiconductor integrated circuit |
| 01/18/2007 | US20070014112 Variable slit apparatus, illumination apparatus, exposure apparatus, exposure method, and device fabrication method |
| 01/18/2007 | US20070014073 Transfer-ESC based on a wafer |
| 01/18/2007 | US20070013903 System for detection of wafer defects |
| 01/18/2007 | US20070013859 Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same |
| 01/18/2007 | US20070013405 Test head docking system and method |
| 01/18/2007 | US20070013397 Inspection system, inspection method, and method for manufacturing semiconductor device |
| 01/18/2007 | US20070013394 Dual feedback control system for maintaining the temperature of an ic-chip near a set-point |
| 01/18/2007 | US20070013284 Plasma accelerating apparatus and plasma processing system having the same |
| 01/18/2007 | US20070013084 Bumped die and wire bonded board-on-chip package |
| 01/18/2007 | US20070013083 Semiconductor device and a manufacturing method of the same |
| 01/18/2007 | US20070013069 Wiring structure and method for manufacturing the same |
| 01/18/2007 | US20070013067 Electronic component mounting method and apparatus |
| 01/18/2007 | US20070013060 Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation |