Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/18/2007US20070013048 Electronic parts packaging structure and method of manufacturing the same
01/18/2007US20070013044 Packaged integrated circuits and methods of producing thereof
01/18/2007US20070013040 Packaging of a microchip device
01/18/2007US20070013036 MEMS package using flexible substrates, and method thereof
01/18/2007US20070013024 High-voltage transistor having shielding gate
01/18/2007US20070013023 Isolation structure configurations for modifying stresses in semiconductor devices
01/18/2007US20070013022 Semiconductor device and method for producing the same
01/18/2007US20070013019 Method of eliminating curl for devices on thin flexible substrates, and devices made thereby
01/18/2007US20070013017 Electro-optical circuitry having integrated connector and methods for the production thereof
01/18/2007US20070013014 High temperature resistant solid state pressure sensor
01/18/2007US20070013012 Etch-stop layer structure
01/18/2007US20070013011 Semiconductor device having guard ring and manufacturing method thereof
01/18/2007US20070013009 Semiconductor device including I/O oxide and nitrided core oxide on substrate, and method of manufacture
01/18/2007US20070013008 Power LDMOS transistor
01/18/2007US20070013006 Apparatus and method of manufacture for integrated circuit and CMOS device including epitaxially grown dielectric on silicon carbide
01/18/2007US20070012999 Method for Making a Semiconductor Device Including Regions of Band-Engineered Semiconductor Superlattice to Reduce Device-On Resistance
01/18/2007US20070012992 Method for manufacturing and operating a non-volatile memory
01/18/2007US20070012991 Semiconductor memory device including multi-layer gate structure
01/18/2007US20070012987 Memory cell with selective deposition of refractory metals
01/18/2007US20070012986 Phase-change memory device including nanowires and method of manufacturing the same
01/18/2007US20070012984 Semiconductor device incorporating an electrical contact to an internal conductive layer and method for making the same
01/18/2007US20070012981 Semiconductor memory device including multi-layer gate structure
01/18/2007US20070012980 Large-area nanoenabled macroelectronic substrates and uses therefor
01/18/2007US20070012978 Junction-isolated depletion mode ferroelectric memory devices and systems
01/18/2007US20070012977 Semiconductor device and method for forming the same
01/18/2007US20070012976 Semiconductor device and manufacturing method of the same
01/18/2007US20070012966 Image Sensors and Methods of Fabricating Same
01/18/2007US20070012965 Photodetection system and module
01/18/2007US20070012963 CMOS image sensor and manufacturing method thereof
01/18/2007US20070012962 Method for making image sensor with reduced etching damage
01/18/2007US20070012958 Distributed high voltage jfet
01/18/2007US20070012952 Segmented magnetic shielding elements
01/18/2007US20070012950 Production of electronic devices
01/18/2007US20070012949 Bipolar transistor and power amplifier
01/18/2007US20070012948 Combined APD / PIN InGaAs photodetector with microlens structure and method of manufacture
01/18/2007US20070012945 Semiconductor device and method for manufacturing semiconductor device
01/18/2007US20070012943 Group III nitride semiconductor substrate and manufacturing method thereof
01/18/2007US20070012941 Light emitting diode comprising semiconductor nanocrystal complexes
01/18/2007US20070012939 Flip chip light emitting diode and method of manufacturing the same
01/18/2007US20070012937 High-brightness light emitting diode having reflective layer
01/18/2007US20070012923 Electronic circuit
01/18/2007US20070012922 Field effect transistor and display using same
01/18/2007US20070012921 Semiconductor device including semiconductor circuit made from semiconductor element and manufacturing method thereof
01/18/2007US20070012907 Doped Semiconductor Nanocrystal Layers And Preparation Thereof
01/18/2007US20070012876 Surface-normal optical path length for infrared photodetection
01/18/2007US20070012866 Fabrication of low leakage-current backside illuminated photodiodes
01/18/2007US20070012664 Enhancing the width of polycrystalline grains with mask
01/18/2007US20070012662 Solution for wet treatment of hafnium containing materials, use of the solution and a wet treatment process
01/18/2007US20070012661 Silicon nitride passivation layers having oxidized interface
01/18/2007US20070012660 Cluster tool with integrated metrology chamber for transparent substrates
01/18/2007US20070012659 High aspect ratio etch using modulation of RF powers of various frequencies
01/18/2007US20070012657 Plasma spraying liquid crystalline polymer on surface of component by feeding liquid crystalline polymer powder into plasma flame to form molten or heat-softened particles, where liquid crystalline polymer particles form plasma sprayed coating on outermost surface of component; minimizes contamination
01/18/2007US20070012655 Micro-package, multi-stack micro-package, and manufacturing method therefor
01/18/2007US20070012402 Apparatus and method for downstream pressure control and sub-atmospheric reactive gas abatement
01/18/2007US20070012401 Plasma processing apparatus
01/18/2007US20070012341 Supercritical fluid delivery system for semiconductor wafer processing
01/18/2007US20070012251 Seal arrangement with corrosion barrier and method
01/18/2007US20070012245 Semiconductor manufacturing apparatus and coolant circulating method using the same
