Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2007
01/31/2007CN1906749A Process system and device for transporting substrates
01/31/2007CN1906748A Vertical heat treatment apparatus and method for operating same
01/31/2007CN1906747A System and method for etching a mask
01/31/2007CN1906746A Wafer-level moat structures
01/31/2007CN1906745A Electronic device, semiconductor device using same, and method for manufacturing semiconductor device
01/31/2007CN1906744A Device having a compliant electrical interconnects and compliant sealing element
01/31/2007CN1906743A Method for forming a memory structure using a modified surface topography and structure thereof
01/31/2007CN1906742A Method of forming thin sgoi wafers with high relaxation and low stacking fault defect density
01/31/2007CN1906741A Semiconductor device and fabrication process thereof
01/31/2007CN1906740A Method of producing III-nitride substrate
01/31/2007CN1906739A Method for grinding GaN substrate
01/31/2007CN1906738A GaAs substrate cleaning method, GaAs substrate manufacturing method, epitaxial substrate manufacturing method and GaAs wafer
01/31/2007CN1906737A Wafer-processing tape
01/31/2007CN1906736A Film-forming method
01/31/2007CN1906735A Method for depositing silicon carbide and ceramic films
01/31/2007CN1906734A Semiconductor treating device
01/31/2007CN1906701A Stress assisted current driven switching for magnetic memory applications
01/31/2007CN1906650A Display device and its fabrication method
01/31/2007CN1906620A Method and apparatus for determining chemistry of part's residual contamination
01/31/2007CN1906539A Precision motion control using feed forward of acceleration
01/31/2007CN1906528A Liquid crystal display device and method for manufacturing the same
01/31/2007CN1906527A Display device and manufacturing method of the same
01/31/2007CN1906522A 激光处理装置 The laser processing device
01/31/2007CN1906496A Probe device capable of being used for plural kinds of testers
01/31/2007CN1906493A Electrically connecting apparatus and contactor
01/31/2007CN1906478A Advanced roughness metrology
01/31/2007CN1906469A Substrate temperature measuring apparatus and processor
01/31/2007CN1906332A Nano-array electrode manufacturing method and photoelectric converter using same
01/31/2007CN1906327A Film forming method
01/31/2007CN1906324A Ion implantation method and ion implantation device
01/31/2007CN1906265A Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
01/31/2007CN1906262A Chemical-mechanical polishing of metals in an oxidized form
01/31/2007CN1905991A Polishing pad
01/31/2007CN1905782A Surface treating method and film pattern forming method
01/31/2007CN1905243A Method for manufacturing a mask and an organic EL element and an organic EL printer
01/31/2007CN1905233A Thin film transistor substrate and method of making the same
01/31/2007CN1905232A Thin film transistor substrate and method for fabricating the same
01/31/2007CN1905231A Thin film transistor substrate and manufacturing method thereof
01/31/2007CN1905223A LED light source packaging structure for low-temp. coburning ceramic by thermoelectric separating design
01/31/2007CN1905214A Non-volatile memory device and associated method of manufacture
01/31/2007CN1905213A Nonvolatile semiconductor memory device, semiconductor device and manufacturing method of nonvolatile semiconductor memory device
01/31/2007CN1905212A Transistor and method for forming the same
01/31/2007CN1905211A Strained channel transistor and method of fabricating the same
01/31/2007CN1905210A Field effect transistor and method of manufacturing a field effect transistor
01/31/2007CN1905209A Semiconductor device and method for fabricating the same
01/31/2007CN1905208A Semiconductor wafer and method of manufacturing semiconductor device
01/31/2007CN1905204A 电光器件及其制作方法 Electro-optical device and manufacturing method thereof
01/31/2007CN1905203A 有机薄膜晶体管显示板 The organic thin film transistor display panel
01/31/2007CN1905201A Semiconductor imaging device and fabrication process thereof
01/31/2007CN1905200A Wiring base plate and making method, electro-optic device and method of manufacturing same, electronic device and making method
