| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/24/2007 | CN1901203A Semiconductor device and method for forming a semiconductor structure |
| 01/24/2007 | CN1901202A 半导体元件及其形成方法 Semiconductor device and method of forming |
| 01/24/2007 | CN1901201A Non-volatile memory device having fin-type channel region and method of fabricating the same |
| 01/24/2007 | CN1901200A Nonvolatile memory devices and methods of fabricating the same |
| 01/24/2007 | CN1901198A Electronic assembly and method for producing an electronic assembly |
| 01/24/2007 | CN1901197A Vertical pnp transistor and method of making same |
| 01/24/2007 | CN1901194A Semiconductor device and method for fabricating the same |
| 01/24/2007 | CN1901192A Esd protection device in high voltage and manufacturing method for the same |
| 01/24/2007 | CN1901191A Shallow trench isolation structure and method of fabricating the same |
| 01/24/2007 | CN1901189A Plane flip-chip LED integrated chip and producing method |
| 01/24/2007 | CN1901185A Transient voltage protection apparatus, material and manufacturing methods |
| 01/24/2007 | CN1901184A 半导体器件 Semiconductor devices |
| 01/24/2007 | CN1901183A Substrate, smart card modules and methods for fabricating the same |
| 01/24/2007 | CN1901182A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/24/2007 | CN1901181A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/24/2007 | CN1901177A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/24/2007 | CN1901172A Semiconductor wafer and process for producing a semiconductor wafer |
| 01/24/2007 | CN1901169A Method for manufacturing thin film transistor substrate |
| 01/24/2007 | CN1901168A Method for producing film tranistor array and its driving circuit |
| 01/24/2007 | CN1901167A Semiconductor device and method of manufacturing thereof |
| 01/24/2007 | CN1901166A Method for manufacturing contact structures for dram semiconductor memories |
| 01/24/2007 | CN1901165A Method for making channel capacitor dynamic random access storage unit |
| 01/24/2007 | CN1901164A Manufacturing method of semiconductor device |
| 01/24/2007 | CN1901163A Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 01/24/2007 | CN1901162A Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 01/24/2007 | CN1901161A Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 01/24/2007 | CN1901160A Manufacturing method for electronic substrate and manufacturing method for electro-optical device |
| 01/24/2007 | CN1901159A Manufacturing method of a matrix type display device |
| 01/24/2007 | CN1901158A Method of manufacturing thin film transistor substrate |
| 01/24/2007 | CN1901157A Forming method for film pattern, device, electro-optical apparatus, electronic apparatus, and manufacturing method for active matrix substrate |
| 01/24/2007 | CN1901156A Method for producing double embedded structure |
| 01/24/2007 | CN1901155A Holder for fabricating organic light emitting display |
| 01/24/2007 | CN1901154A Actuatable loadport system |
| 01/24/2007 | CN1901153A Wafer transferring apparatus and transferring method thereof |
| 01/24/2007 | CN1901152A Etching method and apparatus |
| 01/24/2007 | CN1901151A Voltage measuring method, electrical inspection method, electrical inspection device, manufacturing method of semiconductor device and manufacturing method of element substrate |
| 01/24/2007 | CN1901150A Process for exposing solder bumps on an underfill coated semiconductor |
| 01/24/2007 | CN1901149A Semiconductor device and method of manufacturing the same |
| 01/24/2007 | CN1901148A IC chip mounting method |
| 01/24/2007 | CN1901147A Ic芯片安装方法 Ic chip mounting method |
| 01/24/2007 | CN1901146A Semiconductor device and manufacturing method of the same |
| 01/24/2007 | CN1901145A Variable capacitor structure and its producing method |
| 01/24/2007 | CN1901144A Method for producing heavy blended gallium nitride field effect transistor |
| 01/24/2007 | CN1901143A Method for forming super large scale integrated circuit refractory metal silicide |
| 01/24/2007 | CN1901142A Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method |
| 01/24/2007 | CN1901141A Method for preparing nano electrode based on silicon nitride hollowed-out mask |
| 01/24/2007 | CN1901140A 真空控制系统 Vacuum control system |
| 01/24/2007 | CN1901139A Method for preapring nano size pit on gallium arsenide substrate |
| 01/24/2007 | CN1901138A Mask, mask chip, manufacturing method of mask, manufacturing method of mask chip, and electronic device |
| 01/24/2007 | CN1900829A Method for removing photoresist, etch and/or polymeric residues or contaminants from semiconductor substrates |
