Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/30/2007US7169679 Varactor with improved tuning range
01/30/2007US7169678 Method of forming a semiconductor device using a silicide etching mask
01/30/2007US7169677 Method for producing a spacer structure
01/30/2007US7169676 Semiconductor devices and methods for forming the same including contacting gate to source
01/30/2007US7169675 Material architecture for the fabrication of low temperature transistor
01/30/2007US7169674 Complementary metal oxide semiconductor (CMOS) gate stack with high dielectric constant gate dielectric and integrated diffusion barrier
01/30/2007US7169673 Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics
01/30/2007US7169672 Split gate type nonvolatile memory device and manufacturing method thereof
01/30/2007US7169671 Method of recording information in nonvolatile semiconductor memory
01/30/2007US7169670 Method of forming gate oxide layer in semiconductor device
01/30/2007US7169669 Method of making thin silicon sheets for solar cells
01/30/2007US7169668 Method of manufacturing a split-gate flash memory device
01/30/2007US7169667 Nonvolatile memory cell with multiple floating gates formed after the select gate
01/30/2007US7169666 Method of forming a device having a gate with a selected electron affinity
01/30/2007US7169665 Capacitance process by using passivation film scheme
01/30/2007US7169664 Method of reducing wafer contamination by removing under-metal layers at the wafer edge
01/30/2007US7169663 Semiconductor device with rare metal electrode
01/30/2007US7169662 Methods for making semiconductor structures having high-speed areas and high-density areas
01/30/2007US7169661 Process of fabricating high resistance CMOS resistor
01/30/2007US7169660 Lithography-independent fabrication of small openings for forming vertical mos transistor
01/30/2007US7169659 Method to selectively recess ETCH regions on a wafer surface using capoly as a mask
01/30/2007US7169658 Method for formation of an ultra-thin film and semiconductor device containing such a film
01/30/2007US7169657 Process for laser processing and apparatus for use in the same
01/30/2007US7169656 Method of manufacturing a semiconductor device
01/30/2007US7169655 Field effect transistors and methods for manufacturing field effect transistors
01/30/2007US7169654 Method of forming a semiconductor device
01/30/2007US7169653 Fabrication method for liquid crystal display
01/30/2007US7169652 Method of manufacturing electro-optical device, electro-optical device, transferred chip, transfer origin substrate
01/30/2007US7169651 Process and lead frame for making leadless semiconductor packages
01/30/2007US7169649 Wafer scale integration of electroplated 3D structures using successive lithography, electroplated sacrificial layers, and flip-chip bonding
01/30/2007US7169648 Process for producing a semiconductor device
01/30/2007US7169647 Connection between a semiconductor chip and an external conductor structure and method for producing it
01/30/2007US7169646 Interconnect assemblies and methods
01/30/2007US7169645 Methods of fabrication of package assemblies for optically interactive electronic devices
01/30/2007US7169644 Method of making multifunction electrode
01/30/2007US7169643 Semiconductor device, method of fabricating the same, circuit board, and electronic apparatus
01/30/2007US7169642 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
01/30/2007US7169641 Semiconductor package with selective underfill and fabrication method therfor
01/30/2007US7169640 Card manufacturing technique and resulting card
01/30/2007US7169639 Semiconductor device manufacturing method
01/30/2007US7169638 Adjusting die placement on a semiconductor wafer to increase yield
01/30/2007US7169637 One mask Pt/PCMO/Pt stack etching process for RRAM applications
01/30/2007US7169635 Programmable structure, an array including the structure, and methods of forming the same
01/30/2007US7169634 Design and fabrication of rugged FRED
01/30/2007US7169633 Solid-state image sensor for improving sensing quality and manufacturing method thereof
01/30/2007US7169632 Radiation-emitting semiconductor component and method for producing the semiconductor component
01/30/2007US7169631 Silicon and silicon/germanium light-emitting device, methods and systems
01/30/2007US7169630 Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
01/30/2007US7169629 VCSEL and the fabrication method of the same
01/30/2007US7169628 Cold cathode field emission device and process for the production thereof, and cold cathode field emission display and process for the production thereof
01/30/2007US7169627 Method for inspecting a connecting surface of a flip chip
01/30/2007US7169625 Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoring
01/30/2007US7169624 Shared bit line cross-point memory array manufacturing method
01/30/2007US7169623 System and method for processing a wafer including stop-on-aluminum processing
01/30/2007US7169622 Magnetoresistive random access memory devices and methods for fabricating the same
01/30/2007US7169621 Ferroelectric memory device
01/30/2007US7169620 Method of reducing the surface roughness of spin coated polymer films
01/30/2007US7169619 Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process
01/30/2007US7169589 Highly-expressed and highly active recombinant silicatein enzyme, silicatein isolated from natural source after gene induction
01/30/2007US7169541 Compound, polymer, resist composition, and patterning process
01/30/2007US7169540 Method of treatment of porous dielectric films to reduce damage during cleaning
01/30/2007US7169515 A data processing system containing a machine readable data storage medium with instructions for laying out a photolithographic mask, coupled to a processor; integrated circuits; electromagnetic waveform computer program for assigning phase shifting regions
01/30/2007US7169477 Composition for preparing porous dielectric thin films
01/30/2007US7169474 Epoxy resin composition and semiconductor device
01/30/2007US7169469 Particle-removing wafer
01/30/2007US7169440 Method for removing photoresist and etch residues
01/30/2007US7169345 Method for integrated circuit packaging
01/30/2007US7169323 Fluoroalkylsulfonamide salt and acid; etching silicon oxide substrates
01/30/2007US7169322 Aqueous dispersion, process for its production and use
01/30/2007US7169283 Anodization device and anodization method
01/30/2007US7169269 Plating apparatus, plating cup and cathode ring
01/30/2007US7169256 Plasma processor with electrode responsive to multiple RF frequencies
01/30/2007US7169255 Plasma processing apparatus
01/30/2007US7169254 Plasma processing system and apparatus and a sample processing method
01/30/2007US7169253 Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing
01/30/2007US7169248 Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods
01/30/2007US7169235 Cleaning method and polishing apparatus employing such cleaning method
01/30/2007US7169234 Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
01/30/2007US7169233 Reactor chamber
01/30/2007US7169231 Gas distribution system with tuning gas
01/30/2007US7169226 Defect reduction by oxidation of silicon
01/30/2007US7169015 Apparatus for optical inspection of wafers during processing
01/30/2007US7168936 Light transparent substrate imprint tool with light blocking distal end
01/30/2007US7168911 Semiconductor handling robot with improved paddle-type end effector
01/30/2007US7168747 Device for gripping and holding an object in a contactless manner
01/30/2007US7168624 Semiconductor device and IC card
01/30/2007US7168607 Method and device for cleaning and then bonding substrates
01/30/2007US7168587 Wafer carrier door and spring biased latching mechanism
01/30/2007US7168564 Composite substrate carrier
01/30/2007US7168553 Dynamically balanced substrate carrier handler
01/30/2007US7168447 Fluid distribution unit for dividing a stream of fluid into a plurality of partial streams
01/30/2007US7168436 Gas for removing deposit and removal method using same
01/30/2007US7168352 Process for sawing substrate strip
01/30/2007US7168224 Method of making a packaged radiation sensitive resist film-coated workpiece
01/30/2007US7168162 Method of manufacturing a probe card
01/30/2007US7168161 Manufacturing method of solid-state image sensing device
01/30/2007US7168160 Method for mounting and heating a plurality of microelectronic components
01/30/2007CA2361050C High purity, siliconized silicon carbide having high thermal shock resistance
01/30/2007CA2219912C Photocatalytic semiconductor coating process
01/25/2007WO2007011881A2 Magnetic elements having improved switching characteristics