01/31/2007CN1905199A Array substrate having enhanced aperture ratio, method of manufacturing the same and display device
01/31/2007CN1905198A Array substrate, method of manufacturing the same and method of crystallizing silicon
01/31/2007CN1905197A Semiconductor memory, the fabrication thereof and a method for operating the semiconductor memory
01/31/2007CN1905196A EEPROM component and its making method
01/31/2007CN1905195A Flash memory device and method of manufacturing the same
01/31/2007CN1905194A Semiconductor device and manufacturing method of the same
01/31/2007CN1905193A Semiconductor device and method for manufacturing the same
01/31/2007CN1905187A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
01/31/2007CN1905186A Device isolation structure of a semiconductor device and method of forming the same
01/31/2007CN1905184A Doped single crystal silicon silicided efuse and its forming method
01/31/2007CN1905181A Semiconductor packages for surface mounting and method of producing same
01/31/2007CN1905178A Circuit assembly structure and method for making the same
01/31/2007CN1905177A Circuit assembly structure and method for making the same
01/31/2007CN1905176A Circuit assembly structure and method for making the same
01/31/2007CN1905175A Semiconductor device and manufacturing method of the same
01/31/2007CN1905169A Semiconductor device and its manufacturing method
01/31/2007CN1905168A Semiconductor device and its making method and used jointing material and its making method
01/31/2007CN1905166A Film transistor array substrate and mfg. method thereof
01/31/2007CN1905165A Manufacturing method of semiconductor device
01/31/2007CN1905164A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
01/31/2007CN1905163A Display array, multi-layer complementary wire structure and mfg. method
01/31/2007CN1905162A Method for mfg. non-volatile memory body
01/31/2007CN1905161A Memory cell arrangement with a folded bit line arrangement and relevant manufacturing method
01/31/2007CN1905160A Manufacturing method for an integrated semiconductor structure and corresponding integrated semiconductor structure
01/31/2007CN1905159A 阵列基板及其形成方法 Array substrate and method for forming
01/31/2007CN1905158A Method for reducing element efficiency mismatch and semiconductor circuit
01/31/2007CN1905157A Organic EL element and method of manufacturing organic EL element, and organic EL display device
01/31/2007CN1905156A Front technique for mfg. high voltage LCD driving device
01/31/2007CN1905155A Conductor forming method and internal connecting wire forming method
01/31/2007CN1905154A Technique for forming gapless shallow channel insulation area by subatmospheric CVD method
01/31/2007CN1905153A Method for reducing wafer harm caused by shallow slot insulation chemical mechanical polishing technique
01/31/2007CN1905152A Substrate lifting device and substrate processing device
01/31/2007CN1905151A Substrate carrier
01/31/2007CN1905150A Method for detecting IC on-line defect and making process monitor circuit structure
01/31/2007CN1905149A Damage evaluation method of compound semiconductor member
01/31/2007CN1905148A Bonding pad, method for fabricating a bonding pad and an electronic device, and its fabricating method
01/31/2007CN1905147A Semiconductor device fabrication method and semiconductor device fabrication device
01/31/2007CN1905146A Method for manufacturing semiconductor device
01/31/2007CN1905145A Method of making a stacked die package
01/31/2007CN1905144A Methods for packaging an image sensor and a packaged image sensor
01/31/2007CN1905143A CSP packaging technique
01/31/2007CN1905142A QFN chip packaging technique
01/31/2007CN1905141A Semiconductor device and method of manufacturing the same
01/31/2007CN1905140A Image sensor package, optical glass therefor and processing method
01/31/2007CN1905139A Method for forming a thin-film transistor
01/31/2007CN1905138A Semiconductor device and method of fabricating the same
01/31/2007CN1905137A Electronic device and method for manufacturing the electronic device
01/31/2007CN1905136A Method for manufacturing semiconductor device
01/31/2007CN1905135A Plasma etching apparatus
01/31/2007CN1905134A Controlling method for gate formation of semiconductor device