Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/16/2007US7163830 Method for temporarily engaging electronic component for test
01/16/2007US7163829 Method of integration testing for packaged electronic components
01/16/2007US7163828 Electrode, method of manufacturing the same, ferroelectric memory, and semiconductor device
01/16/2007US7163826 Method of fabricating multi layer devices on buried oxide layer substrates
01/16/2007US7163780 Disposing on a substrate surface a B-staged dielectric matrix comprising dielectric matrix materials and a removable porogen; curing; patterning the dielectric matrix material; depositing a metal layer; removing porogen
01/16/2007US7163778 Anti-reflection film material and a substrate having an anti-reflection film and a method for forming a pattern
01/16/2007US7163776 Positive-working resist composition
01/16/2007US7163755 Magneto-resistive element
01/16/2007US7163751 Coating compositions for use with an overcoated photoresist
01/16/2007US7163721 Method to plasma deposit on organic polymer dielectric film
01/16/2007US7163719 Method of depositing thin film using hafnium compound
01/16/2007US7163644 For planarizing the surface of a substrate, storage stability
01/16/2007US7163641 Method of forming high aspect ratio apertures
01/16/2007US7163638 Forming an insulating film on a substrate material, forming a contact hole in the insulating film, and coating a region where a transparent conductive film is to be formed with a liquid containing a precursor of the transparent conductive film liquid coats any unnecessary insulating film formed, annealin
01/16/2007US7163614 Methods of and apparatus for making high aspect ratio microelectromechanical structures
01/16/2007US7163613 Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses
01/16/2007US7163603 Plasma source assembly and method of manufacture
01/16/2007US7163602 Apparatus for generating planar plasma using concentric coils and ferromagnetic cores
01/16/2007US7163597 Ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping
01/16/2007US7163588 Processing a workpiece using water, a base, and ozone
01/16/2007US7163587 Reactor assembly and processing method
01/16/2007US7163585 Method and apparatus for an improved optical window deposition shield in a plasma processing system
01/16/2007US7163450 Abrasive pad
01/16/2007US7163448 Chemical/mechanical polishing method for STI
01/16/2007US7163393 Heat treatment jig for semiconductor silicon substrate
01/16/2007US7163301 Method and apparatus for managing actinic intensity transients in a lithography mirror
01/16/2007US7163197 Liquid substance supply device for vaporizing system, vaporizer, and vaporization performance appraisal method
01/16/2007US7163110 Adjustable cassette for accommodating substrates and method for adjusting same
01/16/2007US7163104 Tray for semiconductor device and semiconductor device
01/16/2007US7163053 Heat exchanger
01/16/2007US7163033 Substrate bonding apparatus for liquid crystal display device panel
01/16/2007US7163019 Method of reducing water spotting and oxide growth on a semiconductor structure
01/16/2007US7163018 Single wafer cleaning method to reduce particle defects on a wafer surface
01/16/2007US7163017 Polysilicon etch useful during the manufacture of a semiconductor device
01/16/2007US7162906 Method and apparatus for removing a carrier part from a carrier
01/16/2007US7162881 Thermophoretic wand to protect front and back surfaces of an object
01/16/2007US7162796 Method of making an interposer with contact structures
01/16/2007US7162794 Manufacturing method for multilayer ceramic elements
01/16/2007US7162765 Seal system for irrigated scrubber mandrel assembly
01/16/2007CA2274071C Affinity based self-assembly systems and devices for photonic and electronic applications
01/11/2007WO2007005925A1 Clamp for use in processing semiconductor workpieces
01/11/2007WO2007005870A1 Power interconnect structure for balanced bitline capacitance in a memory array
01/11/2007WO2007005823A2 Semiconductor wafer cutting blade and method
01/11/2007WO2007005817A1 Transistor with improved tip profile and method of manufacture thereof
01/11/2007WO2007005731A2 Machining nanometer-sized tips from multi-walled nanotubes
01/11/2007WO2007005724A2 Fpga circuits and methods considering process variations
01/11/2007WO2007005697A2 Block contact architectures for nanoscale channel transistors
01/11/2007WO2007005695A1 Integrated circuit die containing metal- and particle-filled through-silicon vias
01/11/2007WO2007005639A2 Lead frame isolation using laser technology
01/11/2007WO2007005636A2 Semiconductor failure analysis tool