01/18/2007US20070012241 Methods of assessing the temperature of semiconductor wafer substrates within deposition apparatuses
01/18/2007US20070012110 Microfactory comb capacitive accelerometer
01/18/2007US20070012085 Method and apparatus for detecting abnormal characteristic values capable of suppressing detection of normal characteristic values
01/18/2007US20070011952 Polishing efficiency, uniformity, removal rate; containing clay and small cerium dioxide abrasive particles; glass and/or semiconductor wafers
01/18/2007US20070011905 Methods and systems for processing a substrate using a dynamic liquid meniscus
01/18/2007DE19536019B4 Verfahren zur Herstellung von feinen diskreten Metallstrukturen und seine Verwendung A process for the production of fine discrete metal structures and its use
01/18/2007DE112005000441T5 Halbleiterbauteil und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
01/18/2007DE112005000420T5 Halbleiter-Prüfverfahren und System für dieses Semiconductor Test method and system for this
01/18/2007DE112004002782T5 Verfahren zum Herstellen eines Photomasken-Rohlings A method for manufacturing a photomask blank
01/18/2007DE112004001975T5 Verfahren und Anordnung zur Verbindung von Teststrukturen oder Leitungsarrays zur Überwachung der Herstellung integrierter Schaltungen Method and arrangement for connection of test structures or line arrays for monitoring the manufacture of integrated circuits
01/18/2007DE10343578B4 Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen und Verfahren zu seiner Herstellung Rewiring substrate strip with a plurality of semiconductor device positions and process for its preparation
01/18/2007DE102006029499A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
01/18/2007DE102006028999A1 Flachtafeldisplay und Verfahren zu dessen Herstellung A flat panel display and method for its production
01/18/2007DE102006027841A1 Herstellung von III-Nitrid-Halbleiter-Bauteilen Preparation of III-nitride semiconductor components
01/18/2007DE102006025843A1 Stapel-Annealing-System Batch annealing system
01/18/2007DE102005047056B3 Power semiconductor element and production process has field electrode structure with at least two first field electrodes and a second field electrode in a second direction with dielectric separation between them
01/18/2007DE102005040875A1 Charge-Trapping-Speicher und Verfahren zu dessen Herstellung Charge trapping memory and method for its production
01/18/2007DE102005036548A1 Verfahren zur Herstellung eines Kontaktes in einem Flash-Speicher Process for the preparation of a contact in a flash memory
01/18/2007DE102005032807A1 Kombinierte Ätz- und Dotiermedien für Siliziumdioxidschichten und darunter liegendes Silizium Combined etching and doping of silicon dioxide layers and underlying silicon
01/18/2007DE102005032547A1 Wafer-Klemmanordnung zur Aufnahme eines Wafers während eines Abscheidungsverfahrens Wafer clamp assembly for holding a wafer during a deposition method
01/18/2007DE102005032142A1 Verfahren zum Kontaktieren von Halbleiterbauteilen mit einem Testkontakt A method for bonding semiconductor components with a test contact
01/18/2007DE102005032074A1 Semiconductor element and production process especially for an insulated gate bipolar transistor has very highly doped region between low and highly oppositely doped regions
01/18/2007DE102005024952A1 Semiconductor memory component manufacturing method, involves selectively etching dielectric layer to conductive layer for forming trenches that are partially dissected in surface of conducting path and ends in conductive layer
01/18/2007DE102005023119A1 Maskenprogrammierbares Logikmakro Mask Programmable logic macro
01/18/2007DE10103186B4 Verfahren zur Herstellung eines elektronischen Bauteils mit einem Halbleiter-Chip A method of manufacturing an electronic component comprising a semiconductor chip
01/18/2007CA2614373A1 Hard mask structure for patterning of materials
01/17/2007EP1744609A2 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
01/17/2007EP1744606A2 Printed circuit board and method for producing the printed circuit board
01/17/2007EP1744453A1 Surface acoustic wave device
01/17/2007EP1744365A2 Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
01/17/2007EP1744362A2 Semiconductor device and electronic apparatus
01/17/2007EP1744359A1 Interconnect structure having cavities in its dielectric portion
01/17/2007EP1744358A1 Semiconductor device and manufacturing method
01/17/2007EP1744357A2 Method for manufacturing SIMOX wafer and SIMOX wafer
01/17/2007EP1744356A1 Magnetically-levitated rotor system for an RTP chamber
01/17/2007EP1744355A2 Wafer carrier for semiconductor wafers or similar objects
01/17/2007EP1744354A2 Capacitive device, organic dielectric laminates, multilayer structures incorporating such devices, and methods of making thereof
01/17/2007EP1744353A1 Chip carrier substrate made if silicon with through-contacts and method for its manufacture
01/17/2007EP1744352A2 Method for forming a fully germano-silicided gate mosfet and devices obtained thereof
01/17/2007EP1744351A2 Method for forming a fully silicided gate MOSFET and devices obtained thereof
01/17/2007EP1744350A2 A method of making a polycrystalline thin film, a mask pattern used in the same and a method of making a flat panel display device using the same
01/17/2007EP1744349A2 Laser irradiation apparatus, laser irradiation method, beam homogenizer, semiconductor device, and method of manufacturing the semiconductor device