| 01/24/2007 | CN1900827A Method and system for maskless lithography real-time pattern rasterization and using computationally coupled mirrors to achieve optimum feature representation |
| 01/24/2007 | CN1900826A Mask formation over an integrated electronic circuit |
| 01/24/2007 | CN1900823A Method of uniformly coating a substrate |
| 01/24/2007 | CN1900820A Pattern forming method and method for fabricating semiconductor device by using the same to form desired pattern |
| 01/24/2007 | CN1900819A Photomask blank, photomask and fabrication method thereof |
| 01/24/2007 | CN1900782A Display device manufacturing method |
| 01/24/2007 | CN1900725A Lithographic contact elements |
| 01/24/2007 | CN1900386A Method for epitaxial growing AlxGa1-xN single crystal film on saphire lining bottom material |
| 01/24/2007 | CN1900364A Method for removal of copper oxide film from substrate processing surface |
| 01/24/2007 | CN1900363A 清洗液及其用途 Cleaning fluid and its use |
| 01/24/2007 | CN1900358A Apparatus for electroless deposition of metals onto semiconductor substrates |
| 01/24/2007 | CN1900195A Adhesive agent for circuit member connection, circuit board and its producing method |
| 01/24/2007 | CN1900192A Polishing composition and polishing method |
| 01/24/2007 | CN1899951A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/24/2007 | CN1297046C Semiconductor light-emitting device and its manufacturing method |
| 01/24/2007 | CN1297016C Nitride semiconductor device |
| 01/24/2007 | CN1297015C Nonvolatile memory with ferroelectric gate field effect transistor and manufacture thereof |
| 01/24/2007 | CN1297013C Dipolar transistor and its producing method |
| 01/24/2007 | CN1297011C Semiconductor device and manufacturing method thereof |
| 01/24/2007 | CN1297010C Semiconductor device with analog capacitor and its production method |
| 01/24/2007 | CN1297008C Thin film transistor and display device using the same |
| 01/24/2007 | CN1297007C Semiconductor device |
| 01/24/2007 | CN1297005C Semiconductor device and bleeder circuit |
| 01/24/2007 | CN1297004C Semiconductor device and bleeder circuit |
| 01/24/2007 | CN1297003C Semiconductor device and bleeder circuit |
| 01/24/2007 | CN1297001C Structure and method for reducing thermal-mechanical stress in superposed through hole |
| 01/24/2007 | CN1297000C Interconnection structure containing stress regulating covering and its manufacturing method |
| 01/24/2007 | CN1296999C Semiconductor integrated circuit with shortened pad pitch |
| 01/24/2007 | CN1296998C Semiconductor device, semiconductor package, and method for testing semiconductor device |
| 01/24/2007 | CN1296997C Cu-pad/bonded/cu-wire with self-passivating cu-alloys |
| 01/24/2007 | CN1296992C Method for manufacturing DRAM crystal cell structure by utilizing oxidizing wire clearance walls and back etching |
| 01/24/2007 | CN1296991C Fin FET devices from bulk semiconductor and method for forming |
| 01/24/2007 | CN1296990C Method for manufacturing semiconductor device with low dielectric constant zone |
| 01/24/2007 | CN1296989C Method to relax alignment accuracy requirement in fabrication for integrated circuit |
| 01/24/2007 | CN1296988C Method and wafer for maintaining ultra clean bonding pads on a wafer |
| 01/24/2007 | CN1296987C Manufacture method of contact hole and manufacture method of semiconductor element |
| 01/24/2007 | CN1296986C Method of conforming rear end manufacturing process |
| 01/24/2007 | CN1296985C Substrate processing apparatus and method for adjusting a substrate connection position |
| 01/24/2007 | CN1296984C Substrate alignment method and apparatus |
| 01/24/2007 | CN1296983C Ceramic electrostatic chuck assembly and method of making |
| 01/24/2007 | CN1296982C Conduit for preventing electronic device oxidation when heated |
| 01/24/2007 | CN1296981C Method for producing semiconductor device |
| 01/24/2007 | CN1296980C Method of forming a bond pad with groove |
| 01/24/2007 | CN1296979C Adhesive tape for semiconductor device |
| 01/24/2007 | CN1296978C Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device |
| 01/24/2007 | CN1296977C Insulative film etching device |
| 01/24/2007 | CN1296976C Low temperature liquid-phase deposition method and cleaning method of liquid phase deposition equipment |
| 01/24/2007 | CN1296975C Processing apparatus for plasma |
| 01/24/2007 | CN1296974C Ozone treating method and ozone treating system |
| 01/24/2007 | CN1296973C Method for cleaning wave pattern structure of semiconductor wafer in manufacturing semiconductor device |