01/11/2007WO2007005617A2 Electrically conducting polymer glue, devices made therewith and methods of manufacture
01/11/2007WO2007005489A2 Method and system for determining optical properties of semiconductor wafers
01/11/2007WO2007005312A1 Material systems for dielectrics and metal electrodes and methods for formation thereof
01/11/2007WO2007005263A2 Semiconductor die package and method for making the same
01/11/2007WO2007005228A2 Hermetic seals for micro-electromechanical system devices
01/11/2007WO2007005204A2 System and method for critical dimension reduction and pitch reduction
01/11/2007WO2007005196A2 Scalable uniform thermal plate
01/11/2007WO2007005191A1 Source side injection storage device with spacer gates and method therefor
01/11/2007WO2007005136A1 Technique for forming contact insulation layers silicide regions with different characteristics
01/11/2007WO2007005088A2 Vaporizable metalorganic compounds for deposition of metals and metal-containing thin films
01/11/2007WO2007004995A1 Radiation crosslinker
01/11/2007WO2007004986A1 An integrated circuit package and a method for manufacturing an integrated circuit package
01/11/2007WO2007004890A1 Reduction of attraction forces between silicon wafers
01/11/2007WO2007004808A1 Apparatus for trapping residual product of semiconductor manufacturing process
01/11/2007WO2007004782A1 Pad conditioner and error detecting apparatus for the same
01/11/2007WO2007004768A1 Method of controlling active layer of iii-nitride semiconductor light emitting device
01/11/2007WO2007004666A1 Thin film transistor, wiring board and method for manufacturing such thin film transistor and wiring board
01/11/2007WO2007004660A1 Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package
01/11/2007WO2007004658A1 Printed wiring board
01/11/2007WO2007004657A1 Printed wiring board
01/11/2007WO2007004612A1 Method of producing substrate under controlling organic matter concentration in stripping liquor
01/11/2007WO2007004609A1 Method of forming spherical body, method of joining fine lines and laser processing device
01/11/2007WO2007004607A1 Method for cutting workpiece
01/11/2007WO2007004576A1 Plasma treatment apparatus and plasma treatment method
01/11/2007WO2007004567A1 Exposure apparatus, exposure method, device manufacturing method, and system
01/11/2007WO2007004566A1 Compound, positive resist composition and method for forming resist pattern
01/11/2007WO2007004552A1 Exposure apparatus and method, exposure apparatus maintenance method, and device manufacturing method
01/11/2007WO2007004551A1 Container transporting apparatus and container transporting system
01/11/2007WO2007004550A1 Method and apparatus for manufacturing semiconductor wafer
01/11/2007WO2007004535A1 Semiconductor device and method for manufacturing same
01/11/2007WO2007004528A1 Method for designing structure of silicon carbide electrostatic induction transistor
01/11/2007WO2007004485A1 Washing device and washing method
01/11/2007WO2007004444A1 Semiconductor memory
01/11/2007WO2007004443A1 Method for forming tungsten film, film-forming apparatus, storage medium and semiconductor device
01/11/2007WO2007004431A1 Method of forming high-resolution pattern and apparatus therefor
01/11/2007WO2007004418A1 Semiconductor integrated circuit device
01/11/2007WO2007004413A1 Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same
01/11/2007WO2007004381A1 METHOD FOR MANUFACTURING SiOCH FILM, PLASMA CVD APPARATUS AND SiOCH FILM
01/11/2007WO2007004358A1 Exposure apparatus
01/11/2007WO2007004295A1 Semiconductor device and method for manufacturing same
01/11/2007WO2007004289A1 Testing circuit, wafer, measuring apparatus, device manufacturing method and display device
01/11/2007WO2007004281A1 Paste composition and solar cell element using same
01/11/2007WO2007004272A1 Method for predicting distribution of impurity concentration and program for determining impurity concentration
01/11/2007WO2007004258A1 Semiconductor device and fabrication method thereof
01/11/2007WO2007004256A1 Semiconductor device and method for manufacturing same
01/11/2007WO2007004096A2 Methods of fabricating crystalline silicon film and thin film transistors
01/11/2007WO2007003639A2 Substrate, in particular made of silicon carbide, coated with a thin stoichiometric film of silicon nitride, for making electronic components, and method for obtaining such a film
01/11/2007WO2007003638A1 Highly oxygen-sensitive silicon layer and method for obtaining same
01/11/2007WO2007003489A1 Method for producing a structured parylene coating, and corresponding structured parylene coating
01/11/2007WO2007003479A1 Method and apparatus for evacuating an enclosure